Brand: SK Hynix | Category: Memory (RAM)
SKU: H5CG48AGBX | Part #: H5CG48AGBX | MPN: H5CG48AGBX
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The SK Hynix HBM3E 24GB is a third-generation High Bandwidth Memory module engineered for next-generation AI accelerators and GPU compute platforms. Featuring 24GB of unified memory capacity with HBM3E architecture, this module delivers extreme memory bandwidth essential for large language model inference, transformer-based workloads, and tensor operations at scale. The Mach-1 variant represents the production-qualified implementation optimized for NVIDIA H200 Tensor GPUs and upcoming accelerator generations.
HBM3E technology integrates multiple DRAM dies in a vertical stack with Through-Silicon Vias (TSVs) to achieve unprecedented bandwidth-to-footprint efficiency. The 24GB capacity addresses critical memory wall constraints in generative AI applications, enabling deployment of larger model weights and extended batch processing without frequent host-memory transfers.
Designed for enterprise data center deployment, the HBM3E 24GB module meets strict reliability requirements for mission-critical AI infrastructure. SK Hynix manufactures this component to support the accelerating adoption of large-scale transformer models, retrieval-augmented generation systems, and real-time inference services across financial services, technology, research, and cloud service provider environments.
| Manufacturer | SK Hynix |
| ManufacturerPartNumber | H5CG48AGBX |
| ProductName | HBM3E 24GB High Bandwidth Memory (Mach-1) |
| MemoryType | HBM3E (High Bandwidth Memory 3E) |
| Capacity | 24 GB |
| ConfigurationDies | 8 x 3GB dies |
| BusWidth | 1024-bit |
| PeakBandwidth | 1.456 TB/s |
| OperatingVoltage | 1.15V |
| OperatingTemperatureRange | 0°C to 85°C |
| StorageTemperatureRange | -40°C to 125°C |
| InterfaceStandard | HBM3E JEDEC |
| PackageForm | BGA (Ball Grid Array) |
| LaunchQuarter | Q1 2024 |
| TargetApplications | AI accelerators, GPU compute, HPC systems |
| MemoryTechnology | 3D stacked DRAM with Through-Silicon Vias (TSVs) |
| GenerationLineage | HBM3E (succeeds HBM3) |
Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.
| Brand | SK Hynix |
| Category | Memory (RAM) |
| SKU | H5CG48AGBX |
| Part Number | H5CG48AGBX |
| Condition | New |
| ManufacturerPartNumber | H5CG48AGBX |
| ProductName | HBM3E 24GB High Bandwidth Memory (Mach-1) |
| MemoryType | HBM3E (High Bandwidth Memory 3E) |
| Capacity | 24 GB |
| ConfigurationDies | 8 x 3GB dies |
| BusWidth | 1024-bit |
| PeakBandwidth | 1.456 TB/s |
| OperatingVoltage | 1.15V |
| OperatingTemperatureRange | 0°C to 85°C |
| StorageTemperatureRange | -40°C to 125°C |
| InterfaceStandard | HBM3E JEDEC |
| PackageForm | BGA (Ball Grid Array) |
| LaunchQuarter | Q1 2024 |
| TargetApplications | AI accelerators, GPU compute, HPC systems |
| MemoryTechnology | 3D stacked DRAM with Through-Silicon Vias (TSVs) |
| GenerationLineage | HBM3E (succeeds HBM3) |