Samsung 32GB DDR4 RDIMM M393A4K40EB3-CWEGQ

Brand: Samsung | Category: Memory (RAM)

SKU: SAM-DDR4-32GB | Part #: M393A4K40EB3-CWEGQ | MPN: M393A4K40EB3-CWEGQ

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The Samsung M393A4K40EB3-CWEGQ is a 32GB DDR4-3200 RDIMM module built for high-reliability server environments where data integrity and sustained performance matter. This 288-pin registered DIMM operates at 3200 MT/s with a PC4-25600 speed rating, delivering the consistent throughput that modern data centre workloads demand. Samsung's C-die architecture at 10nm-class process geometry underpins the module's stability across the full 0°C to 85°C operating range, making it a dependable choice for sustained production deployments in GCC and Asian data centres.

What sets the M393A4K40EB3-CWEGQ apart in the mid-capacity RDIMM segment is its balance between speed and error correction overhead. The dual-rank, x4 organisation (2Rx4) combined with full ECC support means your memory subsystem can detect and correct single-bit errors in real time, a non-negotiable requirement for financial transaction servers, healthcare information systems, and AI training infrastructure. The 22-cycle CAS latency is typical for Samsung's DDR4-3200 registered DIMMs; while not aggressive, it reflects the overhead necessary for the register buffer that makes RDIMM suitable for large-scale, multi-socket configurations. At 1.2V nominal, the module aligns with JEDEC DDR4 RDIMM specifications, ensuring compatibility across vendors and generations.

When a systems architect or storage engineer at a mid-to-large enterprise spec out a new Xeon or EPYC-based server, they reach for this module because it fills a critical niche: enough capacity for in-memory analytics workloads without requiring quad-rank designs, proven Samsung build quality, and universal compatibility with Intel Xeon Scalable processors (Ice Lake and Cascade Lake) and AMD EPYC families (Rome and Milan generations). The standard 31.25mm low-profile form factor fits without interference in dense 2U or 3U chassis, so procurement teams avoid compatibility surprises. Network infrastructure teams building redundant storage appliances, database administrators configuring replicated SQL Server instances, and cloud infrastructure teams provisioning hypervisor pools all depend on this capacity and speed pairing to avoid bottlenecks at the memory tier.

Samsung's manufacturing consistency—backed by JEDEC compliance certification—means you can populate an 8-socket EPYC 7003 system or a 2-socket Xeon Platinum 8390 with multiple M393A4K40EB3-CWEGQ modules and trust that thermal throttling, frequency variance, and bit-level errors will remain within acceptable limits across years of operation. The ECC functionality is always active; there is no performance penalty for choosing error correction when your workload involves customer data, financial records, or machine learning model training. Organisations running VMware vSphere clusters, Red Hat OpenStack deployments, or Kubernetes nodes at scale benefit from the memory stability this module provides, especially in environments where a single undetected memory fault can corrupt days of computation or require expensive data recovery.

Omnixon Global stocks the Samsung M393A4K40EB3-CWEGQ as part of our enterprise memory portfolio, serving systems integrators, data centre operators, and direct enterprise customers across the UAE, Gulf region, and into Asia-Pacific. We maintain verified inventory and can support rapid deployment timelines for server refreshes and capacity expansions. For bulk configurations, engineering team consultation, or platform-specific compatibility verification, reach out via RFQ through our technical sales desk.

Performance Specifications

• Capacity: 32GB per module; dual-rank configuration allows efficient population in high-core-count processors
• Speed Grade: DDR4-3200 (PC4-25600) with 22-cycle CAS latency and 1.2V nominal voltage
• ECC Support: Full single-bit error correction and detection enabled across all addresses
• Die Technology: Samsung C-die (10nm-class third-generation process) ensures thermal stability and frequency consistency
• JEDEC Compliance: Registered RDIMM standard ensures cross-platform compatibility with Xeon and EPYC architectures
• Operating Range: 0°C to 85°C enables deployment in non-climate-controlled edge facilities and dense data centre racks
• Form Factor: 288-pin low-profile (31.25mm) RDIMM fits standard server chassis without riser-card modifications
• Part Number M393A4K40EB3-CWEGQ: Samsung's consistent SKU naming allows straightforward inventory tracking and future re-ordering