Supermicro SuperBlade SBI-4229P-T3N

The Supermicro SBI-4229P-T3N is a next-generation SuperBlade module built around the AMD EPYC 9005 'Turin' processor architecture, supporting up to two AMD EPYC 9005 series CPUs per blade with a maximum TDP envelope suited for high-density blade chassis deployments. Leveraging the Zen 5 microarchitecture, each EPYC 9005 processor delivers up to 192 cores per socket, providing exceptional compute density for throughput-intensive enterprise, HPC, and cloud-native workloads. The blade integrates PCIe 5.0 fabric connectivity, enabling substantially higher bandwidth for NVMe storage, accelerators, and inter-blade communication compared to its predecessor generation.

The SBI-4229P-T3N is designed to slot into Supermicro's SuperBlade enclosures, sharing power, cooling, and networking infrastructure across all blade modules to dramatically reduce per-node power delivery overhead. The module supports DDR5 memory across multiple DIMM slots per processor, enabling large memory footprints ideal for in-memory databases, AI inference staging, and large-scale virtualization. The blade's T3N designation reflects its tri-mode NVMe/SAS/SATA storage controller capability, providing flexible local storage configuration without sacrificing drive density.

As a 2025-Q2 launch product, the SBI-4229P-T3N positions SuperBlade deployments at the forefront of x86 compute density, targeting hyperscale edge deployments, financial analytics, genomics processing, and enterprise private cloud infrastructure. The shared-resource SuperBlade architecture allows organizations to achieve server densities of up to 20 compute blades per 10U enclosure, translating to an extraordinary ratio of compute cores per rack unit. PCIe 5.0 support ensures the platform remains relevant as GPU and SmartNIC accelerator ecosystems continue to advance.

Ideal for

• High-density private cloud infrastructure requiring maximum vCPU density per rack unit with shared power and cooling efficiency
• HPC cluster deployments in genomics, computational fluid dynamics, and molecular simulation leveraging EPYC 9005's high core count and memory bandwidth
• Financial services low-latency analytics and risk calculation engines benefiting from large DDR5 memory capacity and fast PCIe 5.0 fabric
• AI inference serving farms where blade density minimizes datacenter floor space while PCIe 5.0 supports high-bandwidth accelerator cards
• Telecom and edge NFV (Network Functions Virtualization) deployments requiring compact, power-efficient multi-tenant compute nodes
• Enterprise virtualization consolidation projects targeting aggressive VM density ratios across Kubernetes and traditional hypervisor environments

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.