Brand: SK Hynix | Category: Memory (RAM)
SKU: SKHY-HBM3E16H48GB | Part #: HBM3E-16H-48GB | MPN: HBM3E-16H-48GB
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The SK Hynix Tall 16-High HBM3E 48GB (Sample/Production) from SK Hynix is enterprise-grade Memory (RAM) hardware built for data centers. SK Hynix's first 16-high HBM3E stack delivers 48 GB of ultra-dense bandwidth-optimized memory for next-generation AI training accelerators. Available in brand new condition. SK Hynix memory (ram) products are trusted by enterprises and data centers worldwide. Available from Omnixon Global. Contact our sales team to request a quote.
| Brand | SK Hynix |
| Category | Memory (RAM) |
| SKU | SKHY-HBM3E16H48GB |
| Part Number | HBM3E-16H-48GB |
| Condition | New |
| Product Family | HBM3E (High Bandwidth Memory 3E) |
| Stack Height | 16-High (16 DRAM dies + 1 base logic die) |
| Capacity per Stack | 48 GB |
| Interface Width | 1024-bit (8 channels × 128-bit) |
| Data Rate per Pin | 9.6 Gbps |
| Aggregate Bandwidth per Stack | Up to 1.2 TB/s |
| Number of Channels | 8 independent channels per stack |
| Supply Voltage (VDDQ) | 1.1 V nominal |
| Die Interconnect Technology | Through-Silicon Via (TSV) |
| Error Correction | On-die ECC per DRAM die + system-level ECC via base logic die |
| Package Form Factor | 2.5D HBM stack for integration on silicon interposer (CoWoS, EMIB, or equivalent) |
| Stack Footprint | Approximately 7.75 mm × 11.87 mm (standard HBM PHY footprint) |
| Stack Height (Physical) | Approximately 720 µm (TBD at production release) |
| Memory Generation Standard | JEDEC HBM3E compliant |
| Interface Standard | HBM3E PHY per JEDEC JESD238 specification |
| Refresh Scheme | Per-bank refresh (PBR) and all-bank refresh supported |
| Operating Temperature Range | 0°C to 95°C junction (HBM standard thermal envelope) |
| ESD Protection | Integrated ESD protection on all I/O and power pins |
| Availability Status | Sample / Production (2025-Q4 launch) |
| Target Applications | AI training accelerators, HPC GPUs, AI ASICs, custom 2.5D-packaged compute modules |