Micron 7450 PRO 3.84TB E1.S NVMe SSD

Micron 7450 PRO 3.84TB E1.S NVMe SSD

Brand: Micron | Category: Enterprise SSDs

SKU: MICR-MTFDKBG3T8TFR1BC1ZABYY | Part #: MTFDKBG3T8TFR-1BC1ZABYY | MPN: MTFDKBG3T8TFR-1BC1ZABYY

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About the Micron 7450 PRO 3.84TB E1.S NVMe SSD

The Micron 7450 PRO 3.84TB E1.S is an enterprise-grade NVMe SSD built on Micron's 176-layer TLC 3D NAND and paired with the NVMe 1.4 protocol over a PCIe Gen 4 x4 host interface. Housed in the E1.S 9.5mm EDSFF (Enterprise and Data Center SSD Form Factor) chassis, this drive is purpose-engineered for high-density hyperscale and cloud server deployments where rack-level storage capacity must be maximized without sacrificing per-drive performance. The controller architecture delivers consistent read-heavy mixed-workload performance, making the 7450 PRO a mature, production-proven component in modern disaggregated storage and composable infrastructure designs.

The 7450 PRO 3.84TB sustains sequential read throughput of up to 6,800 MB/s and sequential write throughput of up to 4,000 MB/s, while delivering up to 1,000,000 random read IOPS and 180,000 random write IOPS under steady-state conditions. End-to-end data path protection, power-loss protection circuitry, and hardware-based AES 256-bit encryption (with TCG Opal 2.01 and TCG Enterprise SSC support) address enterprise data integrity and security requirements. The drive carries a rated endurance of 7,008 TBW and a 1 DWPD rating across a five-year operational period, positioning it for read-intensive and mixed-workload environments such as database reads, analytics, and content serving.

The E1.S form factor enables significantly higher storage density per rack unit compared to traditional 2.5-inch U.2 drives, aligning with the EDSFF ecosystem adopted by major brands and hyperscale operators for next-generation server platforms. Operating within a 12W maximum power envelope, the 7450 PRO balances performance per watt for thermally constrained deployments. Micron's Flexible Data Placement (FDP) and NVMe Namespace support provide the software-defined storage flexibility that modern orchestration environments and cloud-native workloads increasingly require.

Ideal for

  • High-density hyperscale server storage pools requiring maximized capacity per rack unit via EDSFF chassis designs
  • Read-intensive relational and NoSQL database acceleration where consistent low-latency random read IOPS are critical
  • Cloud-native object storage and content delivery back-ends demanding high sequential throughput with efficient power consumption
  • AI and machine learning data pipeline staging, where large training datasets must be ingested at sustained high sequential read bandwidth
  • Virtualized server infrastructure running multiple storage-heavy VMs or containers that benefit from high random IOPS and namespace isolation
  • Enterprise analytics and data warehouse appliances requiring durable mixed-read workload endurance with hardware-enforced data security

Technical specifications

ManufacturerMicron
Manufacturer Part NumberMTFDKBG3T8TFR-1BC1ZABYY
Product Series7450 PRO
Capacity3.84 TB
Form FactorE1.S 9.5mm (EDSFF)
Interface ProtocolNVMe 1.4
Host InterfacePCIe Gen 4 x4
NAND Technology176-layer TLC 3D NAND
Sequential Read Throughput6,800 MB/s
Sequential Write Throughput4,000 MB/s
Random Read IOPS (4K)1,000,000 IOPS
Random Write IOPS (4K)180,000 IOPS
Endurance (TBW)7,008 TBW
Endurance (DWPD)1 DWPD (5-year rated period)
Power – Active (Max)12 W
Hardware EncryptionAES 256-bit; TCG Opal 2.01; TCG Enterprise SSC
Power Loss ProtectionYes
End-to-End Data ProtectionYes (T10 DIF / PI compatible)
Operating Temperature0°C to 70°C
Mean Time Between Failures (MTBF)2,000,000 hours

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.

Technical Specifications

BrandMicron
CategoryEnterprise SSDs
SKUMICR-MTFDKBG3T8TFR1BC1ZABYY
Part NumberMTFDKBG3T8TFR-1BC1ZABYY
ConditionNew
Manufacturer Part NumberMTFDKBG3T8TFR-1BC1ZABYY
Product Series7450 PRO
Capacity3.84 TB
Form FactorE1.S 9.5mm (EDSFF)
Interface ProtocolNVMe 1.4
Host InterfacePCIe Gen 4 x4
NAND Technology176-layer TLC 3D NAND
Sequential Read Throughput6,800 MB/s
Sequential Write Throughput4,000 MB/s
Random Read IOPS (4K)1,000,000 IOPS
Random Write IOPS (4K)180,000 IOPS
Endurance (TBW)7,008 TBW
Endurance (DWPD)1 DWPD (5-year rated period)
Power – Active (Max)12 W
Hardware EncryptionAES 256-bit; TCG Opal 2.01; TCG Enterprise SSC
Power Loss ProtectionYes
End-to-End Data ProtectionYes (T10 DIF / PI compatible)
Operating Temperature0°C to 70°C
Mean Time Between Failures (MTBF)2,000,000 hours