HPE 32GB (1x32GB) Dual Rank x4 DDR4-2666 CAS-19-19-19 Registered Smart Memory Kit

The HPE 32GB (1x32GB) Dual Rank x4 DDR4-2666 CAS-19-19-19 Registered Smart Memory Kit (838083-B21) is a server-grade RDIMM engineered for HPE ProLiant Gen10 and select Gen9 platforms. Built on DDR4 architecture operating at 2666 MT/s with a CAS latency of 19-19-19, this module delivers the bandwidth and reliability required to support demanding enterprise application stacks, virtualized environments, and high-throughput data processing workloads. The dual-rank x4 DRAM organization maximizes memory density per DIMM slot while maintaining compatibility with HPE's intelligent platform management infrastructure.

As an HPE Smart Memory module, the kit includes an HPE-specific Serial Presence Detect (SPD) mechanism that enables the server's BIOS and iLO subsystem to validate and authenticate the memory at POST, unlocking full platform performance profiles unavailable to third-party DIMMs. This integration allows precise thermal monitoring at the module level, supports Advanced Memory Protection features including Lockstep mode and Online Spare Memory, and enables memory mirroring configurations for environments where uptime is non-negotiable. ECC (Error Correcting Code) protection continuously scrubs single-bit errors and detects multi-bit errors, preserving data integrity across extended operational periods.

With a 32GB capacity per module and DDR4-2666 speed, this kit is well-suited for scaling memory capacity in rack and tower servers deployed across datacenter, cloud-adjacent, and AI inference infrastructure. Organizations running large in-memory databases, real-time analytics engines, containerized microservices platforms, or enterprise resource planning (ERP) systems benefit directly from the combination of high per-DIMM density, low-latency access, and the platform-validated reliability that HPE Smart Memory certification provides. The module is RoHS compliant and manufactured to HPE's datacenter-grade quality standards.

Ideal for

• Scaling virtualization hosts running VMware vSphere or Microsoft Hyper-V, where higher per-DIMM density reduces slot consumption while increasing VM density per server
• In-memory database deployments such as SAP HANA, Redis, or Microsoft SQL Server running memory-intensive OLAP and OLTP workloads requiring consistent low-latency access
• AI inference servers and HPC nodes where large model footprints demand high-bandwidth, high-capacity registered memory with validated platform integration
• Enterprise ERP and CRM application servers requiring ECC-protected, platform-authenticated memory to meet uptime SLAs and data integrity requirements
• Software-defined storage nodes and hyperconverged infrastructure platforms where memory capacity directly influences caching performance and I/O throughput
• Private and hybrid cloud control-plane servers where HPE iLO-integrated thermal and health monitoring of each memory module supports proactive fault isolation

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.