Samsung 64GB DDR5 7200MHz RDIMM ECC Registered Server Memory MDRR644QKBC2-4D000

Brand: Samsung | Category: Memory (RAM)

SKU: MDRR644QKBC2-4D000 | Part #: MDRR644QKBC2-4D000 | MPN: MDRR644QKBC2-4D000

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Product Overview

The Samsung 64GB DDR5 7200MHz RDIMM (Registered Dual Inline Memory Module) represents the cutting edge of enterprise server memory technology. Built on Samsung's industry-leading DRAM fabrication process, this module delivers exceptional bandwidth, rock-solid reliability, and the capacity modern data-intensive workloads demand. Operating at a screaming 7200 MT/s data rate — among the highest commercially available for DDR5 server memory — it is engineered specifically for next-generation enterprise platforms including the latest Intel Xeon Scalable (Granite Rapids / Sapphire Rapids Refresh) and AMD EPYC (Genoa / Bergamo / Turin) processor families.

As enterprise IT teams grapple with AI/ML inference pipelines, in-memory databases, large-scale virtualisation, and real-time analytics, the memory subsystem has become a critical bottleneck. The MDRR644QKBC2-4D000 directly addresses this challenge, offering a 64GB density per DIMM slot that reduces slot pressure while maximising addressable memory per node. Its registered (buffered) architecture ensures signal integrity across high-channel-count platforms, while on-die ECC and module-level ECC combine to safeguard data integrity at enterprise SLA standards.

For IT procurement managers and systems architects sourcing memory for mission-critical deployments across the GCC, Middle East, and global markets, Omnixon Global stocks this module brand new and ready to ship from Dubai, ensuring minimal lead times for enterprise projects of any scale.

Key Features & Benefits

• Ultra-High Bandwidth at 7200 MT/s: Delivers theoretical peak bandwidth exceeding 57.6 GB/s per module, dramatically accelerating memory-bound workloads such as AI inference, in-memory analytics, and large language model (LLM) serving.
• 64GB High-Density Capacity: Maximises memory per DIMM slot, allowing servers with 12 or 16 DIMM slots to scale to 768GB or 1TB of RAM without exhausting physical slots, preserving upgrade headroom.
• DDR5 RDIMM Architecture: The registered clock driver (RCD) buffers command and address signals, enabling stable operation across high-channel-count and high-capacity configurations that unbuffered modules cannot reliably support.
• Advanced ECC Protection: On-die ECC corrects single-bit errors at the DRAM die level before they propagate to the memory bus, while module-level ECC provides an additional layer of correction — critical for financial systems, healthcare databases, and government workloads.
• Lower Operating Voltage (1.1V): DDR5 architecture reduces DRAM core voltage to 1.1V compared to DDR4's 1.2V, cutting per-module power consumption and contributing to lower PUE in high-density rack deployments.
• Samsung's Industry-Leading DRAM Process: Fabricated on Samsung's advanced EUV node, the DRAM dies deliver improved yield, tighter timings, and proven long-term reliability underpinned by Samsung's global quality assurance infrastructure.
• Thermal Compliance & Labelling: Modules meet JEDEC SPD (Serial Presence Detect) specifications with accurate thermal sensor data, enabling platform firmware to apply intelligent thermal throttling and prevent memory-induced thermal events.
• Drop-In Compatibility: Designed to comply fully with JEDEC DDR5 RDIMM standards, ensuring broad plug-and-play compatibility across qualifying server platforms without BIOS patching or custom firmware.

Technical Architecture

The MDRR644QKBC2-4D000 is built around a multi-die stack of Samsung DDR5 DRAM components organised into a 64GB module. Each DDR5 RDIMM channel operates at 64-bit data width (with an additional 8 bits dedicated to ECC), and the registered architecture introduces a Registering Clock Driver (RCD02 or later generation) that re-drives clock and command/address signals to all DRAM components on the module. This re-driving is essential at speeds above 4800 MT/s, where signal reflections and crosstalk on unregistered traces would cause uncorrectable errors.

DDR5 introduces a fundamental architectural change compared to DDR4: each physical DIMM now contains two independent 32-bit sub-channels rather than a single 64-bit channel. This sub-channel architecture doubles the command bus frequency relative to the data bus, reducing latency for small random accesses while maintaining the wide burst bandwidth needed for streaming workloads. The 7200 MT/s data rate is achieved through tighter-binned DRAM dies and optimised signal conditioning on the PCB, validated against the JEDEC DDR5-7200 speed grade specification.

Power management is handled by an integrated PMIC (Power Management Integrated Circuit) on the module itself — another DDR5 innovation that moves voltage regulation from the motherboard to the DIMM, improving power delivery accuracy and reducing noise on the memory bus. The SPD hub stores module identity, timing parameters, and thermal sensor readings, all accessible to the host BIOS/UEFI for automatic configuration at POST.

Performance & Capacity

At 7200 MT/s, each module delivers a theoretical peak bandwidth of approximately 57.6 GB/s (7200 MT/s × 8 bytes per transfer). In a dual-channel configuration across a single CPU socket, this translates to up to 115.2 GB/s of aggregate memory bandwidth — nearly double what DDR4-3200 platforms could achieve. For multi-socket platforms with 8-channel memory controllers (e.g., Intel Xeon Granite Rapids or AMD EPYC Genoa), a fully populated server can achieve well over 900 GB/s of total system memory bandwidth.

In real-world AI inference benchmarks, high-bandwidth DDR5-7200 RDIMMs have demonstrated measurable improvements in token generation throughput for large language models held entirely in system memory. For OLAP databases such as SAP HANA or Oracle In-Memory, increased bandwidth directly reduces query execution time for column-store scans. HPC simulations with large working sets — molecular dynamics, computational fluid dynamics, finite element analysis — similarly scale near-linearly with available memory bandwidth up to the saturation point of the compute cores.

The 64GB density allows a 16-DIMM-slot platform to reach 1TB of system RAM, sufficient to host multiple concurrent large in-memory databases, dozens of memory-heavy virtual machines, or a full AI model inference stack without relying on NVMe swap or memory tiering solutions.

Compatibility & Integration

• Processor Compatibility: Intel Xeon Scalable 5th Generation (Emerald Rapids), 6th Generation (Granite Rapids); AMD EPYC 9004 Series (Genoa, Bergamo, Genoa-X) and 9005 Series (Turin)
• Server Platform Compatibility: Dell PowerEdge (R760, R860, R960), HPE ProLiant DL380 Gen11 / DL560 Gen11, Lenovo ThinkSystem SR860 V3, Supermicro H13 Series, Inspur NF Series, H3C UniServer R6900 G6
• Standards Compliance: JEDEC DDR5 RDIMM specification, JEDEC SPD (Serial Presence Detect) with TS5111 thermal sensor, DDR5-7200 speed grade
• ECC Support: Full ECC operation required; platforms must enable ECC mode in BIOS/UEFI
• Operating System Support: All major enterprise OS platforms including Red Hat Enterprise Linux, SUSE Linux Enterprise Server, Ubuntu Server LTS, Windows Server 2022/2025, VMware vSphere 8.x
• Hypervisor Support: VMware ESXi 8.x, Microsoft Hyper-V, KVM/QEMU, Nutanix AHV

Ideal Use Cases

• AI & Machine Learning Inference: Serving large language models (LLMs) and transformer-based models directly from high-bandwidth system memory, reducing reliance on GPU VRAM for inference-only nodes and lowering per-query latency.
• In-Memory Databases & OLAP Analytics: SAP HANA, Oracle Database In-Memory, and MemSQL deployments that require massive RAM footprints to hold entire hot datasets in memory for sub-second query response times.
• High-Density Server Virtualisation: VMware vSphere, Nutanix HCI, and Microsoft Hyper-V clusters where maximising VM density per physical host is essential — 64GB DIMMs minimise slot usage while enabling 1TB+ memory per node.
• High-Performance Computing (HPC): Scientific simulations, computational fluid dynamics, genomics pipelines, and financial Monte Carlo simulations that require both large memory capacity and high streaming bandwidth.
• Cloud & Colocation Infrastructure: Hyperscale and private cloud operators building high-core-count nodes with AMD EPYC or Intel Xeon, where memory bandwidth is a shared resource across many tenant workloads simultaneously.
• Real-Time Data Streaming & CEP: Complex event processing engines such as Apache Flink, Apache Kafka Streams, and custom FPGA-accelerated data pipelines that require low-latency memory access to sustain high event ingestion rates.
• Virtualised Network Functions (VNF) & Telco NFV: Carrier-grade NFV infrastructure requiring deterministic latency and large memory pools for stateful packet processing, 5G core functions, and software-defined networking overlays.

Why Buy from Omnixon Global

Omnixon Global is a trusted B2B IT hardware distributor headquartered in Dubai, UAE, with deep expertise in sourcing, validating, and delivering enterprise-grade components across the GCC region and international markets. All units of the Samsung 64GB DDR5 7200MHz RDIMM available through Omnixon are brand new, sourced through authorised supply channels, and stored in climate-controlled facilities to preserve component integrity. Our enterprise procurement specialists have hands-on experience advising data centre architects, IT managers, and system integrators on memory configuration, platform compatibility, and capacity planning — ensuring you receive not just hardware, but actionable technical guidance. With established logistics partnerships throughout the UAE, Saudi Arabia, Qatar, Kuwait, Bahrain, Oman, and beyond, Omnixon is uniquely positioned to fulfil both single-unit evaluation orders and large-volume deployment requisitions with the reliability that enterprise SLAs demand. Contact our team for volume pricing, compatibility verification, and project-level support.

Related Products & Ecosystem

To build a complete, high-performance server memory configuration, consider pairing this module with complementary products available through Omnixon Global. For the compute layer, explore our range of Intel Xeon Scalable and AMD EPYC processors (CPUs) optimised for DDR5 platforms. High-memory servers typically require enterprise NVMe SSDs for fast scratch storage and OS boot volumes — our Enterprise SSD category includes U.2 and E1.S form factors suited for AI and analytics servers. For the infrastructure layer, our Server Racks & Enclosures and Rack PDUs ensure your high-density memory platforms are housed and powered appropriately. Network bandwidth to match DDR5 memory throughput is provided by our 25GbE, 100GbE, and 400GbE Network Adapters & NICs, and Network Switches from leading vendors. Finally, for power resilience in critical deployments, our UPS & Power Protection portfolio safeguards server nodes against grid instability — essential in any enterprise data centre environment.