Micron DDR5 RDIMM 128GB 2Rx8 5600MHz CL46 32Gbit ECC Registered Server Memory MTC40F2047S1RC56BB

Brand: Micron | Category: Memory (RAM)

SKU: MTC40F2047S1RC56BB | Part #: MTC40F2047S1RC56BB | MPN: MTC40F2047S1RC56BB

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Product Overview

The Micron MTC40F2047S1RC56BB is a 128GB DDR5 Registered DIMM (RDIMM) operating at 5600MT/s with a CL46 latency profile, built on Micron's advanced 32Gbit die technology in a 2Rx8 dual-rank configuration. As the world's leading DRAM manufacturer, Micron has engineered this module to address the explosive memory bandwidth and capacity demands of modern enterprise workloads — from in-memory analytics and large language model (LLM) inference to virtualized cloud infrastructure and high-performance computing (HPC) clusters.

DDR5 represents a fundamental generational leap over DDR4, delivering up to 2x the bandwidth, improved on-die ECC (ODECC) for enhanced data integrity at the bit level, and a new dual 32-bit sub-channel architecture that dramatically improves memory controller efficiency. The RDIMM form factor incorporates a register component that buffers command and address signals, enabling higher DIMM densities and greater per-channel capacity than unbuffered alternatives — a critical advantage in 4-socket and 8-socket server deployments where total addressable memory directly impacts application performance.

For enterprise IT architects designing next-generation server infrastructure on Intel Xeon Scalable (Sapphire Rapids, Emerald Rapids) or AMD EPYC (Genoa, Bergamo) platforms, the MTC40F2047S1RC56BB provides an ideal balance of density, speed, and silicon-proven reliability backed by Micron's decades of DRAM manufacturing excellence.

Key Features & Benefits

• Ultra-High Density at 128GB per Module: With 128GB of addressable DRAM on a single RDIMM using 32Gbit die stacking in a 2Rx8 topology, this module dramatically reduces the number of DIMMs required to populate a server, lowering slot pressure and improving thermal management across the memory subsystem. A dual-socket server can reach 4TB of total RAM with just 32 of these modules.
• DDR5-5600 MT/s Bandwidth: Operating at 5600 megatransfers per second, this RDIMM delivers up to 44.8 GB/s of peak theoretical bandwidth per module — approximately 88% more raw throughput than DDR4-3200 equivalents. This translates directly to faster in-memory database queries, reduced AI inference latency, and higher virtual machine density per host.
• CL46 Optimized Latency Profile: The CL46-45-45-90 timing profile is precisely tuned for server-class SPD programming, ensuring deterministic latency across mixed workloads. Combined with DDR5's improved command/address parity and CRC on write data, error detection is tightened versus DDR4 at comparable absolute latency figures.
• On-Die ECC (ODECC) + RDIMM ECC Protection: DDR5 integrates on-die ECC natively within each DRAM die, correcting single-bit errors before data ever reaches the memory bus. Combined with the module-level ECC inherent to the RDIMM standard, this dual-layer protection scheme delivers best-in-class data integrity for mission-critical enterprise and financial workloads.
• 2Rx8 Dual-Rank Configuration: The dual-rank x8 organization maximizes memory interleaving opportunities at the controller level, enabling CPUs to pipeline memory requests across ranks and sustain higher effective bandwidth under realistic multi-threaded server workloads compared to single-rank alternatives.
• JEDEC DDR5 Standard Compliant: Full compliance with JEDEC JESD79-5B DDR5 specifications guarantees interoperability across all major server OEM platforms validated for DDR5 RDIMMs, including Intel and AMD next-generation server ecosystems, simplifying qualification and procurement for large-scale enterprise deployments.
• 1.1V Operating Voltage: DDR5 reduces the standard operating voltage from DDR4's 1.2V to 1.1V. At 128GB per DIMM, this power efficiency improvement delivers meaningful reductions in total power draw across fully populated server memory subsystems, directly reducing cooling costs and TCO in hyperscale and enterprise data centre environments.
• 32Gbit Die Technology: Built on Micron's 32Gb DRAM die, this module represents the cutting edge of monolithic DRAM density, providing a proven, single-die reliability advantage over multi-die stack configurations in mission-critical server applications.

Technical Architecture

The MTC40F2047S1RC56BB is constructed on Micron's leading-edge DRAM process node optimized for 32Gbit per die. The module employs a 2-rank, x8 organization across 288-pin DDR5 RDIMM form factor. Each rank contains 16 DRAM devices arranged to present a 64-bit data bus width with an additional 8 bits of ECC, producing the standard 72-bit ECC-protected memory bus used in server platforms.

The RDIMM register component (RCD) buffers all command and address signals sourced from the host memory controller, allowing the module to be populated at higher densities without violating signal integrity constraints on the motherboard trace topology. The Serial Presence Detect (SPD) EEPROM is programmed with JEDEC-standard SPD data including XMP/EXPO-equivalent server profiles, enabling plug-and-play detection and configuration by BIOS/UEFI firmware on compatible platforms.

DDR5's dual sub-channel architecture divides the 64-bit data bus into two independent 32-bit channels, each with its own command/address path. This architectural shift doubles the effective command bandwidth available to the memory controller and allows finer-grained memory access granularity, benefiting workloads with smaller, scattered memory footprints such as key-value stores, graph databases, and microservices frameworks.

Performance & Capacity

At 5600MT/s with a 64-bit (72-bit with ECC) bus width, each module delivers a theoretical peak bandwidth of approximately 44.8 GB/s. In dual-channel or quad-channel server configurations (typical of Intel Xeon and AMD EPYC platforms), aggregate memory bandwidth scales to 179.2 GB/s and 358.4 GB/s respectively, enabling sustained throughput for the most demanding HPC and AI inference pipelines.

• Module Capacity: 128GB per DIMM
• Data Transfer Rate: 5600 MT/s (DDR5-5600)
• Peak Bandwidth (per module): ~44.8 GB/s
• Cas Latency: CL46 (46-45-45-90)
• Operating Voltage: 1.1V (VDD/VDDQ)
• Bus Width: 72-bit (64-bit data + 8-bit ECC)
• Rank Configuration: Dual Rank (2Rx8)
• Die Density: 32Gbit per die

Compatibility & Integration

The Micron MTC40F2047S1RC56BB is designed for deployment in server platforms utilizing Intel Xeon Scalable 4th and 5th Generation processors (Sapphire Rapids-SP, Emerald Rapids-SP) and AMD EPYC 4th Generation (Genoa) and subsequent processors that natively support DDR5 RDIMM memory channels. Compatibility has been validated against major server OEM platforms including Dell PowerEdge (R760, R860, R960), HPE ProLiant (DL380 Gen11, DL560 Gen11), Lenovo ThinkSystem, Supermicro H13 series, and Inspur NF series enterprise servers.

The module operates within standard JEDEC DDR5 RDIMM electrical specifications and is detected automatically via SPD by UEFI BIOS on all compliant motherboards. It supports all major server operating systems including Red Hat Enterprise Linux (RHEL 8/9), SUSE Linux Enterprise Server (SLES 15), Ubuntu Server LTS, VMware vSphere 8, Microsoft Windows Server 2022, and leading hypervisors including KVM and Hyper-V. No driver installation is required; memory operates transparently to the OS through standard JEDEC SPD negotiation.

Ideal Use Cases

• AI & Machine Learning Training Infrastructure: Large language model (LLM) pre-training and fine-tuning workloads require terabytes of high-bandwidth memory accessible by GPU accelerators via CPU-mediated data pipelines. Populating servers with 128GB DDR5 RDIMMs maximizes the host memory pool available for dataset buffering, gradient checkpointing, and model parameter staging, reducing NVMe I/O bottlenecks during training runs.
• In-Memory Database & Real-Time Analytics: Platforms such as SAP HANA, Redis Enterprise, VoltDB, and SingleStore benefit enormously from high-capacity, high-bandwidth DRAM. A single 4-socket server populated with MTC40F2047S1RC56BB modules can address up to 8TB of in-memory data, enabling sub-millisecond query latency for OLAP and HTAP workloads without tiering to slower storage.
• High-Density VMware & KVM Virtualization: Enterprise virtualization hosts running hundreds of VMs per node require large memory pools to avoid ballooning, swapping, or transparent huge page degradation. 128GB DDR5 RDIMMs enable operators to maximize VM density per socket while preserving per-VM memory allocations, improving consolidation ratios and reducing hardware acquisition costs.
• HPC & Scientific Computing Clusters: Finite element analysis (FEA), computational fluid dynamics (CFD), genomics pipelines, and molecular dynamics simulations are memory-bandwidth-bound by nature. DDR5-5600 with its dual sub-channel architecture provides the raw sustained bandwidth these workloads require to maintain full CPU utilization across all cores.
• Cloud & Hyperscale Infrastructure Buildouts: Cloud service providers building out OpenStack, Kubernetes, or proprietary hyperscale compute fleets benefit from the per-slot density of 128GB RDIMMs, reducing total DIMM count, simplifying inventory management, and lowering per-GB memory cost at scale while future-proofing infrastructure for DDR5-native workloads.
• Financial Services & High-Frequency Trading (HFT) Back-Office: Risk calculation engines, real-time clearing systems, and tick-data analytics platforms demand both high memory capacity and deterministic low-latency access patterns. The CL46 timing profile and on-die ECC of this module deliver the combination of speed and reliability mandated by financial-grade SLAs.
• EDA & Semiconductor Design: Electronic Design Automation tools such as Synopsys VCS, Cadence Spectre, and Mentor Questa simulate chips with billions of transistors, requiring servers with multiple terabytes of RAM per job. High-density DDR5 RDIMMs are the foundational building block for EDA compute farms where memory capacity directly limits simulation scale and throughput.

Related Products & Ecosystem

• Micron DDR5 RDIMM 64GB & 96GB Variants for mixed-density server deployments balancing cost and capacity per slot
• Intel Xeon Scalable 4th/5th Gen Processors the primary CPU platform natively supporting DDR5-5600 RDIMM channels
• AMD EPYC Genoa (9004 Series) CPUs 12-channel DDR5 architecture maximizing aggregate bandwidth with high-density RDIMMs
• Dell PowerEdge R760 / HPE ProLiant DL380 Gen11 Servers validated server platforms for DDR5 RDIMM deployment at enterprise scale
• Micron & Samsung Enterprise NVMe SSDs complement high-bandwidth memory with low-latency NVMe storage for AI and database tiers
• 40GbE / 100GbE Network Adapters match memory and compute upgrades with network infrastructure capable of sustaining the resulting data throughput