Brand: Samsung | Category: Memory (RAM)
SKU: SAMS-K3KL9L90DMMGCT | Part #: K3KL9L90DM-MGCT | MPN: K3KL9L90DM-MGCT
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The Samsung HBM3E 12-High 36GB DRAM Stack from Samsung is enterprise-grade Memory (RAM) hardware built for data centers. Samsung's 12-high HBM3E stack delivers 36GB per package and industry-leading bandwidth for next-generation AI accelerators and high-performance computing platforms. Available in brand new condition. Samsung memory (ram) products are trusted by enterprises and data centers worldwide. Available from Omnixon Global. Contact our sales team to request a quote.
| Brand | Samsung |
| Category | Memory (RAM) |
| SKU | SAMS-K3KL9L90DMMGCT |
| Part Number | K3KL9L90DM-MGCT |
| Condition | New |
| Product Family | HBM3E 12-High |
| Capacity per Package | 36 GB |
| Memory Technology | HBM3E (High Bandwidth Memory 3E) |
| Stack Height | 12 dies (12-high) |
| Process Node | Samsung 1b-nm DRAM |
| Bus Width per Package | 1024 bits |
| Data Rate per Pin | Up to 9.8 Gbps |
| Aggregate Bandwidth per Package | Up to 1.23 TB/s |
| Operating Voltage (VDD) | 1.1 V |
| Error Correction | On-die ECC with advanced multi-bit correction |
| TSV (Through-Silicon Via) Count | Multiple thousands of TSV interconnects per stack |
| Package Interface | HBM3E JEDEC-standard PHY interface for 2.5D silicon interposer integration |
| Package Type | 2.5D interposer-mounted HBM stack (CoWoS and equivalent process compatible) |
| Thermal Design | Thinned-die stacking with optimized inter-die underfill for enhanced thermal conductivity |
| Compliance Standards | JEDEC HBM3E specification, JEDEC JESD238 |
| ECC Mode | Advanced on-die ECC; supports system-level RAS features |
| Refresh Scheme | Distributed refresh with temperature-compensated self-refresh (TCSR) |
| Target Applications | AI/ML accelerators, HPC GPUs, custom AI ASICs, FPGA-based HPC platforms |
| Launch Date | Q2 2025 |
| Form Factor | Bare-die stack for integration on silicon interposer; not a standalone DIMM |
| Power Consumption (Typical) | Optimized per JEDEC HBM3E power envelope; precise figures dependent on system operating point |