Micron MRDIMM 256GB 8800MT/s

The Micron 256GB MRDIMM (Multiplexed Rank DIMM) represents a fundamental architectural advancement in server memory technology, purpose-built to meet the extreme bandwidth demands of next-generation AI inference, large language model serving, and bandwidth-bound HPC applications. Operating at 8800 MT/s, the MRDIMM standard introduces an on-DIMM multiplexer ASIC that aggregates multiple ranks and presents a unified high-bandwidth interface to the memory controller, effectively doubling the sustained memory bandwidth available per channel compared to conventional DDR5 RDIMMs operating at equivalent frequencies. This architecture is co-engineered with Intel's Xeon 6 processor platform, which natively supports the MRDIMM electrical and protocol specification, enabling seamless deployment in compatible dual-socket and single-socket enterprise servers launched in 2025.

At 256GB per module, the Micron MRDIMM provides exceptional capacity density, allowing platforms with 8 or 12 DIMM slots to achieve multi-terabyte memory configurations within a single server node without sacrificing per-channel bandwidth. This combination of high capacity and high throughput directly addresses the memory wall problem encountered when running large AI models in-memory, in-database analytics engines, and real-time recommendation systems where both working-set size and data movement rate are simultaneously critical. The on-DIMM multiplexer ASIC is designed to be transparent to the operating system and hypervisor, ensuring compatibility with standard JEDEC DDR5 software stacks and memory management frameworks.

Micron's MRDIMM leverages advanced DRAM die technology with high-density stacking and refined signal integrity engineering to sustain 8800 MT/s across the full 256GB capacity. The module employs a registered clock driver, on-die ECC across all DRAM components, and an additional MRDIMM-layer ECC path through the multiplexer ASIC, delivering enterprise-grade reliability and RAS (Reliability, Availability, Serviceability) features including post-package repair, per-DRAM addressability, and DIMM-level thermal throttling. This positions the module as the memory subsystem of choice for Tier-1 AI inference servers, real-time analytics appliances, and next-generation virtualization hosts where both reliability and raw throughput are non-negotiable.

Ideal for

• Large Language Model (LLM) inference servers running multi-billion parameter models entirely in DRAM, where sustained memory bandwidth directly limits token generation throughput per second
• In-memory database and real-time analytics platforms such as SAP HANA or Redis Enterprise requiring terabyte-scale working sets with sub-millisecond query latency
• AI recommendation engine nodes processing high-dimensional embedding table lookups at scale, where memory bandwidth saturation is the primary performance bottleneck
• High-frequency trading and financial risk modeling infrastructure demanding both large in-memory datasets and maximum data movement rates across Monte Carlo or VaR simulations
• Virtualization and cloud-native host consolidation on Intel Xeon 6 platforms requiring maximum VM density per node while maintaining per-VM memory bandwidth SLAs
• Genomics and computational biology workloads performing large-scale sequence alignment and variant calling against reference datasets held entirely in high-bandwidth main memory

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.