Micron HBM3E 36GB 12-High

Brand: Micron | Category: Memory (RAM)

SKU: MICR-MT62F6G24D156A001 | Part #: MT62F6G24D156A-001 | MPN: MT62F6G24D156A-001

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About the Micron HBM3E 36GB 12-High

The Micron HBM3E 36GB 12-High from Micron is enterprise-grade Memory (RAM) hardware built for data centers. Micron's 36GB HBM3E 12-High stack delivers 1.2 TB/s of memory bandwidth to power the most demanding AI training and high-performance computing accelerators. Available in brand new condition. Micron memory (ram) products are trusted by enterprises and data centers worldwide. Available from Omnixon Global. Contact our sales team to request a quote.

Technical Specifications

BrandMicron
CategoryMemory (RAM)
SKUMICR-MT62F6G24D156A001
Part NumberMT62F6G24D156A-001
ConditionNew
Product FamilyHBM3E
Model36GB 12-High
GenerationHBM3E (JEDEC JESD238 compliant)
Capacity per Stack36 GB
Stack Height12 DRAM core dies + 1 base logic die
Memory Interface Width1024-bit
Aggregate Bandwidth per Stack1.2 TB/s
Data Rate per Pin>9.2 Gbps
Number of Channels16 pseudo channels (8 channels × 2 pseudo channels each)
Channel Width64 bits per channel
Operating Voltage (VDD)1.1V nominal
Process NodeMicron 1-beta (1β) DRAM
Die Interconnect TechnologyThrough-Silicon Via (TSV) with micro-bump bonding
ECC SupportOn-die ECC with advanced error correction per channel
Operating Temperature0°C to 85°C junction (Tj), extended thermal interface required
Thermal Design Power (TDP)Approximately 15W per stack at full bandwidth utilization
Package Form FactorHBM standard footprint for silicon interposer / 2.5D/3D advanced packaging
Stack Dimensions (die footprint)~11.87mm × 9.54mm (per JEDEC HBM standard)
Refresh SchemeAll-bank and per-bank refresh with self-refresh support
Launch DateQ2 2025
Target ApplicationsAI training GPUs, AI inference accelerators, HPC ASICs, exascale computing nodes
Standards ComplianceJEDEC JESD238 HBM3E, AEC-Q100 screening available for select configurations