SK Hynix HBM3E 36GB Enterprise Memory Stack

Brand: SK Hynix | Category: Memory (RAM)

SKU: SKH-H5CG8AGBMD-X0CM | Part #: H5CG8AGBMD-X0CM | MPN: H5CG8AGBMD-X0CM

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A single SK Hynix HBM3E 36GB Enterprise Memory Stack establishes the memory ceiling for next-generation AI accelerators and high-performance compute nodes—a capacity that enterprise infrastructure teams must architect around when designing large-scale training and inference clusters. The SK Hynix part number H5CG8AGBMD-X0CM delivers this capacity through a purpose-built HBM3E stack featuring 12 DRAM dies stacked via Through-Silicon Via (TSV) technology, integrated onto a 2.5D silicon interposer for ultra-dense substrate mounting. This is the architecture that powers enterprise-grade GPU and tensor accelerators where memory bandwidth and density directly limit throughput.

The memory standard HBM3E provides a 1024-bit interface bus width with data rates up to 9.6 Gbps per pin, enabling peak bandwidth of approximately 1.23 TB/s per stack—the defining performance metric for bandwidth-intensive workloads. On-die ECC ensures data integrity across the full 36 GB capacity, critical for AI training pipelines where bit errors compound across billions of parameters. SK Hynix engineered this bare die stack form factor for direct integration into substrate assemblies, eliminating traditional DIMM constraints and enabling the physical proximity required for next-generation compute. For AI infrastructure teams and storage architects evaluating HBM memory for accelerator expansion, this component represents the current generation of enterprise high-bandwidth memory technology.

Typical Enterprise Deployment Scenarios

• AI accelerator memory expansion for large language model training and fine-tuning clusters
• HPC simulation workloads requiring sustained multi-terabyte-per-second memory bandwidth
• Enterprise machine learning inference platforms with high concurrent model loads
• Scientific compute and data analytics applications with bandwidth-critical algorithms
• Custom substrate assembly and module integration for proprietary accelerator designs

To evaluate the SK Hynix HBM3E 36GB stack (H5CG8AGBMD-X0CM) for your infrastructure requirements, contact Omnixon Global to request a quote.