Micron DDR5 RDIMM 32GB 2Rx8 6400MHz CL52 16Gbit MTC20F2085S1RC64BH1R Server Memory

Brand: Micron | Category: Memory (RAM)

SKU: MTC20F2085S1RC64BH1R | Part #: MTC20F2085S1RC64BH1R | MPN: MTC20F2085S1RC64BH1R

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Product Overview

The Micron DDR5 32GB Registered DIMM (RDIMM) operating at 6400 MT/s represents the cutting edge of server memory technology, engineered specifically for modern enterprise infrastructure. Built on Micron's advanced 16Gbit (1Gb × 8) DRAM die technology with a 2Rx8 (dual-rank, x8 organisation) configuration, this module delivers exceptional memory bandwidth, improved power efficiency, and enhanced reliability features that are critical in today's compute-intensive data centre environments.

DDR5 represents a generational leap over DDR4, bringing native on-die ECC, higher channel density, improved signal integrity, and dramatically increased data rates. The 6400 MT/s speed bin pushes the boundaries of what is achievable in production server environments, making this module a premium choice for platforms that support high-frequency memory operation. At 32GB per DIMM, it enables dense memory configurations without sacrificing per-slot performance — a key consideration for rack-scale deployments where physical space and thermal headroom are always at a premium.

As a brand-new, factory-sealed component sourced directly through authorised channels, this Micron RDIMM is suited for enterprise IT procurement teams, system integrators, cloud service providers, and data centre operators across the GCC region and globally who require verified, high-quality server memory at scale.

Key Features & Benefits

• 6400 MT/s Data Rate: Delivers up to 51.2 GB/s of theoretical peak bandwidth per module, enabling the processor to feed data-hungry workloads such as in-memory analytics, AI inference, and real-time transaction processing with minimal bottlenecks.
• 16Gbit Die Technology: Micron's advanced 16Gb DRAM die enables higher density modules in a standard DIMM form factor, reducing the number of physical modules required for large memory footprints and improving overall system efficiency.
• 2Rx8 Dual-Rank Architecture: The dual-rank x8 organisation improves memory controller interleaving, effectively doubling the number of accessible rows compared to single-rank modules and enhancing memory bus utilisation for sustained throughput workloads.
• On-Die ECC (ODECC): DDR5 natively integrates per-die error correction, providing a first layer of data protection before system-level ECC is applied. This layered ECC approach significantly reduces the risk of uncorrectable errors in high-density deployments.
• Registered (RDIMM) Design: The registered buffer between the memory controller and DRAM chips reduces electrical loading on the memory bus, enabling greater DIMM counts per channel without signal integrity degradation — essential for maximising memory capacity in multi-socket server platforms.
• Improved Power Architecture: DDR5 operates at 1.1V VDD compared to DDR4's 1.2V, and incorporates on-module PMIC (Power Management IC) for tighter voltage regulation. This translates to improved power efficiency per gigabyte and reduced thermal output under sustained load.
• Wide Platform Compatibility: Designed for compliance with JEDEC DDR5 standards, ensuring compatibility with the latest Intel Xeon Scalable (Sapphire Rapids, Emerald Rapids) and AMD EPYC (Genoa, Bergamo, Siena) server processors.
• Brand New Condition: Factory-sealed with full manufacturing quality assurance, this module meets Micron's stringent production testing standards and is free from the wear and uncertainty associated with refurbished or pulled components.

Technical Architecture

The MTC20F2085S1RC64BH1R is a 288-pin DDR5 RDIMM module with a 64-bit data bus width (72-bit including ECC). The 2Rx8 configuration means two independent ranks of memory are present on the PCB, each rank utilising x8-wide DRAM devices. This configuration balances density, signal integrity, and rank interleaving performance, making it particularly effective for workloads that benefit from alternating rank access — a common pattern in database and virtualisation scenarios.

The module integrates a Registering Clock Driver (RCD) compliant with the DDR5 RCD02 specification, which buffers the command, address, and clock signals from the host memory controller. This registered design allows for longer signal paths and higher DIMM population densities without sacrificing timing margins. The on-module PMIC consolidates voltage regulation previously handled by the system board, providing cleaner, more stable power delivery to individual DRAM components and contributing to both reliability and signal integrity.

Micron's 16Gbit die, fabricated on a leading-edge process node, enables the 32GB capacity within the standard DIMM PCB footprint. The die is organised in an x8 configuration, meaning each die contributes 8 bits to the data bus, with multiple dies per rank stacked or arranged across the PCB to achieve the target rank width. Micron's manufacturing process and burn-in testing protocols ensure that each module shipped meets or exceeds JEDEC DDR5-6400 electrical and timing specifications.

Performance & Capacity

Operating at 6400 MT/s (DDR5-6400), each module provides a theoretical peak bandwidth of approximately 51.2 GB/s, calculated as 6400 MT/s × 8 bytes per transfer. In dual-channel configurations — standard for modern enterprise processors — a pair of these modules delivers over 102 GB/s of aggregate memory bandwidth per CPU socket. For multi-socket servers with 4 or 8 memory channels per socket, the aggregate bandwidth scales accordingly, providing the sustained throughput required for large language model inference, Monte Carlo simulations, seismic processing, and real-time data streaming applications.

The CL52 primary latency timing at 6400 MT/s translates to an absolute latency of approximately 16.25 nanoseconds (CL / (Transfer Rate / 2000)), which is competitive for this speed grade and represents Micron's optimisation of latency versus bandwidth at the top of the DDR5 speed spectrum. At 32GB per DIMM, a fully populated dual-socket server with 32 DIMM slots can achieve up to 1TB of total system memory — sufficient for the largest in-memory database instances, NUMA-aware HPC workloads, and containerised microservice orchestration platforms.

Compatibility & Integration

The MTC20F2085S1RC64BH1R is designed and validated for use in server platforms powered by Intel 4th and 5th Generation Xeon Scalable processors (code-named Sapphire Rapids and Emerald Rapids), which natively support DDR5 memory at up to 6400 MT/s. It is equally compatible with AMD EPYC 9004 series processors (Genoa, Bergamo, and Siena) that support DDR5 memory subsystems. System integrators should verify specific platform Qualified Vendor Lists (QVLs) for board-level validation.

• JEDEC DDR5 RDIMM standard compliant (JESD79-5)
• 288-pin DDR5 DIMM form factor
• Compatible with Intel Xeon Scalable 4th Gen (Sapphire Rapids) and 5th Gen (Emerald Rapids)
• Compatible with AMD EPYC 9004 series (Genoa, Bergamo, Siena)
• Supported in major OEM server platforms from Dell EMC, HPE, Lenovo, Supermicro, and Inspur
• RAS features: system-level ECC, advanced error reporting, and DRAM post-package repair (PPR) support
• Operating temperature: 0°C to 85°C (standard commercial range)

Ideal Use Cases

• AI & Machine Learning Training: Large-scale model training workloads require enormous memory bandwidth to feed GPU and CPU compute engines. High-frequency DDR5 RDIMMs maximise the CPU-side memory subsystem, accelerating data pre-processing pipelines and reducing training iteration times.
• Virtualisation & Cloud Platforms: VMware vSphere, Microsoft Hyper-V, and KVM-based environments benefit from large memory pools to run dense virtual machine configurations. 32GB RDIMMs enable high VM-to-host ratios while maintaining per-VM memory allocations well above minimum thresholds.
• In-Memory Databases & OLAP: Platforms such as SAP HANA, Oracle TimesTen, Redis, and Memcached rely on the entire working dataset residing in DRAM. Maximum bandwidth and capacity directly translate to query throughput and concurrent user capacity in these environments.
• High-Performance Computing (HPC): Computational fluid dynamics, finite element analysis, genomics sequencing, and weather modelling applications are characterised by large memory footprints and streaming access patterns that saturate memory bandwidth — exactly the workload profile that DDR5-6400 is optimised for.
• Enterprise Databases (OLTP): Oracle Database, Microsoft SQL Server, and PostgreSQL deployments running high transaction volumes benefit from the combination of large memory capacity and low absolute latency, reducing disk I/O by keeping hot data pages in the buffer pool.
• Media & Content Rendering: Video transcoding, 3D rendering, and digital effects pipelines operating on uncompressed or lightly compressed media streams generate significant memory bandwidth demands that DDR5-6400 RDIMMs are well-positioned to address.
• Telecommunications & NFV: Network Function Virtualisation (NFV) platforms and 5G core network servers require fast, reliable memory for packet processing and stateful network functions, where memory latency and bandwidth directly impact throughput and latency SLAs.

Why Buy from Omnixon

Omnixon Global is a trusted B2B IT hardware distributor headquartered in Dubai, UAE, with deep expertise in enterprise memory, server components, and data centre infrastructure. We maintain local stock of high-demand products including DDR5 server memory across multiple capacity and speed grades, enabling rapid fulfilment for enterprise clients throughout the UAE, Saudi Arabia, Qatar, Kuwait, Bahrain, Oman, and broader international markets. Our procurement team specialises in sourcing verified, brand-new components from authorised supply chains, eliminating the risks associated with grey-market or counterfeit hardware. Whether you are refreshing a single server, scaling a hyperscale cluster, or building out a new data centre, Omnixon's enterprise sales team provides expert guidance on memory configuration, compatibility validation, and bulk procurement planning. We understand the unique compliance, documentation, and logistics requirements of enterprise and government procurement in the GCC, and we are equipped to support your project from initial specification through to delivery.

Related Products & Ecosystem

To build a complete, high-performance server memory solution, consider complementing this DDR5 RDIMM with other products available from Omnixon's extensive catalogue. Compatible enterprise servers from leading OEMs including Dell EMC PowerEdge, HPE ProLiant, Lenovo ThinkSystem, and Supermicro are available to create fully integrated, validated platforms. For storage-intensive workloads running alongside memory-optimised applications, explore our range of Enterprise NVMe SSDs and Enterprise HDDs. High-bandwidth Network Adapters & NICs ensure that memory throughput is not bottlenecked at the network layer for distributed computing applications. For data centre power protection and infrastructure supporting your server refresh, our UPS & Power Protection and Server Racks & Enclosures categories offer enterprise-grade solutions from globally recognised brands. Our team can assist in designing a complete bill-of-materials tailored to your specific workload profile and platform requirements.