Brand: Samsung | Category: Memory (RAM)
SKU: SAMS-MSCMMD256GB | Part #: MS-CMMD256GB | MPN: MS-CMMD256GB
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The Samsung CMM-D CXL 2.0 Memory Module 256GB from Samsung is enterprise-grade Memory (RAM) hardware built for data centers. Samsung's 256GB CXL 2.0 DRAM module in E3.S form factor delivers host-agnostic memory expansion with full cache-coherent access for bandwidth-hungry enterprise workloads. Available in brand new condition. Samsung memory (ram) products are trusted by enterprises and data centers worldwide. Available from Omnixon Global. Contact our sales team to request a quote.
| Brand | Samsung |
| Category | Memory (RAM) |
| SKU | SAMS-MSCMMD256GB |
| Part Number | MS-CMMD256GB |
| Condition | New |
| Model | CMM-D CXL 2.0 Memory Module |
| Capacity | 256 GB |
| Form Factor | E3.S 2T (EDSFF) |
| CXL Version | CXL 2.0 |
| CXL Protocol | CXL.mem (Type 3 Device) |
| Host Interface | PCIe 5.0 x8 |
| Interface Bandwidth (Peak) | Up to 64 GB/s (bidirectional aggregate) |
| DRAM Technology | DDR5 DRAM Array |
| DRAM Organization | 256 GB monolithic addressable capacity |
| ECC Support | On-die ECC with end-to-end data integrity |
| Device Type | CXL Type 3 Memory Expander |
| Memory Topology Support | Memory Pooling and Memory Sharing (CXL 2.0 fabric) |
| Operating Temperature | 0°C to 55°C (ambient) |
| Power Consumption (Active) | ~25 W (typical operating) |
| Power Consumption (Idle) | ~8 W (low-power idle) |
| Supply Voltage | 3.3 V via E3.S connector |
| Host OS Compatibility | Linux kernel 5.18+ with CXL subsystem; Windows Server 2025 with CXL driver support |
| Firmware Manageability | CXL Device Firmware Update (DFU) via Vendor-defined Mailbox; MCTP/SMBus management interface |
| Compliance & Standards | CXL Consortium CXL 2.0 Specification; PCIe 5.0 Base Specification; JEDEC DDR5 DRAM Standards; EDSFF E3.S Mechanical Specification |
| Announced | 2025 Q4 |
| Vendor | Samsung Semiconductor |