Brand: SK Hynix | Category: GPUs
SKU: H5CG8H24MER-R0C | Part #: H5CG8H24MER-R0C | MPN: H5CG8H24MER-R0C
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The SK Hynix HBM3E 24GB 8-Hi (Mach-1) is a high-bandwidth memory stack engineered for next-generation GPU accelerators in enterprise AI and HPC environments. Operating at 9.2 Gbps per pin with a 1024-bit interface, this module delivers 1.46 TB/s aggregate bandwidth per stack, enabling efficient data movement for transformer model inference, large language model serving, and multi-GPU distributed training workloads.
Designed as an 8-high stacked configuration with 24GB capacity per stack, the HBM3E Mach-1 is the critical memory tier for NVIDIA H200 and AMD MI325X accelerators. The stack integrates advanced thermal management and signal integrity features required for sustained operation in dense data center deployments, supporting both single-stack and multi-stack GPU architectures with deterministic memory access patterns.
| Manufacturer | SK Hynix |
| Product Line | HBM3E (Mach-1) |
| Manufacturer Part Number | H5CG8H24MER-R0C |
| Capacity | 24 GB |
| Stack Configuration | 8-Hi (8 dies) |
| Interface Width | 1024-bit |
| Data Rate | 9.2 Gbps |
| Peak Bandwidth | 1.46 TB/s |
| Memory Type | High Bandwidth Memory (HBM3E) |
| Die Density | 3 GB per die |
| Logic Die | 8-die stack with integrated controller |
| Operating Temperature Range | 0°C to 85°C (junction) |
| Power Envelope | Integrated within GPU thermal design |
| Process Node | Advanced submicron DRAM process |
| RAS Features | Error-correcting code (ECC), on-die error detection |
| Thermal Interface | Thermal slug for direct cooling integration |
| Substrate | High-density interposer with micro-bump interconnects |
| Launch Date | Q1 2024 |
| GPU Integration | NVIDIA H200 / AMD MI325X ecosystems |
Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.
| Brand | SK Hynix |
| Category | GPUs |
| SKU | H5CG8H24MER-R0C |
| Part Number | H5CG8H24MER-R0C |
| Condition | New |
| Product Line | HBM3E (Mach-1) |
| Manufacturer Part Number | H5CG8H24MER-R0C |
| Capacity | 24 GB |
| Stack Configuration | 8-Hi (8 dies) |
| Interface Width | 1024-bit |
| Data Rate | 9.2 Gbps |
| Peak Bandwidth | 1.46 TB/s |
| Memory Type | High Bandwidth Memory (HBM3E) |
| Die Density | 3 GB per die |
| Logic Die | 8-die stack with integrated controller |
| Operating Temperature Range | 0°C to 85°C (junction) |
| Power Envelope | Integrated within GPU thermal design |
| Process Node | Advanced submicron DRAM process |
| RAS Features | Error-correcting code (ECC), on-die error detection |
| Thermal Interface | Thermal slug for direct cooling integration |
| Substrate | High-density interposer with micro-bump interconnects |
| Launch Date | Q1 2024 |
| GPU Integration | NVIDIA H200 / AMD MI325X ecosystems |