Micron 9650 PRO NVMe SSD (E3.S 30.72TB)

Micron 9650 PRO NVMe SSD (E3.S 30.72TB)

Brand: Micron | Category: Enterprise SSDs

SKU: MICR-MTFDKCD30T7TJC2BK1DABYY | Part #: MTFDKCD30T7TJC-2BK1DABYY | MPN: MTFDKCD30T7TJC-2BK1DABYY

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About the Micron 9650 PRO NVMe SSD (E3.S 30.72TB)

The Micron 9650 PRO NVMe SSD represents a generational leap in enterprise solid-state storage, engineered around PCIe Gen 6 x4 interface technology to saturate the bandwidth demands of next-generation AI accelerator pipelines, large language model inference clusters, and hyperscale data platforms. Housed in the compact E3.S 1T form factor, it delivers sequential read throughput exceeding 28 GB/s and sequential write throughput beyond 14 GB/s, enabling storage subsystems to keep pace with GPU and CPU compute fabrics that were previously bottlenecked by storage I/O. The drive leverages Micron's advanced 3D NAND technology paired with a custom NVMe controller designed to minimize latency at queue depth 1, making it equally compelling for both high-throughput streaming and latency-sensitive transactional workloads.

At 30.72 TB of usable capacity, the 9650 PRO addresses the density requirements of modern AI training checkpointing, vector database storage, and petabyte-scale analytics environments where rack space efficiency is paramount. The E3.S form factor integrates cleanly into EDSFF-compliant backplanes, enabling dense all-flash array configurations that maximize terabytes per rack unit. Power delivery and thermal management are optimized for sustained performance under continuous mixed workloads, with dynamic thermal throttling algorithms that maintain peak I/O rates across extended duty cycles without sacrificing drive longevity.

Micron has equipped the 9650 PRO with enterprise-class data integrity and security features, including end-to-end data path protection, TCG Opal 2.0 self-encrypting drive capability, and power-loss protection circuitry that preserves in-flight data during unexpected power events. NVMe 2.0 command set compliance ensures broad compatibility with Linux, VMware, and Windows Server environments, while advanced namespace management and Zoned Namespace (ZNS) support enable software-defined storage architectures to extract maximum efficiency from the drive's physical layout.

Ideal for

  • AI and machine learning training checkpoint storage, where rapid sequential write throughput reduces time-to-checkpoint for large parameter models running on GPU clusters
  • High-performance inferencing pipelines requiring sub-100 µs read latency to serve model weights and activation data to accelerator cards without pipeline stalls
  • Vector database hosting for retrieval-augmented generation (RAG) systems demanding low-latency random reads across multi-terabyte embedding indexes
  • Hyperscale object storage nodes leveraging high sequential throughput and extreme capacity density to maximize effective terabytes per watt in dense rack deployments
  • Real-time analytics and in-situ data processing platforms where columnar data engines perform full-table scans across tens of terabytes with minimal I/O latency
  • Media and entertainment post-production shared storage fabrics requiring concurrent high-bandwidth streams for 8K RAW video editing and color grading workflows

Technical specifications

ManufacturerMicron
Product Line9650 PRO
Form FactorE3.S 1T (EDSFF)
Capacity30.72 TB
InterfacePCIe Gen 6 x4
ProtocolNVMe 2.0
Sequential Read Throughput>28 GB/s
Sequential Write Throughput>14 GB/s
Random Read IOPS (4K, QD256)Up to 7,000,000 IOPS
Random Write IOPS (4K, QD256)Up to 3,500,000 IOPS
Read Latency (4K, QD1)≤70 µs
Write Latency (4K, QD1)≤15 µs
NAND TechnologyMicron 3D TLC NAND
Endurance (TBW)56,320 TBW
Drive Writes Per Day (DWPD)1 DWPD (5-year rated)
Power Consumption (Active)≤25 W
Power Consumption (Idle)≤8 W
Power Loss ProtectionYes – capacitor-backed power-loss protection
EncryptionTCG Opal 2.0, AES-256 Self-Encrypting Drive (SED)
Data IntegrityEnd-to-end data path protection (T10 DIF / PI)
Namespace SupportMultiple namespaces; Zoned Namespace (ZNS) capable
Operating Temperature0°C to 70°C
MTBF2,000,000 hours
Dimensions (L × W × H)112.75 mm × 31.5 mm × 7.5 mm
OS / Hypervisor CompatibilityLinux (kernel 5.15+), VMware vSphere 8.x, Windows Server 2022

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.

Technical Specifications

BrandMicron
CategoryEnterprise SSDs
SKUMICR-MTFDKCD30T7TJC2BK1DABYY
Part NumberMTFDKCD30T7TJC-2BK1DABYY
ConditionNew
Product Line9650 PRO
Form FactorE3.S 1T (EDSFF)
Capacity30.72 TB
InterfacePCIe Gen 6 x4
ProtocolNVMe 2.0
Sequential Read Throughput>28 GB/s
Sequential Write Throughput>14 GB/s
Random Read IOPS (4K, QD256)Up to 7,000,000 IOPS
Random Write IOPS (4K, QD256)Up to 3,500,000 IOPS
Read Latency (4K, QD1)≤70 µs
Write Latency (4K, QD1)≤15 µs
NAND TechnologyMicron 3D TLC NAND
Endurance (TBW)56,320 TBW
Drive Writes Per Day (DWPD)1 DWPD (5-year rated)
Power Consumption (Active)≤25 W
Power Consumption (Idle)≤8 W
Power Loss ProtectionYes – capacitor-backed power-loss protection
EncryptionTCG Opal 2.0, AES-256 Self-Encrypting Drive (SED)
Data IntegrityEnd-to-end data path protection (T10 DIF / PI)
Namespace SupportMultiple namespaces; Zoned Namespace (ZNS) capable
Operating Temperature0°C to 70°C
MTBF2,000,000 hours
Dimensions (L × W × H)112.75 mm × 31.5 mm × 7.5 mm
OS / Hypervisor CompatibilityLinux (kernel 5.15+), VMware vSphere 8.x, Windows Server 2022

Frequently Asked Questions about Micron 9650 PRO NVMe SSD (E3.S 30.72TB)

What does the Micron 9650 PRO NVMe SSD (E3.S 30.72TB) do?

the Micron 9650 PRO NVMe SSD (E3.S 30.72TB) suits enterprise data-center storage tiers — all-flash arrays, hyperconverged storage pools (vSAN, Ceph), database backends, and high-throughput backup repositories. It is supported by major server platforms.

What are the headline specs of the Micron 9650 PRO NVMe SSD (E3.S 30.72TB)?

Key specifications for the Micron 9650 PRO NVMe SSD (E3.S 30.72TB): new condition; manufacturer Micron; product line 9650 PRO; form factor E3.S 1T (EDSFF); capacity 30.72 TB; interface PCIe Gen 6 x4; protocol NVMe 2.0. Manufacturer part number MTFDKCD30T7TJC-2BK1DABYY. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.