Brand: Samsung | Category: Memory (RAM)
SKU: SAMS-MSCMMB256GB | Part #: MS-CMMB256GB | MPN: MS-CMMB256GB
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The Samsung CMM-B 256GB is a Compute Express Link (CXL) 2.0 compliant memory expansion module engineered to break the physical DIMM slot constraints of modern server platforms. Built on Samsung's advanced DRAM fabrication process, the CMM-B connects via the CXL 2.0 protocol over a PCIe 5.0 physical interface, presenting a coherent, byte-addressable memory pool that the host CPU can access with near-DDR latency characteristics. The module supports CXL memory pooling and sharing, allowing multiple hosts or compute nodes to dynamically allocate and reclaim memory capacity from a shared fabric, which is a transformative architectural shift for hyperscale and enterprise data centers deploying disaggregated infrastructure.
The CMM-B is specifically optimized for workloads whose memory footprint routinely exceeds what conventional DDR5 DIMM configurations can deliver per socket. Large-scale in-memory databases, real-time analytics engines, generative AI inference serving, and deep learning training pipelines that stage massive embedding tables or KV-cache data in host memory are primary beneficiaries. By presenting 256GB of additional coherent memory per module, the CMM-B enables system architects to compose logical memory capacities well into the terabyte range without resorting to costly multi-socket NUMA topologies or sacrificing memory bandwidth efficiency.
Samsung's CMM-B ships in the industry-standard E3.S form factor, ensuring compatibility with next-generation server platforms from major brands that have adopted CXL 2.0-ready chipsets and host controllers. The module integrates an onboard CXL memory controller that handles protocol translation, error correction via ECC, and the coherency handshake with the host CPU's cache hierarchy. Its modular, hot-add design philosophy supports incremental memory scaling — operators can expand system memory capacity without system downtime in platforms with live-insertion support — making it an operationally agile building block for evolving AI infrastructure demands.
| Manufacturer | Samsung |
| Product Family | CXL Memory Module Box (CMM-B) |
| Model | CMM-B 256GB |
| Capacity | 256 GB |
| Interface Protocol | CXL 2.0 (Compute Express Link) |
| Physical Interface | PCIe 5.0 x8 |
| Form Factor | E3.S (EDSFF) |
| Memory Type | DDR5 DRAM (internally) |
| ECC Support | Yes, on-module ECC (SECDED) |
| CXL Device Type | Type 3 (CXL.mem) |
| Memory Pooling | Supported (CXL 2.0 memory pooling and sharing) |
| Host Coherency | Hardware-coherent byte-addressable memory via CXL.cache + CXL.mem |
| Operating Voltage | 3.3 V (PCIe/CXL slot) |
| Power Consumption (Active) | Approximately 25 W (typical) |
| Power Consumption (Idle) | Approximately 8 W (typical) |
| Operating Temperature | 0 °C to 55 °C |
| Storage Temperature | -40 °C to 70 °C |
| Dimensions | E3.S standard (112.75 mm × 31.5 mm) |
| RAS Features | ECC, patrol scrub, error logging, SMBus/I2C management interface |
| OS / Driver Support | Linux kernel 6.x with CXL subsystem; Windows Server 2025 with CXL driver support |
| Launch Generation | 2025 Q3 |
| Compliance & Standards | CXL Consortium CXL 2.0 specification; PCIe 5.0 Base Specification; JEDEC DDR5 |
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| Brand | Samsung |
| Category | Memory (RAM) |
| SKU | SAMS-MSCMMB256GB |
| Part Number | MS-CMMB256GB |
| Condition | New |
| Product Family | CXL Memory Module Box (CMM-B) |
| Model | CMM-B 256GB |
| Capacity | 256 GB |
| Interface Protocol | CXL 2.0 (Compute Express Link) |
| Physical Interface | PCIe 5.0 x8 |
| Form Factor | E3.S (EDSFF) |
| Memory Type | DDR5 DRAM (internally) |
| ECC Support | Yes, on-module ECC (SECDED) |
| CXL Device Type | Type 3 (CXL.mem) |
| Memory Pooling | Supported (CXL 2.0 memory pooling and sharing) |
| Host Coherency | Hardware-coherent byte-addressable memory via CXL.cache + CXL.mem |
| Operating Voltage | 3.3 V (PCIe/CXL slot) |
| Power Consumption (Active) | Approximately 25 W (typical) |
| Power Consumption (Idle) | Approximately 8 W (typical) |
| Operating Temperature | 0 °C to 55 °C |
| Storage Temperature | -40 °C to 70 °C |
| Dimensions | E3.S standard (112.75 mm × 31.5 mm) |
| RAS Features | ECC, patrol scrub, error logging, SMBus/I2C management interface |
| OS / Driver Support | Linux kernel 6.x with CXL subsystem; Windows Server 2025 with CXL driver support |
| Launch Generation | 2025 Q3 |
| Compliance & Standards | CXL Consortium CXL 2.0 specification; PCIe 5.0 Base Specification; JEDEC DDR5 |
The Samsung CXL Memory Module Box CMM-B 256GB is enterprise server memory designed for ECC-protected workloads — virtualization hosts, database servers, analytics platforms, and AI training rigs. Samsung validates this module against major server vendor compatibility matrices.
Key specifications for the Samsung CXL Memory Module Box CMM-B 256GB: new condition; manufacturer Samsung; product family CXL Memory Module Box (CMM-B); model CMM-B 256GB; capacity 256 GB; interface protocol CXL 2.0 (Compute Express Link); physical interface PCIe 5.0 x8. Manufacturer part number MS-CMMB256GB. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.