Brand: SK Hynix | Category: Memory (RAM)
SKU: SKHY-HMCG94AGBRA129N | Part #: HMCG94AGBRA129N | MPN: HMCG94AGBRA129N
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The SK Hynix HMCG94AGBRA129N represents the cutting edge of server memory density, combining 3DS (3D Stacking) technology with Load-Reduced DIMM (LRDIMM) architecture to achieve 256GB capacity on a single module. This ultra-high-capacity design addresses the critical memory bottleneck in large language model inference, real-time analytics, and simulation workloads where consolidating massive datasets into addressable memory significantly reduces latency and improves throughput compared to disk or network-based data access patterns.
3DS technology employs three-high die stacking within each DRAM package, enabling SK Hynix to pack substantially more capacity per module while maintaining electrical compliance and thermal characteristics. The LRDIMM design distributes address and command signals through a register and data buffer, allowing systems to support higher module populations per channel without degrading signal integrity—critical for scaling from 8-socket to 12-socket server configurations that require 2TB+ total memory.
Operating at DDR5-5600 (5600 MT/s), this module delivers 44.8 GB/s per-DIMM bandwidth, essential for memory-bound workloads in AI training support infrastructure, vector database operations, and financial modeling platforms. ECC protection ensures data integrity for mission-critical applications, while compliance with JEDEC DDR5 standards guarantees interoperability with validated server platforms including 4th and 5th generation AMD EPYC and Intel Xeon Scalable systems.
| Manufacturer | SK Hynix |
| Model | HMCG94AGBRA129N |
| Capacity | 256GB |
| DRAM Type | DDR5 |
| Speed | 5600 MT/s (DDR5-5600) |
| Form Factor | LRDIMM (Load-Reduced DIMM) |
| Die Configuration | 3DS (3D Stacking) |
| ECC | Yes, SECDED (Single Error Correction, Double Error Detection) |
| Voltage | 1.1V |
| Module Density | 256Gb (32Gb × 8 stacks per 3DS package) |
| Data Width | 64-bit + 8-bit ECC |
| Bandwidth | 44.8 GB/s per module |
| Registered | Yes, with buffer/register for address/command distribution |
| JEDEC Standard | DDR5 LRDIMM (3DS-capable) |
| Operating Temperature | 0°C to 95°C |
| Refresh Rate | 1x / 2x selectable (auto-detect) |
| RoHS Compliance | Yes |
| Production Launch | Q2 2024 |
| Server Compatibility | AMD EPYC 9004/9005 series; Intel Xeon Scalable (4th/5th Gen); validation with select platforms |
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| Brand | SK Hynix |
| Category | Memory (RAM) |
| SKU | SKHY-HMCG94AGBRA129N |
| Part Number | HMCG94AGBRA129N |
| Condition | New |
| Model | HMCG94AGBRA129N |
| Capacity | 256GB |
| DRAM Type | DDR5 |
| Speed | 5600 MT/s (DDR5-5600) |
| Form Factor | LRDIMM (Load-Reduced DIMM) |
| Die Configuration | 3DS (3D Stacking) |
| ECC | Yes, SECDED (Single Error Correction, Double Error Detection) |
| Voltage | 1.1V |
| Module Density | 256Gb (32Gb × 8 stacks per 3DS package) |
| Data Width | 64-bit + 8-bit ECC |
| Bandwidth | 44.8 GB/s per module |
| Registered | Yes, with buffer/register for address/command distribution |
| JEDEC Standard | DDR5 LRDIMM (3DS-capable) |
| Operating Temperature | 0°C to 95°C |
| Refresh Rate | 1x / 2x selectable (auto-detect) |
| RoHS Compliance | Yes |
| Production Launch | Q2 2024 |
| Server Compatibility | AMD EPYC 9004/9005 series; Intel Xeon Scalable (4th/5th Gen); validation with select OEM platforms |