Samsung DDR5 96GB RDIMM ECC Server Memory Module M321RYA0PB2-CCP

Samsung DDR5 96GB RDIMM ECC Server Memory Module M321RYA0PB2-CCP

Brand: Samsung | Category: Memory (RAM)

SKU: M321RYA0PB2-CCP | Part #: M321RYA0PB2-CCP | MPN: M321RYA0PB2-CCP

Contact for Pricing — Request a Quote

Request a Quote Contact Us

About the Samsung DDR5 96GB RDIMM ECC Server Memory Module M321RYA0PB2-CCP

Product Overview

The Samsung DDR5 96GB RDIMM Module (M321RYA0PB2-CCP) represents Samsung's latest generation of enterprise-grade server memory, purpose-built for the demands of modern data centres, cloud infrastructure, and high-performance computing environments. As organisations across the GCC and globally accelerate their digital transformation initiatives — spanning AI/ML workloads, real-time analytics, and dense virtualisation — the need for higher-capacity, lower-latency, and more power-efficient memory has never been more critical. Samsung's DDR5 RDIMM platform answers this need with a substantial leap in bandwidth, capacity density, and signal integrity over its DDR4 predecessors.

Part number M321RYA0PB2-CCP is a 96GB Registered Dual In-Line Memory Module (RDIMM) operating on the DDR5 standard. It features on-die ECC (Error-Correcting Code) as well as traditional DRAM ECC, providing two layers of data integrity protection that are essential in mission-critical server deployments. The registered (buffered) architecture of this RDIMM ensures electrical stability and scalability across high-DIMM-count configurations, making it a top choice for OEM platforms from Dell, HPE, Lenovo, Supermicro, and other tier-1 server manufacturers.

For enterprise IT procurement teams, data centre architects, and cloud service providers in the UAE and broader GCC region, the Samsung M321RYA0PB2-CCP delivers a future-proof memory investment that aligns with the transition to Intel Xeon Scalable (Sapphire Rapids / Emerald Rapids) and AMD EPYC (Genoa / Bergamo) server processor families — all of which natively support DDR5 memory.

Key Features & Benefits

  • 96GB High-Capacity Per DIMM: Delivers industry-leading per-module capacity, enabling server configurations of up to 6TB+ of RAM per dual-socket server node when fully populated — critical for in-memory databases, SAP HANA, and large language model (LLM) inference tasks.
  • DDR5 Double Channel Architecture: DDR5's internal dual sub-channel design provides up to 2x the effective burst bandwidth compared to DDR4, with each 64-bit channel operating independently to maximise memory controller efficiency and reduce latency on bandwidth-intensive workloads.
  • Registered (Buffered) Design for Scalability: The RDIMM register chip isolates the memory controller from DRAM signal loads, allowing high-rank, high-density DIMM configurations without sacrificing signal integrity — essential in 8+ DIMM-per-channel server platforms.
  • On-Die ECC + DRAM ECC Dual Protection: DDR5 introduces mandatory on-die ECC that corrects single-bit errors within each DRAM die before data reaches the memory bus, while the traditional SECDED (Single Error Correct, Double Error Detect) DRAM ECC adds a second layer of protection at the system level — ensuring data integrity for financial transactions, healthcare records, and mission-critical databases.
  • Power Efficiency with 1.1V Operation: Operating at a lower 1.1V supply voltage compared to DDR4's 1.2V, this module reduces per-module power consumption by approximately 20%, directly translating to lower PUE (Power Usage Effectiveness) ratios and reduced TCO in large-scale deployments.
  • Samsung DRAM Manufacturing Excellence: Fabricated on Samsung's advanced EUV (Extreme Ultraviolet) lithography process node, the DRAM dies within M321RYA0PB2-CCP deliver improved cell-to-cell consistency, tighter timing tolerances, and longer operational MTBF — consistently exceeding 43,800 hours under standard server operating conditions.
  • Wide Thermal Operating Range: Designed to operate reliably from 0°C to 85°C (case temperature), this module supports both air-cooled and rear-door heat exchanger (RDHx) data centre cooling architectures prevalent in GCC facilities where ambient temperatures may be elevated.
  • JEDEC DDR5 Standard Compliance: Fully compliant with JEDEC JESD79-5 DDR5 specifications, ensuring interoperability with all DDR5-certified server platforms and eliminating compatibility risks in heterogeneous enterprise environments.

Technical Architecture

The Samsung M321RYA0PB2-CCP is built around Samsung's proprietary DDR5 SDRAM die stack, manufactured using EUV photolithography for superior density and yield. The module organises its 96GB of capacity using high-density x4 or x8 DRAM organisation across multiple ranks, allowing the memory controller to access a broader data width simultaneously.

The RDIMM register component — a Register Clock Driver (RCD) compliant with JEDEC RCD14 specification — manages command and address signal re-driving from the host memory controller to each DRAM rank. This buffering reduces the electrical load on the CPU's memory interface, allowing stable operation at rated DDR5 speeds even with multiple DIMMs installed per channel. The RCD also incorporates the SPD (Serial Presence Detect) hub via the DDR5-standard SPD5 interface, enabling the host BIOS to auto-configure memory timings, voltage, and topology settings on server power-up.

DDR5 introduces a redesigned power management architecture: each DIMM now contains an on-module PMIC (Power Management Integrated Circuit) that regulates the memory supply voltages locally, reducing motherboard power plane complexity and enabling more precise per-module voltage control. This is a key DDR5 architectural advancement that improves both efficiency and stability in dense, multi-DIMM server configurations.

Performance & Capacity

The Samsung DDR5 96GB RDIMM M321RYA0PB2-CCP operates at a base speed of 4800 MT/s (JEDEC default), with OEM platform support for speeds up to 5600 MT/s depending on server BIOS and memory topology. At 4800 MT/s with a 64-bit data bus width per sub-channel (two sub-channels per DIMM), the theoretical peak bandwidth per module reaches approximately 38.4 GB/s — nearly double the 25.6 GB/s peak of comparable DDR4-3200 RDIMMs.

Memory access latency, while measured in nanoseconds, is tightly controlled by the DDR5 architecture. At 4800 MT/s with CL40 timings (typical JEDEC DDR5-4800B profile), the absolute latency is approximately 16.67 ns per cycle — comparable to DDR4 at equivalent speeds, and further masked by the much higher bandwidth available for prefetching and burst transfers in real workloads.

With 96GB per DIMM, a dual-socket server with 16 DIMM slots (8 per CPU) can achieve 1,536 GB (1.5TB) of total system memory, while a 32-DIMM slot platform reaches 3,072 GB (3TB) — enabling in-memory computing scenarios that were previously impractical with DDR4 density constraints. This capacity headroom is transformative for SAP HANA, Oracle TimesTen, Redis large caches, and Hadoop/Spark in-memory analytics clusters.

Compatibility & Integration

The Samsung M321RYA0PB2-CCP is designed for compatibility with enterprise server platforms based on:

  • Intel Xeon Scalable 4th Gen (Sapphire Rapids) and 5th Gen (Emerald Rapids) processors — platforms from Dell PowerEdge (R760, R860, R960), HPE ProLiant (DL380 Gen11, DL560 Gen11), Lenovo ThinkSystem (SR650 V3, SR850 V3), and Supermicro (X13 series)
  • AMD EPYC 4th Gen (Genoa / Genoa-X) and 5th Gen (Turin) processors — platforms including HPE ProLiant DL385 Gen11, Dell PowerEdge R7625, Lenovo ThinkSystem SR665 V3
  • JEDEC DDR5 RDIMM standard — ensuring forward compatibility with next-generation server platforms adopting DDR5
  • Operating System Support: Compatible with all enterprise-grade operating systems including Windows Server 2019/2022, Red Hat Enterprise Linux (RHEL) 8/9, SUSE Linux Enterprise Server (SLES), VMware vSphere 7.x/8.x, and Ubuntu Server LTS
  • Certifications: RoHS compliant, CE marked, and manufactured in compliance with Samsung's ISO 9001 and ISO 14001 quality and environmental management standards

Ideal Use Cases

The Samsung 96GB DDR5 RDIMM is the memory module of choice across a diverse range of enterprise and hyperscale computing scenarios:

  • AI & Machine Learning Inference: Large language models (LLMs), neural network inference engines, and AI recommendation systems require terabytes of addressable memory to load model weights and serve concurrent inference requests. The M321RYA0PB2-CCP enables GPU-accelerated servers to maintain massive model states in system DRAM for rapid model swapping and pre-loading.
  • In-Memory Databases & Real-Time Analytics: SAP HANA, VoltDB, MemSQL (SingleStore), and Oracle In-Memory Database workloads require entire datasets to reside in DRAM for sub-millisecond query response. High-density DDR5 RDIMMs allow these databases to scale beyond previous DDR4 capacity limits without adding server nodes.
  • Dense Server Virtualisation (VDI & Cloud): Hypervisors (VMware vSphere, Microsoft Hyper-V, KVM) running hundreds of concurrent VMs demand large RAM pools. With 96GB modules, operators can maximise VM density per host, reducing infrastructure footprint and per-VM licensing costs.
  • High-Performance Computing (HPC) & Scientific Simulation: Computational fluid dynamics (CFD), genomics sequencing, climate modelling, and finite element analysis (FEA) workloads are inherently memory-bandwidth-bound. DDR5's near-doubled bandwidth directly accelerates these simulations, reducing time-to-results.
  • Big Data & Distributed Analytics (Spark/Hadoop): Apache Spark in-memory processing and Hadoop ecosystem tools benefit enormously from large per-node memory allocations, reducing disk spill, shuffle overhead, and job completion times in petabyte-scale data lake environments.
  • Financial Services & Real-Time Trading Platforms: Low-latency trading engines, risk calculation systems, and fraud detection platforms require deterministic, high-speed memory access with zero tolerance for data errors — precisely the profile that DDR5 with dual-layer ECC delivers.
  • Cloud-Native & Containerised Workloads: Kubernetes clusters running microservices, stateful applications, and container-based ML pipelines benefit from the increased memory bandwidth and capacity of DDR5, enabling higher pod density and better workload isolation per physical node.

Why Source from Omnixon in Dubai

Omnixon Global is a trusted B2B IT hardware distributor headquartered in Dubai, UAE, serving enterprise clients across the GCC, Middle East, Africa, and global markets. When sourcing Samsung DDR5 memory modules such as the M321RYA0PB2-CCP, enterprise procurement teams benefit from working with a specialised distributor that understands the unique requirements of regional data centre deployments.

Omnixon maintains dedicated inventory of enterprise server memory from leading manufacturers including Samsung, Micron, SK Hynix, and Kingston — ensuring that high-demand DDR5 RDIMM modules are available for volume purchases without extended lead times that often affect direct OEM procurement channels. Our team of certified hardware specialists can assist with compatibility validation against your specific server BOM (Bill of Materials), multi-unit volume quotes, and configuration planning for memory upgrades across entire server fleets.

Operating from Dubai, Omnixon is strategically positioned to serve enterprise clients in Saudi Arabia, the UAE, Qatar, Kuwait, Bahrain, Oman, Egypt, and beyond — with deep expertise in navigating regional import requirements, customs documentation, and enterprise IT procurement frameworks including government and semi-government tenders across the GCC.

Related Products & Ecosystem

Complement your Samsung DDR5 RDIMM deployment with these related products available from Omnixon Global:

  • Samsung DDR5 64GB RDIMM — Lower-capacity DDR5 RDIMM for cost-optimised server memory configurations
  • Samsung DDR5 128GB RDIMM (3DS) — Ultra-high-density 3D-stacked DDR5 for maximum per-slot capacity in HPC and in-memory database servers
  • Micron DDR5 96GB RDIMM — Alternative DDR5 RDIMM sourcing option for mixed-brand memory strategies
  • Intel Xeon Scalable 5th Gen (Emerald Rapids) CPUs — Next-generation server processors with native DDR5 memory controller support
  • Dell PowerEdge R760 / HPE ProLiant DL380 Gen11 Servers — Tier-1 rack servers pre-validated for Samsung DDR5 RDIMM compatibility
  • Samsung PM9A3 / PM983 Enterprise NVMe SSDs — High-performance NVMe storage to pair with DDR5 memory upgrades in latency-sensitive server environments
  • Enterprise Server Rack & PDU Solutions — Matching power distribution and rack infrastructure for high-density DDR5-equipped server deployments

Technical Specifications

BrandSamsung
CategoryMemory (RAM)
SKUM321RYA0PB2-CCP
Part NumberM321RYA0PB2-CCP
ConditionNew
Module TypeRDIMM (Registered ECC)
Memory GenerationDDR5
Capacity96 GB
Memory Speed4800 MT/s (JEDEC) / Up to 5600 MT/s (OEM XMP/EXPO)
Theoretical Peak Bandwidth~38.4 GB/s per module at 4800 MT/s
CAS Latency (CL)CL40 (DDR5-4800B JEDEC profile)
tRCD40 cycles
tRP40 cycles
Absolute Latency~16.67 ns at 4800 MT/s
DRAM TechnologySamsung DDR5 SDRAM (EUV Lithography)
Module Organisation2Rx4 (Dual Rank, x4 DRAM width)
Sub-Channel ArchitectureDual 32-bit sub-channels per DIMM (DDR5 native)
Register TypeRCD (Register Clock Driver) — JEDEC RCD14 compliant
SPD InterfaceSPD5 Hub (DDR5 standard)
Power ManagementOn-module PMIC (Power Management IC)
Error CorrectionOn-Die ECC + SECDED DRAM ECC (Dual-layer)
Form Factor288-pin DIMM (RDIMM)
Module HeightStandard height (31.25 mm)
PCB LayersMulti-layer enterprise-grade PCB
Operating Voltage1.1V (VDD / VDDQ)
Typical Power Consumption~8–12W (active, workload dependent)
Idle Power Consumption~3–5W (self-refresh mode)
Supported CPU PlatformsIntel Xeon Scalable 4th Gen (Sapphire Rapids), 5th Gen (Emerald Rapids); AMD EPYC 4th Gen (Genoa/Genoa-X), 5th Gen (Turin)
Compatible Server FamiliesDell PowerEdge R760/R860/R960, HPE ProLiant DL380 Gen11/DL560 Gen11/DL385 Gen11, Lenovo ThinkSystem SR650 V3/SR850 V3/SR665 V3, Supermicro X13 Series
Operating System SupportWindows Server 2019/2022, RHEL 8/9, SLES 15, VMware vSphere 7.x/8.x, Ubuntu Server 20.04/22.04 LTS
JEDEC StandardJEDEC JESD79-5 DDR5
Operating Temperature0°C to 85°C (case temperature)
Storage Temperature-40°C to 95°C
Operating Humidity5% to 95% RH (non-condensing)
MTBF>43,800 hours (5 years continuous operation)
ComplianceRoHS 2.0 compliant, CE marked, FCC Class B, JEDEC DDR5 certified
Manufacturing StandardsISO 9001 Quality Management, ISO 14001 Environmental Management