SK Hynix DDR5 MCRDIMM 128GB 8800MT/s

The SK Hynix DDR5 MCRDIMM 128GB operating at 8800MT/s represents a landmark advancement in server memory architecture, introducing the Multiplexer Combined RDIMM (MCRDIMM) form factor that integrates an on-module multiplexer buffer to dramatically reduce the electrical load presented to the memory controller. This design enables Intel Xeon 6 platforms to sustain ultra-high data rates that conventional RDIMMs cannot achieve, effectively bridging the gap between standard DRAM and HBM-class bandwidth requirements. The MCRDIMM topology decouples the CPU's memory interface from the DRAM devices, allowing more DRAM ranks to be addressed per channel without signal integrity degradation, resulting in both higher capacity and higher speed simultaneously.

At 8800MT/s, this module delivers memory bandwidth figures previously unavailable in standard DIMM form factors, making it particularly compelling for workloads that have historically been bottlenecked by memory throughput rather than compute throughput. The 128GB per-DIMM capacity is achieved through high-density DDR5 die stacking and advanced packaging techniques, enabling platforms to reach multi-terabyte total memory configurations while maintaining the bandwidth density that modern AI inference, in-memory analytics, and HPC workloads demand. The module adheres to JEDEC DDR5 standards while extending performance through the MCRDIMM specification ratified for next-generation Intel server platforms.

Launched in Q4 2025, this SK Hynix MCRDIMM is optimized for Intel Xeon 6 processors with HBM configurations, where memory subsystem balance is critical to overall system performance. The module features on-die ECC, advanced RAS (Reliability, Availability, and Serviceability) capabilities including post-package repair (PPR), and full compatibility with JEDEC SPD and temperature monitoring standards. Its thermal and power characteristics have been engineered to operate within standard 1U and 2U server thermal envelopes, supporting data center deployments without requiring specialized cooling infrastructure beyond what modern high-density server platforms already provide.

Ideal for

• Large-scale AI inference serving on Intel Xeon 6 HBM platforms where model weight bandwidth determines throughput per server node
• In-memory database acceleration for SAP HANA, Oracle TimesTen, and VoltDB deployments requiring multi-TB low-latency addressable memory pools
• High-performance computing (HPC) simulation workloads in computational fluid dynamics, structural analysis, and climate modeling where STREAM bandwidth is the primary performance limiter
• Genomics and bioinformatics pipelines processing large reference datasets entirely in DRAM to eliminate NVMe or storage latency from critical path operations
• Financial services risk analytics and real-time Monte Carlo simulations requiring simultaneous high-capacity and high-bandwidth memory access patterns
• Virtualization and cloud-native hypervisor hosts maximizing VM density on Intel Xeon 6 platforms while maintaining per-VM memory bandwidth guarantees through NUMA-aware allocation

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.