Samsung DDR5 48GB RDIMM Server Memory Module M321R6GA0P82-CCP 4800MHz ECC

Samsung DDR5 48GB RDIMM Server Memory Module M321R6GA0P82-CCP 4800MHz ECC

Brand: Samsung | Category: Memory (RAM)

SKU: M321R6GA0P82-CCP | Part #: M321R6GA0P82-CCP | MPN: M321R6GA0P82-CCP

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About the Samsung DDR5 48GB RDIMM Server Memory Module M321R6GA0P82-CCP 4800MHz ECC

Product Overview

The Samsung DRAM Server DDR5 M321R6GA0P82-CCP is a 48GB Registered DIMM (RDIMM) built on Samsung's industry-leading DDR5 DRAM technology. As the world's largest DRAM manufacturer, Samsung engineered this module specifically for demanding enterprise server environments where memory bandwidth, capacity density, and reliability are non-negotiable. The transition from DDR4 to DDR5 represents one of the most significant generational leaps in server memory architecture in over a decade — delivering up to 1.87x greater bandwidth, improved power efficiency via on-die ECC, and dramatically higher per-DIMM capacities. The M321R6GA0P82-CCP slots directly into Intel Xeon Scalable (4th Gen Sapphire Rapids and beyond) and AMD EPYC Genoa/Bergamo server platforms, making it the ideal upgrade component for organisations modernising their compute infrastructure across the GCC and globally.

At 48GB per module, this RDIMM occupies a strategic sweet spot in the DDR5 portfolio — offering significantly higher density than 32GB modules while remaining cost-effective compared to 64GB or 96GB variants. For enterprise architects designing memory-optimised servers, deploying multiple M321R6GA0P82-CCP modules enables terabyte-scale memory configurations within a single 2-socket server node, which is critical for in-memory analytics, large language model (LLM) inference, and real-time OLAP workloads.

Key Features & Benefits

  • 48GB High-Density Capacity per DIMM: Achieve up to 3TB of total memory in a dual-socket server with 32 DIMM slots, enabling massive in-memory dataset operations without external storage I/O bottlenecks.
  • DDR5-4800 (PC5-38400) Speed Rating: Operating at 4800MT/s, this module delivers a peak theoretical bandwidth of approximately 38.4 GB/s per module — nearly double the bandwidth of DDR4-2666 modules — directly accelerating throughput-intensive workloads such as AI inference pipelines, HPC simulations, and real-time stream processing.
  • Registered (RDIMM) Architecture with On-Die ECC: The registered buffer isolates the memory controller from the DRAM loads, allowing stable multi-DIMM configurations per channel. On-die ECC (independent of system-level ECC) corrects single-bit errors within each DRAM die before they propagate, substantially improving data integrity in mission-critical enterprise deployments.
  • 1.1V Operating Voltage for Improved Power Efficiency: DDR5 operates at 1.1V compared to DDR4's 1.2V, resulting in meaningful power savings at scale. In a fully populated 32-DIMM server chassis, this translates to measurable reductions in per-rack power draw and cooling requirements — directly impacting PUE and TCO for data centre operators.
  • Samsung DRAM Monolithic Die Technology: Manufactured using Samsung's advanced EUV (Extreme Ultraviolet Lithography) process node, each die delivers tighter process control, higher yields, and superior thermal consistency compared to competing DRAM vendors — critical for continuous 24/7 server operation in high-ambient-temperature GCC data centres.
  • SPD 5.0 (Serial Presence Detect) with PMIC Integration: DDR5 introduces an integrated Power Management IC (PMIC) on each DIMM, enabling per-module voltage regulation and more granular power management. Combined with SPD 5.0, this allows server BMC/BIOS systems to automatically configure optimal operating parameters without manual intervention.
  • Full RAS (Reliability, Availability, Serviceability) Feature Set: Supports Post Package Repair (PPR), Hard Post Package Repair (HPPR), error logging, temperature monitoring, and refresh management — features essential for enterprise SLA compliance and predictive maintenance strategies.
  • JEDEC DDR5 Standard Compliant: Full compliance with JEDEC JESD79-5 DDR5 specification ensures interoperability across certified server platforms from major OEMs including HPE, Dell, Lenovo, Supermicro, and Inspur.

Technical Architecture

The M321R6GA0P82-CCP is built on Samsung's 1z nm (or advanced EUV) class DDR5 DRAM die technology. Unlike DDR4, the DDR5 architecture fundamentally redesigns the internal memory subsystem: each DDR5 DIMM contains two independent 32-bit sub-channels (effectively two 32-bit channels per DIMM slot) rather than a single 64-bit channel. This dual sub-channel architecture allows the memory controller to issue independent commands to each sub-channel simultaneously, significantly improving memory-level parallelism and reducing latency under mixed read/write workloads.

The RDIMM register (RCD — Registering Clock Driver) buffers address and command signals between the host memory controller and the DRAM devices, reducing electrical load on the memory bus and enabling stable operation with higher DIMM counts per channel. The module uses a 288-pin DDR5 RDIMM form factor (not backward compatible with DDR4 slots) and operates across a standard CAS latency of CL40 at 4800MT/s (40-39-39 primary timings), which is characteristic of DDR5 JEDEC-standard modules. Burst length is BL16 (Burst Chop 8 supported), and the module supports Command/Address training, Write Leveling, and Read/Write DQ training for optimal signal integrity.

Performance & Capacity

  • Capacity: 48GB per module (6Rx8 — 6 Ranks, x8 DRAM organisation)
  • Speed: DDR5-4800 / PC5-38400
  • Transfer Rate: 4800 MT/s (Mega Transfers per second)
  • Peak Bandwidth: ~38.4 GB/s per module (theoretical)
  • Primary Timings: CL40-39-39 @ 4800MT/s
  • Operating Voltage (VDD/VDDQ): 1.1V
  • Data Bus Width: 64-bit + 8-bit ECC (72-bit total)
  • Sub-Channel Architecture: 2x 32-bit independent sub-channels per DIMM
  • Burst Length: BL16 (BC8 support)
  • Read Latency Improvement vs DDR4: Up to 20% lower memory access latency under bandwidth-saturated conditions due to improved prefetch and sub-channel parallelism

Compatibility & Integration

The Samsung M321R6GA0P82-CCP is certified and validated for use with the following server platforms and ecosystems:

  • Intel Xeon Scalable Processors: 4th Generation Intel Xeon Scalable (Sapphire Rapids, SPR) — requires DDR5-capable server platforms with DDR5 DIMM slots. Compatible with platforms using the Intel C741 chipset (Eagle Stream platform).
  • AMD EPYC Processors: AMD EPYC 9004 Series (Genoa, Genoa-X) and EPYC 97x4 Series (Bergamo/Siena) — all natively support DDR5 RDIMM configurations.
  • Server OEM Platforms: HPE ProLiant DL380 Gen11, DL360 Gen11, DL560 Gen11; Dell PowerEdge R760, R760xa, R860, R960; Lenovo ThinkSystem SR650 V3, SR850 V3; Supermicro H13 Series; Inspur NF5280M7; Fujitsu PRIMERGY RX2540 M7.
  • Operating Systems: Compatible with all major enterprise OS environments including Red Hat Enterprise Linux (RHEL), SUSE Linux Enterprise Server (SLES), Ubuntu Server LTS, VMware vSphere/ESXi 8.x, Microsoft Windows Server 2022, and containerised environments (Kubernetes, OpenShift).
  • Form Factor: 288-pin DDR5 RDIMM — not backward compatible with DDR4 or DDR3 slots.
  • Standards Compliance: JEDEC JESD79-5 (DDR5), RoHS 2.0, REACH compliant.

Ideal Use Cases

  • AI & Machine Learning Inference: Large-scale LLM inference servers and AI inferencing nodes require massive, low-latency memory to hold model parameters in-memory. The 48GB density and DDR5-4800 bandwidth of the M321R6GA0P82-CCP enable GPU-attached or CPU-based inference platforms to serve models with billions of parameters without constant NVMe paging.
  • In-Memory Databases & OLAP: Platforms such as SAP HANA, Oracle TimesTen, MemSQL (SingleStore), and Redis Enterprise thrive when the entire working dataset resides in DRAM. A 2-socket server fully populated with 48GB RDIMMs can support up to 3TB of in-memory database capacity, enabling sub-millisecond query response times for real-time analytics.
  • Virtualisation & VDI Infrastructure: VMware vSphere, Microsoft Hyper-V, and Nutanix AHV environments benefit from higher per-server DRAM capacity to increase VM density. With 48GB per DIMM, IT teams can consolidate more virtual machines per host, reducing physical server count and licensing costs.
  • Cloud-Native & Hyperscale Computing: Cloud service providers and hyperscalers deploying OpenStack, Kubernetes, or proprietary cloud orchestration stacks can leverage the DDR5 bandwidth improvements to handle higher container density and faster pod scheduling, directly improving infrastructure utilisation rates.
  • High-Performance Computing (HPC) & Scientific Simulation: Computational fluid dynamics (CFD), finite element analysis (FEA), genomics sequencing pipelines, and climate modelling applications are memory-bandwidth bound. The ~38.4 GB/s per-module throughput of DDR5-4800 significantly accelerates these workloads compared to DDR4-based predecessors.
  • Real-Time Streaming & Event Processing: Apache Kafka, Apache Flink, and similar event-streaming architectures that process millions of events per second benefit from the improved memory parallelism of DDR5's dual sub-channel design, reducing per-event processing latency at scale.
  • ERP & Enterprise Application Servers: Tier-1 ERP platforms (SAP S/4HANA, Oracle EBS, Microsoft Dynamics) deployed on dedicated bare-metal servers require large, reliable memory pools. The RDIMM ECC architecture of the M321R6GA0P82-CCP ensures data integrity for financial transaction processing and eliminates costly unplanned downtime.

Why Source from Omnixon in Dubai

Omnixon Global is a trusted B2B IT hardware distributor headquartered in Dubai, UAE, specialising in enterprise-grade components for data centres, cloud infrastructure teams, and IT procurement professionals across the GCC region — including the UAE, Saudi Arabia, Qatar, Kuwait, Bahrain, and Oman — as well as international buyers worldwide.

As a specialist in server memory and compute components, Omnixon maintains dedicated inventory of Samsung DRAM products including DDR5 RDIMM, LRDIMM, and NVDIMM modules, enabling rapid fulfilment for enterprise refresh cycles, urgent capacity expansions, and large-scale data centre build-outs. Our technical pre-sales team can assist with memory compatibility validation against your specific server bill of materials, DIMM population guidelines, and channel configuration optimisation to ensure you extract maximum performance from your DDR5 investment.

GCC-based enterprise buyers benefit from Omnixon's in-region presence, reducing logistics complexity, import lead times, and cross-border compliance challenges associated with sourcing from non-regional distributors. Our procurement team is experienced in supporting government, semi-government, and private sector enterprises with structured purchase orders, RFQ responses, and vendor registration requirements common across UAE and KSA public sector procurement frameworks.

Related Products & Ecosystem

Complete your DDR5 server memory upgrade with complementary products available from Omnixon:

  • Samsung DDR5 32GB RDIMM — Lower-density option for cost-optimised DDR5 deployments
  • Samsung DDR5 64GB RDIMM — Higher-density alternative for ultra-high memory capacity configurations
  • Samsung DDR5 96GB RDIMM (9Rx4) — Maximum density DDR5 RDIMM for memory-optimised server nodes
  • SK Hynix DDR5 48GB RDIMM — Alternative DDR5 RDIMM option for multi-vendor procurement strategies
  • Micron DDR5 RDIMM Modules — JEDEC-compatible DDR5 alternatives from Micron Technology
  • Intel Xeon Scalable 4th Gen Processors (Sapphire Rapids) — Host CPUs requiring DDR5 memory channels
  • HPE ProLiant DL380 Gen11 Servers — DDR5-native 2-socket server platform fully compatible with this RDIMM
  • Dell PowerEdge R760 Servers — Enterprise 2U server optimised for DDR5 memory configurations
  • Samsung Enterprise NVMe SSDs (PM9A3/PM983) — Pair with DDR5 memory for fully modernised server storage tiers

Technical Specifications

BrandSamsung
CategoryMemory (RAM)
SKUM321R6GA0P82-CCP
Part NumberM321R6GA0P82-CCP
ConditionNew
Product LineSamsung Server DRAM DDR5
Module TypeRDIMM (Registered DIMM)
RoHS ComplianceRoHS 2.0 Compliant
Memory TechnologyDDR5 SDRAM
Capacity per Module48 GB
Speed RatingDDR5-4800 (PC5-38400)
Transfer Rate4800 MT/s
Peak Bandwidth~38.4 GB/s (theoretical per module)
Data Bus Width64-bit + 8-bit ECC (72-bit total)
Sub-Channel Architecture2x 32-bit independent sub-channels per DIMM
Rank Configuration6Rx8 (6 Ranks, x8 DRAM organisation)
Primary Timings (CL-tRCD-tRP)40-39-39 @ 4800 MT/s
Burst LengthBL16 (BC8 supported)
ECC SupportYes — On-Die ECC + System-Level ECC (x72 ECC)
Error CorrectionSingle-bit error correction, Multi-bit error detection (SECDED)
On-Die ECCYes (DRAM-internal, corrects errors per die before propagation)
Form Factor288-pin DDR5 RDIMM
Module Dimensions133.35mm x 31.25mm (Standard RDIMM)
PCB Layers10-layer PCB
Heat SpreaderNo (bare module, server chassis airflow assumed)
Operating Voltage (VDD)1.1V
I/O Voltage (VDDQ)1.1V
PMICIntegrated On-DIMM Power Management IC (DDR5 PMIC)
Typical Power Consumption~7–9W per module at full load (DDR5-4800)
Operating Temperature0°C to 85°C (Extended Temp: A-temp variant dependent on SKU suffix)
Storage Temperature-40°C to +95°C
Operating Humidity5% to 95% RH (non-condensing)
MTBF>20,000,000 hours (estimated, per Samsung DRAM reliability data)
Post Package Repair (PPR)Supported (Hard PPR and Soft PPR)
SPD VersionSPD 5.0 (DDR5 EEPROM)
Temperature MonitoringYes — integrated thermal sensor with JEDEC TS spec
Interface StandardJEDEC JESD79-5 DDR5
Compatible CPU PlatformsIntel Xeon Scalable 4th Gen (Sapphire Rapids); AMD EPYC 9004 Series (Genoa, Genoa-X, Bergamo)
Compatible Server PlatformsHPE ProLiant DL380/DL360/DL560 Gen11; Dell PowerEdge R760/R860/R960; Lenovo ThinkSystem SR650/SR850 V3; Supermicro H13 Series; Inspur NF5280M7
Operating System SupportRHEL, SLES, Ubuntu Server LTS, VMware vSphere 8.x, Windows Server 2022, OpenShift, Kubernetes
Standards ComplianceJEDEC JESD79-5 DDR5, RoHS 2.0, REACH
OEM CertificationSamsung OEM-qualified; validated by major server OEMs (HPE, Dell, Lenovo, Supermicro)