Samsung M321R4GA3EB2-CCPKF 32GB DDR5-5600 ECC RDIMM

Samsung M321R4GA3EB2-CCPKF 32GB DDR5-5600 ECC RDIMM

Brand: Samsung | Category: Memory (RAM)

SKU: SAM-M321R4GA3EB2-CCPKF | Part #: M321R4GA3EB2-CCPKF | MPN: M321R4GA3EB2-CCPKF

Contact for Pricing — Request a Quote

Request a Quote Contact Us

About the Samsung M321R4GA3EB2-CCPKF 32GB DDR5-5600 ECC RDIMM

Samsung's M321R4GA3EB2-CCPKF represents a refined approach to server memory for workloads where latency and stability matter equally. Operating at CAS latency 46 and a conservative 1.1V voltage specification, this 32GB DDR5-5600 ECC RDIMM sits at the intersection of frequency and predictability—exactly where mission-critical infrastructure needs to operate. The combination of low operating voltage and native on-die ECC means you're buying memory that won't surprise you under sustained load, whether you're running an in-memory database cluster, real-time analytics pipeline, or high-frequency trading platform where microsecond variations ripple through downstream decisions.

The M321R4GA3EB2-CCPKF is a Samsung single-rank registered DIMM built on a 10-layer PCB with x4 component width, adhering strictly to JEDEC DDR5 RDIMM standards. This part number has been validated across major platform families—Dell PowerEdge, HPE ProLiant, Lenovo ThinkSystem—which means your infrastructure team can deploy it with confidence into existing refresh cycles. The 288-pin low-profile form factor fits standard 2U and 1U server chassis without adapter complications, and the registered buffering isolates each slot from electrical loading effects that can degrade signal integrity in high-density configurations. Where unregistered memory would force you to choose between capacity and stability in a 16-slot or 32-slot system, Samsung's registered design lets you populate more capacity per server without compromising per-slot reliability.

Infrastructure architects and storage engineers specify this memory when they need DDR5 performance without the thermal or power-budget penalties of higher-speed bins. The 1.1V specification is particularly significant for organizations running 24/7 cooling costs across distributed data centers in warm regions—every 100mV reduction compounds over thousands of servers and months of operation. The on-die ECC at the DRAM level catches single-bit errors before they propagate to the system controller, reducing the probability of undetected corruption in scenarios where application-level checksums don't catch everything. This layered approach to error handling is why database teams, specifically those running PostgreSQL, MySQL, or commercial warehousing systems in high-concurrency modes, tend to specify Samsung memory with native ECC over competitors with post-manufacture ECC implementations.

Thermal characteristics matter in modern server deployments. The M321R4GA3EB2-CCPKF maintains rated performance across the standard commercial operating range of 0°C to 85°C, with no need for memory-specific active cooling in most data-center environments. The low-profile RDIMM design also means airflow patterns aren't disrupted by tall heatsinks, preserving CPU cooling efficiency in tight-pitch blade systems or high-density racks. Samsung has published detailed performance curves showing this part's behavior under sustained load at ambient temperatures typical of GCC-region data centers, making it a straightforward fit for capacity planning without surprise derating or thermal throttling surprises three quarters into a deployment.

Compatibility and validation are non-negotiable in enterprise procurement. The M321R4GA3EB2-CCPKF's adherence to JEDEC DDR5 RDIMM standards means it integrates into qualified vendor memory lists (QVLs) for current-generation server platforms without requiring firmware updates or special BIOS tuning. System administrators appreciate this: memory that just works removes a potential failure mode from their deployment checklist. The part number appears consistently across vendor catalogs and supply chains, reducing the likelihood of counterfeit or grey-market variants that plague smaller or niche memory SKUs. Omnixon Global maintains verified supplier relationships with Samsung distribution, ensuring the M321R4GA3EB2-CCPKF you receive is factory-sealed with full warranty coverage and traceability documentation—crucial for organizations subject to audit trails or supply-chain compliance requirements.

Performance and Reliability Specifications

  • DDR5-5600 speed at CAS latency 46 with 1.1V operating voltage for predictable, low-power operation in latency-sensitive workloads
  • Native on-die ECC with Rank Error Correction (REC) capability, catching single-bit errors at the DRAM level before system propagation
  • Single-rank (1Rx4) design reducing electrical loading per slot, enabling higher capacity-per-server in 16+ slot configurations without stability penalties
  • 10-layer PCB with registered buffering (RDIMM) for signal integrity and isolation in high-density deployments
  • Low-profile form factor compatible with standard 1U/2U server chassis and existing airflow designs without active memory cooling
  • JEDEC DDR5 RDIMM compliant with qualified vendor lists (QVLs) for Dell, HPE, Lenovo, and other major OEM platforms
  • Operating temperature range 0°C to 85°C, validated for continuous duty in warm-climate data-center environments across the GCC region
  • 288-pin configuration with full backward compatibility in server refresh cycles, minimizing platform validation overhead

Organizations across the GCC, Asia-Pacific, and Europe rely on Omnixon Global to source server memory with the same rigor applied to CPU and storage procurement. The Samsung M321R4GA3EB2-CCPKF—whether specified for a data-center refresh, AI infrastructure buildout, or mission-critical database cluster—is backed by our technical team's direct supplier relationships and field-proven deployment experience. We carry both individual modules and full-server memory kits in stock, supported by same-day technical consultation and RFQ turnaround. Contact our enterprise memory specialists to discuss qualification, volume pricing, and warranty options for your next infrastructure project.

Technical Specifications

BrandSamsung
CategoryMemory (RAM)
SKUSAM-M321R4GA3EB2-CCPKF
Part NumberM321R4GA3EB2-CCPKF
ConditionNew
Capacity32GB
Form FactorRDIMM
InterfaceDDR5
Speed5600 MT/s
Manufacturer Part NumberM321R4GA3EB2-CCPKF
Capacity32GB
Memory TypeDDR5
Form FactorRDIMM (Registered DIMM)
Speed5600 MT/s (DDR5-5600)
Pin Count288-pin
ECC SupportECC (Error-Correcting Code)
Module Width72-bit (64-bit data + 8-bit ECC)
Component Widthx4
RanksSingle Rank (1Rx4)
Operating Voltage1.1V
On-Die ECCYes (native DDR5 DRAM-level on-die ECC)
CAS Latency46
Module HeightLow-profile RDIMM
JEDEC ComplianceJEDEC DDR5 RDIMM Standard
Operating Temperature0°C to 85°C (standard commercial/server operating range)
PCB Layers10-layer

Frequently Asked Questions about Samsung M321R4GA3EB2-CCPKF 32GB DDR5-5600 ECC RDIMM

What does the Samsung M321R4GA3EB2-CCPKF 32GB DDR5-5600 ECC RDIMM do?

The Samsung M321R4GA3EB2-CCPKF 32GB DDR5-5600 ECC RDIMM is enterprise RDIMM memory designed for ECC-protected workloads — virtualization hosts, database servers, analytics platforms, and AI training rigs. Samsung validates this module against major server vendor compatibility matrices.

What are the headline specs of the Samsung M321R4GA3EB2-CCPKF 32GB DDR5-5600 ECC RDIMM?

Key specifications for the Samsung M321R4GA3EB2-CCPKF 32GB DDR5-5600 ECC RDIMM: capacity 32GB; form factor RDIMM; interface DDR5; new condition; capacity 32GB; memory type DDR5-5600; module type ECC RDIMM; use case Servers, workstations, and enterprise platforms. Manufacturer part number M321R4GA3EB2-CCPKF. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.

Is the Samsung M321R4GA3EB2-CCPKF 32GB DDR5-5600 ECC RDIMM compatible with my infrastructure?

The Samsung M321R4GA3EB2-CCPKF 32GB DDR5-5600 ECC RDIMM fits RDIMM memory slots and is compatible with major server platforms validated by Samsung. Server vendor IPL/HCL compatibility (Dell PowerEdge, HPE ProLiant, Lenovo ThinkSystem, Supermicro) is checked at quote time so you don't risk a memory-channel mismatch.