XFX Speedster MERC 310 Radeon RX 7900 XT 20GB

The XFX Speedster MERC 310 Radeon RX 7900 XT 20GB (RX-79TMERCB9) is built on AMD's RDNA 3 architecture, fabricated on a 5nm process node, and delivers high-throughput compute and rendering performance suited to demanding professional environments. The card features 5376 stream processors, a 320-bit memory bus, and 20GB of GDDR6 memory operating at 20 Gbps effective speed, yielding 800 GB/s of memory bandwidth. AMD's RDNA 3 architecture introduces second-generation Infinity Cache and dual-issue compute units that substantially increase compute density per clock compared to prior generations.

The MERC 310 thermal solution employs a triple-fan, triple-dissipation design with a large aluminum fin stack and copper heat pipes, enabling sustained boost clocks under extended workloads without throttling. The card draws power through dual 8-pin connectors and carries a 315W TDP, positioning it for workstations with standard high-end PSU configurations. DisplayPort 2.1 outputs support up to 8K display connectivity, and the card is DirectX 12 Ultimate, Vulkan, and OpenCL compliant.

For enterprise and professional users, the RX 7900 XT addresses mid-to-upper-range rendering pipelines, real-time visualization, and GPU-accelerated compute workloads including simulation and machine learning inference. With ROCm platform support on compatible Linux environments, the card can be integrated into compute workflows using HIP and OpenCL-based software stacks. Its 20GB frame buffer accommodates large scene assets, multi-layer compositing, and data sets that exceed the capacity of lower-tier accelerators.

Ideal for

• 3D rendering and real-time ray tracing in production pipelines using AMD-compatible renderers such as Blender Cycles and Radeon ProRender
• GPU-accelerated compute and simulation workloads on ROCm-enabled Linux environments using HIP or OpenCL frameworks
• Multi-display professional visualization setups requiring DisplayPort 2.1 bandwidth for high-resolution or high-refresh-rate panels
• AI inference workloads on workstation-class hardware where large VRAM capacity is required to load substantial model weights
• Video post-production and compositing tasks demanding large frame-buffer allocations for high-resolution footage and multi-layer timelines
• CAD and digital content creation workstation deployments where sustained performance under thermal load and broad API support are required

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.