Micron HBM3E 12-Hi 48GB

The Micron HBM3E 12-Hi 48GB (MT60B6G32HB-48B:A) represents Micron's most advanced High Bandwidth Memory implementation, built on the HBM3E standard and featuring a 12-layer die stack that delivers a substantial leap in capacity and bandwidth over previous HBM generations. The architecture integrates 12 DRAM dies connected through through-silicon vias (TSVs) and micro-bumps, enabling a 1024-bit memory interface per stack that achieves exceptional data throughput while maintaining a compact silicon footprint suited for advanced packaging alongside compute dies in AI accelerator and HPC modules.

With 48GB of capacity per stack, this device addresses the growing memory demands of large-scale AI model inference and training, where insufficient memory capacity forces costly model partitioning or limits batch sizes. The HBM3E interface operates at elevated data rates compared to HBM3, and the 12-Hi stack configuration yields bandwidth figures that far exceed what is achievable with GDDR or traditional DDR5 DIMM solutions at equivalent power envelopes. Error Correcting Code (ECC) support is integrated across the stack, a mandatory attribute for enterprise-grade and mission-critical AI compute deployments where data integrity cannot be compromised.

The Micron HBM3E 12-Hi 48GB is engineered for direct integration by system and accelerator card manufacturers building next-generation AI training platforms, scientific simulation engines, and high-performance inference appliances. Its combination of raw bandwidth, high capacity, power efficiency per bit, and silicon-proven reliability positions it as a foundational memory component in datacenter GPU, NPU, and custom ASIC designs targeting demanding enterprise AI, machine learning, and data-intensive analytics workloads across UAE, GCC, EMEA, and APAC datacenter deployments.

Ideal for

• Large-scale generative AI model training requiring high-capacity, high-bandwidth memory to sustain accelerator compute throughput without memory bottlenecks
• AI inference serving for large language models and multimodal foundation models where on-chip memory capacity determines maximum model size and batch efficiency
• High-performance computing and scientific simulation workloads such as computational fluid dynamics, molecular dynamics, and climate modeling that demand rapid access to large working datasets
• Data analytics acceleration platforms processing large in-memory datasets at high concurrency, where memory bandwidth directly constrains query and transformation throughput
• Custom ASIC and NPU integration in enterprise AI accelerator cards designed for sovereign or private datacenter deployment across regulated industries
• Advanced signal processing and real-time telemetry applications in defense, telecommunications, and financial services infrastructure requiring deterministic low-latency memory access

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.