Samsung LPCAMM2 32GB DDR5-7500 (CAMM2 Low Power)

The Samsung LPCAMM2 32GB DDR5-7500 (M425R4GA3PB0-CWMOD) represents a significant architectural advancement in mobile and compact enterprise memory design. Built on Samsung's LPDDR5X silicon and housed in the CAMM2 (Compression Attached Memory Module) form factor, this module replaces traditional SO-DIMM slots with a direct-compression connector interface, delivering substantially reduced signal path lengths and improved signal integrity at high frequencies. Operating at DDR5-7500 speeds, the module achieves a maximum data transfer rate of 60 GB/s, making it one of the fastest LPCAMM2 solutions commercially available for professional-grade platforms.

The LPCAMM2 standard is defined by JEDEC and enables a thinner, more power-efficient memory subsystem compared to conventional DDR5 SO-DIMM or standard CAMM2 implementations. LPDDR5X's inherent low-power design means the module operates at lower core voltages than standard DDR5 DIMM counterparts, directly reducing thermal output in thermally constrained environments such as compact workstations, edge servers, and AI inferencing appliances. The single 32GB module consolidates capacity that would otherwise require two SO-DIMM slots, freeing physical board space and simplifying platform thermal design.

Targeted at enterprise AI workloads, data science platforms, and high-performance mobile workstation deployments, the Samsung M425R4GA3PB0-CWMOD is suited for system integrators and enterprise procurement teams specifying next-generation platforms based on Intel Core Ultra (Meteor Lake / Lunar Lake generation) or compatible chipsets with LPCAMM2 socket support. Samsung's established manufacturing process and rigorous validation protocols make this module appropriate for mission-critical deployments across UAE, GCC, EMEA, and APAC enterprise environments where platform longevity and component reliability are primary procurement considerations.

Ideal for

• High-performance mobile workstations running AI inference, large language model (LLM) processing, and GPU-assisted machine learning pipelines where memory bandwidth is a primary bottleneck
• Compact edge AI appliances and edge servers requiring high-capacity, low-power memory in thermally constrained, fanless, or semi-fanless chassis designs
• Enterprise data science laptops and creator workstations where a single 32GB LPCAMM2 module replaces dual SO-DIMM slots, enabling thinner platform designs without sacrificing capacity
• Software-defined networking (SDN) and network function virtualization (NFV) edge nodes requiring dense memory in small form-factor platforms with strict power budgets
• Field-deployed rugged computing platforms in defense, oil and gas, and industrial IoT applications where low operating voltage reduces heat generation in sealed enclosures
• platform qualification and system integration programs building next-generation AI PC and workstation product lines certified for enterprise fleet deployment

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.