Omnixon Global

SK Hynix HBM3E 24GB 8-Hi (Mach-1) High Bandwidth Memory Stack

Brand: SK Hynix | Category: GPUs

SKU: H5CG8H24MER-R0C | Part #: H5CG8H24MER-R0C | MPN: H5CG8H24MER-R0C

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About the SK Hynix HBM3E 24GB 8-Hi (Mach-1) High Bandwidth Memory Stack

The SK Hynix HBM3E 24GB 8-Hi (Mach-1) is a high-bandwidth memory stack engineered for next-generation GPU accelerators in enterprise AI and HPC environments. Operating at 9.2 Gbps per pin with a 1024-bit interface, this module delivers 1.46 TB/s aggregate bandwidth per stack, enabling efficient data movement for transformer model inference, large language model serving, and multi-GPU distributed training workloads.

Designed as an 8-high stacked configuration with 24GB capacity per stack, the HBM3E Mach-1 is the critical memory tier for NVIDIA H200 and AMD MI325X accelerators. The stack integrates advanced thermal management and signal integrity features required for sustained operation in dense data center deployments, supporting both single-stack and multi-stack GPU architectures with deterministic memory access patterns.

Ideal for

  • Large language model (LLM) inference acceleration with reduced memory bandwidth bottlenecks in production environments
  • Multi-GPU distributed training of foundation models requiring low-latency inter-GPU memory coherence
  • Real-time inference serving for generative AI applications with high token-generation throughput
  • High-performance computing (HPC) simulations and computational fluid dynamics workloads leveraging peak bandwidth
  • Machine learning recommendation systems requiring rapid feature lookup and aggregation at scale
  • Quantized model deployment and fine-tuning operations across consolidated GPU infrastructure

Technical specifications

ManufacturerSK Hynix
Product LineHBM3E (Mach-1)
Manufacturer Part NumberH5CG8H24MER-R0C
Capacity24 GB
Stack Configuration8-Hi (8 dies)
Interface Width1024-bit
Data Rate9.2 Gbps
Peak Bandwidth1.46 TB/s
Memory TypeHigh Bandwidth Memory (HBM3E)
Die Density3 GB per die
Logic Die8-die stack with integrated controller
Operating Temperature Range0°C to 85°C (junction)
Power EnvelopeIntegrated within GPU thermal design
Process NodeAdvanced submicron DRAM process
RAS FeaturesError-correcting code (ECC), on-die error detection
Thermal InterfaceThermal slug for direct cooling integration
SubstrateHigh-density interposer with micro-bump interconnects
Launch DateQ1 2024
GPU IntegrationNVIDIA H200 / AMD MI325X ecosystems

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Technical Specifications

BrandSK Hynix
CategoryGPUs
SKUH5CG8H24MER-R0C
Part NumberH5CG8H24MER-R0C
ConditionNew
Product LineHBM3E (Mach-1)
Manufacturer Part NumberH5CG8H24MER-R0C
Capacity24 GB
Stack Configuration8-Hi (8 dies)
Interface Width1024-bit
Data Rate9.2 Gbps
Peak Bandwidth1.46 TB/s
Memory TypeHigh Bandwidth Memory (HBM3E)
Die Density3 GB per die
Logic Die8-die stack with integrated controller
Operating Temperature Range0°C to 85°C (junction)
Power EnvelopeIntegrated within GPU thermal design
Process NodeAdvanced submicron DRAM process
RAS FeaturesError-correcting code (ECC), on-die error detection
Thermal InterfaceThermal slug for direct cooling integration
SubstrateHigh-density interposer with micro-bump interconnects
Launch DateQ1 2024
GPU IntegrationNVIDIA H200 / AMD MI325X ecosystems