Micron DDR5 RDIMM 96GB 2Rx8 6400MT/s CL52 ECC Registered Server Memory MTC40F2044WS1RC64BC1

Brand: Micron | Category: Memory (RAM)

SKU: MTC40F2044WS1RC64BC1 | Part #: MTC40F2044WS1RC64BC1 | MPN: MTC40F2044WS1RC64BC1

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Product Overview

The Micron DDR5 RDIMM 96GB 2Rx8 6400MT/s CL52 (Part Number: MTC40F2044WS1RC64BC1, Y5CB Tray) represents the pinnacle of enterprise server memory technology, purpose-built for organisations that demand uncompromising performance, reliability, and density in their IT infrastructure. As the latest generation of DDR5 Registered Dual Inline Memory Modules, this 96GB module operates at a blazing 6400 megatransfers per second — a substantial leap over DDR4 predecessors — delivering the raw memory bandwidth required by modern AI/ML inference engines, large-scale virtualisation platforms, in-memory databases, and high-performance computing clusters.

Manufactured by Micron Technology, one of the world's foremost semiconductor and memory innovators, this RDIMM leverages advanced 1β (1-beta) DRAM fabrication process nodes to achieve both higher density and improved energy efficiency compared to legacy DDR4 solutions. The Y5CB tray designation indicates OEM/enterprise tray packaging, making this module ideal for volume deployments in hyperscale data centres, enterprise server refreshes, and cloud service provider infrastructure rollouts across the GCC and global markets.

With ECC (Error-Correcting Code) and registered (buffered) architecture as standard, the MTC40F2044WS1RC64BC1 ensures the signal integrity and data accuracy that mission-critical enterprise workloads demand. Whether powering a four-socket EPYC Genoa system, an Intel Xeon Scalable platform, or a next-generation ARM-based server, this module is engineered to integrate seamlessly and perform flawlessly under sustained, heavy-load conditions.

Key Features & Benefits

• 96GB High-Density Single Module: Delivers exceptional memory capacity per DIMM slot, enabling servers to reach multi-terabyte total memory configurations with fewer populated slots — critical for large language model (LLM) inference, in-memory analytics, and SAP HANA deployments where working dataset size is paramount.
• DDR5-6400 MT/s Peak Bandwidth: Operating at 6400 megatransfers per second, this module provides up to 51.2 GB/s theoretical peak bandwidth per module — approximately 1.88× the bandwidth ceiling of DDR4-3200 — dramatically accelerating data-intensive workloads including deep learning training, real-time OLAP queries, and video transcoding pipelines.
• CL52 Latency Profile (52-52-52): The CL52 timing profile is carefully optimised to balance high-frequency operation with acceptable absolute latency, ensuring that cache-miss penalties remain manageable even in latency-sensitive transactional database and financial services environments.
• 2Rx8 Dual-Rank Architecture: The 2Rx8 configuration uses dual independent rank access across x8 DRAM components, providing a favourable balance between bandwidth, capacity, and electrical load on the memory controller — supporting server platforms that require controlled power draw across heavily populated memory channels.
• On-Die ECC (ODECC) + System ECC: DDR5 introduces on-die ECC natively at the DRAM component level, providing an additional layer of error correction before system-level ECC operates. Together, these two layers dramatically reduce uncorrectable error rates (UER), protecting enterprise data integrity across 24/7 continuous operation cycles.
• Registered (Buffered) DIMM Design: The RDIMM register buffers command and address signals between the memory controller and DRAM components, enabling higher DIMM counts per channel and improved signal integrity at high frequencies — essential for multi-DIMM-per-channel (2DPC) server configurations common in 2S and 4S enterprise platforms.
• Power Management ICs (PMIC) On-Module: DDR5 modules integrate dedicated on-module Power Management ICs, replacing the motherboard-level voltage regulation of DDR4. This delivers more precise, stable voltage delivery to DRAM cells, reducing power noise and supporting the fine-grained power states (including deeper idle states) that improve total rack energy efficiency.
• Y5CB OEM Tray Packaging: Designed for enterprise OEM and volume channel deployment, the tray format simplifies large-scale memory population projects, system integration workflows, and certified server build-outs with reduced per-unit packaging overhead.

Technical Architecture

The MTC40F2044WS1RC64BC1 is built on Micron's advanced 1β (1-beta) DRAM process node, which delivers improved cell density and reduced leakage current compared to 1α (1-alpha) node predecessors. The module is configured in a 2Rx8 topology, meaning it uses two independently addressable ranks, each constructed from x8-wide DRAM components arranged across the PCB. This results in 16 DRAM ICs per module contributing to a combined 96GB addressable capacity per DIMM.

The DDR5 standard introduces a fundamentally redesigned electrical interface compared to DDR4, featuring a bus voltage of 1.1V (versus 1.2V for DDR4), differential clocking architecture, and burst length of 16 (BL16) with on-die ECC enabled natively. The command/address bus uses a registered clock driver (RCD) compliant with JEDEC DDR5 RCD02 specification, which is mounted on the DIMM PCB and responsible for re-driving all command, address, and clock signals to the DRAM components — enabling the higher frequencies and longer signal traces required in dense multi-socket server designs.

The DIMM's Serial Presence Detect (SPD) hub leverages the DDR5 SPD5 standard with I3C interface, providing richer metadata communication between the module and host platform memory controller, enabling more accurate training, margining, and power optimisation during POST and runtime. The module conforms to JEDEC JESD79-5B DDR5 SDRAM standards and JESD21C Annex L: Serial Presence Detect (SPD) for DDR5 SDRAM Modules.

Performance & Capacity

At 6400MT/s data rate with a 64-bit wide bus (plus 8-bit ECC), each module delivers a theoretical peak bandwidth of approximately 51.2 GB/s. In dual-channel (2-DIMM) configurations typical of modern enterprise processors, aggregate bandwidth per CPU reaches up to 307.2 GB/s on platforms with 6-channel DDR5 memory controllers (such as AMD EPYC Genoa/Bergamo), enabling unprecedented data movement rates for AI inference batching, columnar analytics, and genomics workloads.

• Module Capacity: 96GB per DIMM
• Data Transfer Rate: DDR5-6400 (6400 MT/s)
• Peak Bandwidth per Module: ~51.2 GB/s
• CAS Latency: CL52 (tCL = 52 cycles)
• Timing Profile: 52-52-52 (CL-tRCD-tRP)
• Operating Voltage: 1.1V (VDDQ), 1.1V (VDD)
• Rank Configuration: 2Rx8 (Dual Rank, x8 organisation)
• ECC: On-Die ECC + System-Level ECC (Full ECC)
• DRAM Components: 16× Micron DDR5 SDRAM ICs (x8 width)

Compatibility & Integration

The MTC40F2044WS1RC64BC1 is engineered to be compatible with leading enterprise server platforms supporting DDR5 RDIMM memory. Validated platforms include systems based on Intel 4th/5th Generation Xeon Scalable processors (Sapphire Rapids, Emerald Rapids) and AMD EPYC 4th Generation processors (Genoa, Genoa-X, Bergamo, Siena). Typical compatible server families include HPE ProLiant Gen11, Dell PowerEdge 16G (R760, R660, R960), Lenovo ThinkSystem V3, Supermicro H13 series, and Inspur NF series DDR5-capable platforms.

From an operating system perspective, the module is compatible with all major enterprise OS distributions including Red Hat Enterprise Linux (RHEL) 8/9, SUSE Linux Enterprise Server (SLES) 15, Ubuntu Server 22.04/24.04 LTS, VMware vSphere 8.x, Microsoft Windows Server 2022/2025, and leading hypervisors. No driver installation is required — DDR5 RDIMM modules are enumerated and trained automatically by the platform BIOS/UEFI during POST via the SPD5 interface.

The DIMM form factor is standard 288-pin DDR5 RDIMM, physically and electrically incompatible with DDR4 slots (keyed differently), ensuring installation errors are prevented at the hardware level. The module meets JEDEC DDR5 JESD79-5B compliance and is RoHS 2.0 compliant for deployment across EU, UAE, and GCC regulatory environments.

Ideal Use Cases

• Artificial Intelligence & Machine Learning Inference: Large language models (LLMs), computer vision inference engines, and recommendation systems require massive memory bandwidth and capacity to hold model weights and activations in DRAM. The 96GB density and 51.2 GB/s bandwidth of this module make it ideal for GPU-adjacent CPU memory in AI inference servers running frameworks like PyTorch, TensorFlow, and ONNX Runtime.
• High-Performance Computing (HPC) & Scientific Simulation: Computational fluid dynamics (CFD), finite element analysis (FEA), genomics sequencing, and climate modelling workloads are characterised by large working datasets and streaming memory access patterns that benefit directly from DDR5-6400 bandwidth improvements over DDR4.
• In-Memory Databases & Real-Time Analytics: Platforms such as SAP HANA, Redis Enterprise, VoltDB, and SingleStore require terabytes of fast, reliable DRAM to maintain entire databases in memory. High-density 96GB RDIMMs reduce the DIMM slot count needed to reach target capacity, lowering power draw and cost per GB at the rack level.
• Virtualisation & Virtual Desktop Infrastructure (VDI): Enterprise VMware vSphere, Microsoft Hyper-V, and Nutanix AHV deployments consolidating hundreds of virtual machines per host benefit from maximum DRAM capacity per server. The MTC40F2044WS1RC64BC1 enables very high VM density, reducing physical server sprawl and associated licensing costs.
• Cloud Service Provider Infrastructure: Public and private cloud operators deploying compute nodes for IaaS, PaaS, and containerised workloads (Kubernetes, OpenShift) need dense, reliable memory to maximise tenant density. DDR5-6400 enables faster memory balloon operations, live migration, and snapshot throughput compared to DDR4 infrastructure.
• Financial Services & Real-Time Risk Analytics: High-frequency trading platforms, Monte Carlo risk simulations, and real-time market data processing require both low latency and high bandwidth from server memory. The ECC protection layers guard against silent data corruption — a critical requirement in regulated financial environments.
• Telecommunications & 5G Core Network Functions: Virtualised Network Functions (VNFs) and Cloud-Native Network Functions (CNFs) running on COTS server hardware in 5G core deployments require substantial DRAM capacity and bandwidth to handle millions of simultaneous subscriber sessions with deterministic latency.

Why Source from Omnixon in Dubai

Omnixon Global is a premier B2B IT hardware distributor headquartered in Dubai, UAE, with an established presence serving enterprise clients, system integrators, data centre operators, and government entities across the GCC region including Saudi Arabia, UAE, Qatar, Kuwait, Bahrain, and Oman, as well as international markets worldwide. As DDR5 technology adoption accelerates across the region's hyperscale and enterprise data centre landscape, Omnixon maintains ready stock of high-demand Micron memory modules including the MTC40F2044WS1RC64BC1, minimising procurement lead times for critical infrastructure projects.

Enterprise procurement teams benefit from Omnixon's technical pre-sales support, helping validate memory compatibility with specific server platforms and assisting with bill-of-materials (BOM) optimisation for large-scale deployments. All products supplied by Omnixon are sourced through authorised channels and supplied as brand new, genuine units — ensuring enterprises receive authentic Micron memory with full manufacturer quality assurance. Omnixon's logistics infrastructure in Dubai enables efficient regional distribution compliant with UAE customs and import regulations, simplifying procurement for GCC-based enterprises operating under VAT and local compliance frameworks.

Related Products & Ecosystem

To build a complete DDR5 memory ecosystem for your enterprise server environment, consider pairing the MTC40F2044WS1RC64BC1 with complementary products available from Omnixon's portfolio:

• Micron DDR5 RDIMM 64GB & 128GB Modules — for mixed-capacity memory population strategies across different server tiers
• Micron DDR5 LRDIMM 256GB — for maximum single-socket memory capacity in memory-optimised servers supporting LRDIMMs
• Intel Xeon Scalable 5th Gen (Emerald Rapids) Processors — CPU platforms with native DDR5-6400 memory controller support
• AMD EPYC 9004 Series (Genoa/Bergamo) Processors — 12-channel DDR5 memory controllers for maximum aggregate bandwidth
• HPE ProLiant DL360/DL380 Gen11 Servers — validated DDR5 RDIMM-compatible enterprise rack server platforms
• Dell PowerEdge R760 / R960 Servers — high-density 2S and 4S enterprise servers supporting DDR5-6400 RDIMMs
• Enterprise NVMe SSDs (PCIe Gen5) — complement high-bandwidth DDR5 memory with Gen5 storage to eliminate I/O bottlenecks in data-intensive workloads