Samsung 128GB DDR4-3200 ECC RDIMM Server Memory Module

Brand: Samsung | Category: Memory (RAM)

SKU: M393AAG40M32-CAE | Part #: M393AAG40M32-CAE | MPN: M393AAG40M32-CAE

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Overview

The Samsung 128GB DDR4-3200 ECC RDIMM (M393AAG40M32-CAE) represents the pinnacle of enterprise server memory engineering. Designed for mission-critical deployments, this registered DIMM delivers an extraordinary 128GB of capacity per module, enabling system architects to build ultra-dense memory configurations without sacrificing reliability or performance. Whether you are scaling out a hyperconverged infrastructure cluster, expanding an in-memory analytics platform, or deploying next-generation AI inference servers, this module provides the raw memory bandwidth and capacity headroom that modern enterprise workloads demand.

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Key Features

• 128GB High-Density Capacity: Maximizes memory per slot, reducing the number of DIMMs required and freeing slots for future expansion in multi-socket server platforms.
• DDR4-3200 Speed Grade: Operates at 3200 MT/s, delivering up to 25.6 GB/s of peak theoretical bandwidth per module for throughput-intensive applications.
• ECC (Error Correcting Code): Detects and corrects single-bit memory errors in real time, ensuring data integrity and system stability in continuous enterprise environments.
• Registered (Buffered) Architecture: The on-DIMM register isolates the memory controller from the DRAM load, enabling large memory capacities and multi-DIMM-per-channel configurations.
• Samsung Original DRAM: Manufactured using Samsung's advanced 10nm-class DRAM fabrication process, guaranteeing consistent performance, low power consumption, and industry-leading reliability.
• 1.2V Operating Voltage: Low-voltage design minimizes power draw and thermal output, contributing to lower total cost of ownership in high-density rack deployments.
• CL22 Latency: Balanced CAS latency optimized for server workloads where throughput and sustained bandwidth matter more than absolute latency cycles.

Technical Architecture

This module is built on a 288-pin DIMM form factor, the standard for modern server platforms. The registered (buffered) design incorporates a Register Clock Driver (RCD) that re-drives command, address, and control signals, allowing the memory controller to support higher DIMM counts per channel without signal integrity degradation. Samsung's x4 DRAM organization with on-die ECC (for internal DRAM reliability) is complemented by the system-level ECC provided to the host memory controller, creating a two-layer data protection architecture.

The module uses a dual-rank configuration, effectively doubling the accessible DRAM rows and interleaving access across ranks to keep data pipelines full. This architecture is especially beneficial for workloads with large working sets, such as in-memory databases, real-time analytics, and virtual machine dense environments. Operating at a nominal voltage of 1.2V DC, the module adheres to JEDEC DDR4 standards (JESD79-4B), ensuring broad compatibility across certified server platforms.

Performance

At DDR4-3200 with a CL22-22-22 timing profile, the Samsung 128GB RDIMM delivers best-in-class bandwidth for its capacity tier. In a dual-socket server populated with eight modules per CPU, the aggregate memory bandwidth can exceed 400 GB/s, which is transformative for workloads such as SAP HANA, Oracle In-Memory Database, Redis, and large-scale machine learning model training. The high capacity per module also reduces NUMA (Non-Uniform Memory Access) imbalance in multi-socket systems, as fewer physical modules are needed to achieve the same total memory footprint, resulting in more uniform memory access latency profiles across all CPU sockets.

Compatibility

The Samsung 128GB DDR4-3200 ECC RDIMM is compatible with a broad range of enterprise server platforms that support LRDIMM or high-density RDIMM configurations at DDR4-3200. These include but are not limited to:

• HPE ProLiant Gen10 and Gen10 Plus (DL380, DL360, DL580) with Intel Xeon Scalable (Ice Lake / Cooper Lake) processors
• Dell EMC PowerEdge R750, R650, R940 with Intel 3rd Gen Xeon Scalable processors
• Lenovo ThinkSystem SR650 V2, SR850 V2 with Intel Xeon Scalable Ice Lake
• Supermicro X12 and X11 Series platforms supporting DDR4-3200 RDIMM
• Fujitsu PRIMERGY RX2540 M6 and similar enterprise rack servers

Always verify your specific server's QVL (Qualified Vendor List) and BIOS version requirements before installation. Some platforms may require a BIOS update to support 128GB single-module capacities at full DDR4-3200 speed.

Use Cases

Virtualization and Private Cloud: VMware vSphere, Microsoft Hyper-V, and KVM environments benefit enormously from high per-slot capacity. A single dual-socket server with 16 x 128GB modules achieves 2TB of RAM, supporting hundreds of simultaneous virtual machines without memory overcommitment.

In-Memory Databases: SAP HANA, Oracle TimesTen, and VoltDB require terabytes of fast, reliable memory to hold entire databases in RAM. High-density RDIMMs reduce the physical server count needed to reach multi-terabyte configurations.

AI and Machine Learning: Large language model (LLM) inference and training pipelines benefit from vast memory pools to stage model weights, batch data, and intermediate computation tensors without CPU-to-storage paging.

High-Performance Computing (HPC): Scientific simulation, computational fluid dynamics, and genomics workloads can fully utilize a 2TB memory address space on a standard 2U server chassis.

Enterprise File and Object Storage: Storage controllers and software-defined storage nodes such as Ceph, MinIO, and IBM Spectrum Scale use large DRAM pools for metadata caching and I/O buffering, directly accelerating throughput.

Ecosystem

Pair this module with Samsung PM9A3 or PM983 NVMe SSDs, enterprise HDDs, and network adapters available in our catalog to build a complete, optimized server node.