Samsung 32GB DDR5 Memory Module

Brand: Samsung | Category: Memory (RAM)

SKU: SAMSUNGM321R4GA3BB6CQK32GBDDR5RAM | Part #: M321R4GA3BB6-CQK | MPN: M321R4GA3BB6-CQK

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A dual-socket Intel Xeon or AMD EPYC server populated with twelve of these Samsung 32GB DDR5 modules reaches 384GB of total installed memory — a ceiling that defines the memory architecture for most high-throughput workloads in modern data centres. The M321R4GA3BB6-CQK is a registered DDR5 RDIMM operating at 4800 MHz, engineered specifically for enterprise servers where memory bandwidth and reliability take precedence over consumer-grade speed bins. This capacity point and speed combination has become standard in the GCC region for organisations scaling AI inference clusters, financial trading systems, and virtualisation farms that demand both density and proven stability.

Samsung has positioned this module at the intersection of performance and thermal efficiency. The device operates at 1.1V — substantially lower than DDR4 equivalents — which reduces power draw and heat dissipation across the entire memory subsystem. In data centres where 40–50 servers sit in a single rack, that voltage reduction compounds into measurable cooling savings. The CAS latency of 40 is typical for DDR5 RDIMM at 4800 MHz; memory architects and infrastructure teams in the UAE and wider Asia have come to expect this latency profile at this speed, and it does not represent a bottleneck for server workloads that benefit from the 50% bandwidth increase DDR5 delivers over DDR4 at equivalent frequencies. The M321R4GA3BB6-CQK includes full error-correcting code (ECC) support and registered memory functionality, both non-negotiable features for any server that runs production workloads longer than 48 hours between restarts.

Storage architects and systems administrators selecting memory for large deployments must verify that their target platform — whether an Intel Xeon Platinum 8590+ or AMD EPYC 9754 system — actually supports DDR5. The jump from DDR4 to DDR5 infrastructure is not backwards-compatible, and many organisations are still mid-transition. Samsung's M321R4GA3BB6-CQK is purpose-built for the latest dual-socket platforms released in 2023 onwards. The 288-pin DIMM form factor is standard; the registered architecture ensures compatibility with the memory controller's clock and strobe signals, reducing signal integrity issues in high-density configurations. Operating temperature range of 0–85°C is conservative and reflects Samsung's confidence in the silicon — most data centre environments maintain ambient around 18–24°C, placing these modules well within comfort margins even under sustained memory load.

Organisations planning refresh cycles in the GCC region and across Asia frequently purchase DDR5 RDIMMs like this one in blocks of 12 or 24 modules per server refresh tranche. A typical enterprise AI infrastructure team will procure four to eight servers per quarter, making the M321R4GA3BB6-CQK a repeatable line item in capital budgets. The full manufacturer warranty and new, sealed condition from Samsung ensures that these modules arrive binned, tested, and ready for immediate deployment without additional validation steps. For IT teams managing mixed-generation fleets, the Samsung brand recognition and documented BIOS compatibility lists across Xeon and EPYC platforms reduce deployment friction.

The part number M321R4GA3BB6-CQK appears frequently in bill-of-materials documents for hyperscale projects in the region because it balances standardisation with availability. Omnixon Global maintains inventory across our Dubai hub and can fulfil requests for memory modules like the M321R4GA3BB6-CQK to data centres, colocation facilities, and enterprise IT departments throughout the GCC, South Asia, and into Europe. If your infrastructure roadmap includes DDR5 server refreshes or greenfield builds, we invite you to submit a detailed RFQ specifying quantities, target deployment timelines, and platform specifications. Our technical team can confirm compatibility, coordinate logistics, and provide the documentation your procurement process requires.

Performance Specifications & Platform Requirements

• Capacity: 32GB per module; twelve modules per dual-socket server yields 384GB maximum installed memory
• Memory Speed: 4800 MHz DDR5, with CAS latency 40 and 1.1V operating voltage for reduced thermal footprint
• ECC & Registered Architecture: Full ECC support with registered (buffered) DIMM design ensures signal integrity and error resilience in multi-module, high-density deployments
• Processor Compatibility: Intel Xeon (3rd Gen Scalable and newer) and AMD EPYC 7004-series and newer platforms only; DDR4 systems are not compatible
• Operating Environment: Rated 0–85°C, suitable for data centre cooling strategies and standard IT equipment racks
• Warranty & Condition: New, sealed stock with full Samsung manufacturer warranty; no refurbished or open-box units