SK Hynix HBM3E 24GB 8-Hi Accelerator Memory Stack

The SK Hynix HBM3E 24GB 8-Hi Accelerator Memory Stack is a high-bandwidth memory module designed as the exclusive memory subsystem for next-generation GPU accelerators including NVIDIA H200 and AMD MI300X. The 8-Hi configuration stacks eight 3GB DRAM dies vertically, delivering exceptional memory bandwidth and capacity in a compact form factor optimized for data center AI and HPC deployments.

HBM3E operates at 6.4 Gbps per pin with a 1024-bit wide interface, enabling aggregate bandwidth exceeding 3.2 TB/s per stack. This architecture is purpose-built for compute-intensive workloads requiring simultaneous access to large datasets, including large language model inference, generative AI training, and scientific simulations. The 24GB capacity per stack addresses memory requirements for models ranging from 70B to 405B parameters without requiring memory sharding across multiple GPUs.

Launched in Q1 2024, the HBM3E 24GB 8-Hi configuration represents the current pinnacle of memory technology for accelerator-class compute platforms. Supply of this module remains globally constrained due to high demand from sovereign AI initiatives, hyperscale cloud providers, and enterprise research institutions competing for limited manufacturing capacity.

Ideal for

• Large language model inference and fine-tuning at scale (70B–405B parameters)
• Generative AI model serving with reduced latency and higher throughput per accelerator
• High-performance computing scientific simulations requiring massive memory bandwidth
• Sovereign and restricted-geography AI workloads requiring onshore accelerator deployment
• Multi-modal AI training combining vision, language, and audio transformers
• Real-time financial risk modeling and Monte Carlo simulations

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.