SK Hynix HBM3E 24GB 8-Hi AI Compute Module

The SK Hynix HBM3E 24GB 8-Hi AI Compute Module (H5CG8AGBMD-X002) represents the current apex of High Bandwidth Memory technology, built on SK Hynix's third-generation extended HBM3E architecture. Featuring eight stacked DRAM dies in a Through-Silicon Via (TSV) configuration, this module delivers 24GB of capacity per stack with a 1024-bit wide memory bus per stack, enabling aggregate memory bandwidth that significantly exceeds conventional GDDR or DDR5 solutions. The HBM3E standard advances over HBM3 with higher per-pin data rates, improved power efficiency per bit transferred, and enhanced signal integrity characteristics suited to the dense silicon interposer environments found in modern AI accelerators and high-performance compute packages.

Designed for direct integration alongside high-density AI processors and FPGAs on 2.5D and 3D advanced packaging substrates, the H5CG8AGBMD-X002 is a primary memory choice for next-generation GPU and NPU accelerator platforms targeting large language model (LLM) training, inference, and scientific high-performance computing (HPC) workloads. The 8-Hi stack configuration maximises capacity within the tight footprint constraints of multi-chip module (MCM) designs, making it suitable for systems where memory capacity per unit area is a critical architectural constraint. SK Hynix's manufacturing process for this device incorporates advanced error correction and on-die ECC to support the reliability requirements of enterprise-grade compute infrastructure.

The module is positioned for deployment within datacenter-scale AI infrastructure across hyperscale cloud providers, enterprise AI compute clusters, and research HPC facilities. Its combination of high bandwidth, large per-stack capacity, and low power profile relative to bandwidth delivered makes it integral to accelerator cards and compute modules deployed in high-density rack configurations. Omnixon Global supplies this component to enterprise and institutional buyers across the UAE, GCC, EMEA, and APAC regions, supporting procurement for AI infrastructure build-outs at scale.

Ideal for

• Large language model (LLM) training and fine-tuning on GPU/NPU accelerator platforms requiring maximum memory bandwidth and capacity per package
• High-throughput AI inference serving for transformer-based models where memory bandwidth directly constrains tokens-per-second throughput
• Scientific HPC and simulation workloads on advanced 2.5D interposer-based compute modules demanding sustained high-bandwidth memory access
• Generative AI and diffusion model workloads in hyperscale datacenter GPU clusters where per-accelerator memory capacity is a primary scaling constraint
• Next-generation AI accelerator card design and integration by system and ODMs building HBM3E-equipped compute modules for enterprise deployment
• High-performance data analytics and in-memory database acceleration on heterogeneous compute platforms utilising advanced packaging technologies

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.