SK Hynix LPDDR5X 16GB (POP) for AI Edge / Mobile

The SK Hynix LPDDR5X 16GB Package-on-Package (PoP) module (H58G66AK7BX067) represents the current leading edge of low-power mobile and edge-AI memory technology. Built on SK Hynix's advanced LPDDR5X architecture, this solution delivers significantly elevated bandwidth and reduced power consumption compared to prior LPDDR generations, making it an ideal fit for inference-heavy AI edge deployments, flagship mobile SoC platforms, and compact embedded compute systems where thermal and power budgets are tightly constrained.

The PoP form factor integrates the DRAM stack directly atop the application processor die, minimising trace length and signal latency while dramatically reducing the PCB footprint required for high-capacity memory. This tight physical integration translates directly into lower parasitic inductance and improved signal integrity at the extreme data rates that LPDDR5X supports. The H58G66AK7BX067 operates across the full LPDDR5X speed range, supporting burst lengths and command/address protocols defined under the JEDEC LPDDR5X specification, enabling sustained high-throughput data movement for neural network activations, feature maps, and real-time sensor fusion pipelines.

For enterprise and commercial deployments spanning AI-accelerated edge gateways, ruggedised industrial tablets, automotive companion compute modules, and next-generation mobile workstations, the SK Hynix LPDDR5X 16GB PoP module provides the capacity headroom and memory bandwidth necessary to run large on-device models without offloading to cloud infrastructure. Omnixon Global supplies this component to enterprise buyers across the UAE, GCC, EMEA, and APAC regions, supporting volume procurement requirements for integration and fleet-scale edge AI deployments.

Ideal for

• On-device AI inference in edge gateways and smart camera systems requiring high sustained memory bandwidth for real-time neural network execution
• Flagship Android and mobile Linux SoC platform integration where PoP packaging enables compact, high-density board designs for ultra-thin commercial devices
• Automotive ADAS companion compute modules demanding low-latency, low-power memory for sensor fusion and object detection workloads
• Industrial IoT edge servers and ruggedised tablets processing high-resolution vision data locally without cloud dependency
• 5G mobile compute platforms and portable enterprise devices requiring maximum performance within strict thermal and battery constraints
• and ODM design-in programs for next-generation AI-enabled consumer electronics, wearables, and embedded compute modules at scale

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.