SK Hynix HBM3E 24GB High Bandwidth Memory (Mach-1)

Brand: SK Hynix | Category: Memory (RAM)

SKU: H5CG48AGBX | Part #: H5CG48AGBX | MPN: H5CG48AGBX

Contact for Pricing — Request a Quote

Request a Quote Contact Us

About the SK Hynix HBM3E 24GB High Bandwidth Memory (Mach-1)

The SK Hynix HBM3E 24GB is a third-generation High Bandwidth Memory module engineered for next-generation AI accelerators and GPU compute platforms. Featuring 24GB of unified memory capacity with HBM3E architecture, this module delivers extreme memory bandwidth essential for large language model inference, transformer-based workloads, and tensor operations at scale. The Mach-1 variant represents the production-qualified implementation optimized for NVIDIA H200 Tensor GPUs and upcoming accelerator generations.

HBM3E technology integrates multiple DRAM dies in a vertical stack with Through-Silicon Vias (TSVs) to achieve unprecedented bandwidth-to-footprint efficiency. The 24GB capacity addresses critical memory wall constraints in generative AI applications, enabling deployment of larger model weights and extended batch processing without frequent host-memory transfers.

Designed for enterprise data center deployment, the HBM3E 24GB module meets strict reliability requirements for mission-critical AI infrastructure. SK Hynix manufactures this component to support the accelerating adoption of large-scale transformer models, retrieval-augmented generation systems, and real-time inference services across financial services, technology, research, and cloud service provider environments.

Ideal for

  • Large language model (LLM) inference serving with extended context windows and multi-user concurrency
  • Generative AI model training for transformer architectures and fine-tuning workflows
  • Real-time video processing, computer vision, and multimodal AI inference at scale
  • Financial modeling, quantitative analysis, and high-frequency computational research
  • Scientific computing simulations requiring massive in-memory datasets and tensor operations
  • Cloud service provider GPU-as-a-Service (GPUaaS) infrastructure for enterprise AI workloads

Technical specifications

ManufacturerSK Hynix
ManufacturerPartNumberH5CG48AGBX
ProductNameHBM3E 24GB High Bandwidth Memory (Mach-1)
MemoryTypeHBM3E (High Bandwidth Memory 3E)
Capacity24 GB
ConfigurationDies8 x 3GB dies
BusWidth1024-bit
PeakBandwidth1.456 TB/s
OperatingVoltage1.15V
OperatingTemperatureRange0°C to 85°C
StorageTemperatureRange-40°C to 125°C
InterfaceStandardHBM3E JEDEC
PackageFormBGA (Ball Grid Array)
LaunchQuarterQ1 2024
TargetApplicationsAI accelerators, GPU compute, HPC systems
MemoryTechnology3D stacked DRAM with Through-Silicon Vias (TSVs)
GenerationLineageHBM3E (succeeds HBM3)

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.

Technical Specifications

BrandSK Hynix
CategoryMemory (RAM)
SKUH5CG48AGBX
Part NumberH5CG48AGBX
ConditionNew
ManufacturerPartNumberH5CG48AGBX
ProductNameHBM3E 24GB High Bandwidth Memory (Mach-1)
MemoryTypeHBM3E (High Bandwidth Memory 3E)
Capacity24 GB
ConfigurationDies8 x 3GB dies
BusWidth1024-bit
PeakBandwidth1.456 TB/s
OperatingVoltage1.15V
OperatingTemperatureRange0°C to 85°C
StorageTemperatureRange-40°C to 125°C
InterfaceStandardHBM3E JEDEC
PackageFormBGA (Ball Grid Array)
LaunchQuarterQ1 2024
TargetApplicationsAI accelerators, GPU compute, HPC systems
MemoryTechnology3D stacked DRAM with Through-Silicon Vias (TSVs)
GenerationLineageHBM3E (succeeds HBM3)