SK Hynix HBM4 Base Die Engineering Sample

The SK Hynix HBM4 Base Die Engineering Sample (H5CGG8NGMDX-ES) represents SK Hynix's next-generation High Bandwidth Memory architecture, engineered to meet the extreme memory bandwidth and capacity demands of advanced AI training clusters, exascale HPC systems, and next-generation GPU and accelerator platforms. As an Engineering Sample, this component is targeted at system architects, SoC designers, and platform integrators performing early-stage validation, interoperability testing, and performance characterization ahead of production deployment. The HBM4 generation introduces a wider 2048-bit interface per stack compared to the 1024-bit interface of HBM3, enabling a substantial leap in peak aggregate bandwidth that is critical for large language model (LLM) inference and training workloads where memory bandwidth is the primary system bottleneck.

Built on SK Hynix's advanced DRAM process technology, the HBM4 Base Die serves as the logical and physical foundation of the complete HBM4 stack, housing the interface logic, through-silicon via (TSV) interconnects, and the base I/O circuitry that communicates with the host logic die via a silicon interposer or 2.5D/3D packaging substrate. The base die architecture in HBM4 adopts an open-base-die specification, enabling third-party logic or compute die integration, a design philosophy intended to support heterogeneous integration use cases such as logic-on-memory or custom AI accelerator configurations. This flexibility makes the H5CGG8NGMDX-ES particularly relevant for semiconductor companies and hyperscale platform teams designing bespoke accelerators.

As an Engineering Sample designation (ES suffix), the H5CGG8NGMDX-ES is not a production-released component and is supplied exclusively for technical evaluation, pre-silicon bring-up, and platform validation purposes. Enterprises and research institutions engaged in next-generation AI infrastructure development, memory subsystem benchmarking, or advanced packaging research will find this component essential for establishing readiness ahead of production-grade HBM4 availability. Omnixon Global facilitates access to this engineering sample for qualified buyers across UAE, GCC, EMEA, and APAC regions, supporting global technology programs that require early access to leading-edge memory technology.

Ideal for

• Pre-production validation and bring-up of next-generation AI accelerator SoCs and GPUs requiring HBM4 memory subsystem characterization
• Advanced packaging and 2.5D/3D integration research, including chiplet interoperability testing on silicon interposers for heterogeneous compute platforms
• HPC system architecture evaluation for exascale and petascale cluster designs where memory bandwidth is a primary performance constraint
• Large language model (LLM) and generative AI infrastructure planning, enabling memory subsystem benchmarking ahead of production silicon availability
• Semiconductor IP and EDA tool validation requiring physical HBM4 base die samples for TSV, PHY, and interface controller development and testing
• Enterprise datacenter and hyperscale research teams conducting early platform qualification for next-generation AI training and inference node designs

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.