Brand: Micron | Category: Enterprise SSDs
SKU: MICR-MTFDKCC61T4HG1BK1DABYY | Part #: MTFDKCC61T4HG-1BK1DABYY | MPN: MTFDKCC61T4HG-1BK1DABYY
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The Micron 6550 ION NVMe SSD represents a landmark achievement in high-density enterprise storage, combining Micron's advanced 232-layer QLC (Quad-Level Cell) NAND technology with the compact E3.S 1T form factor to deliver 61.44TB of usable capacity in a single drive. Engineered for the hyperscale and enterprise data center, the 6550 ION leverages Micron's proprietary ION architecture to maximize areal density while maintaining the PCIe 4.0 x4 NVMe interface performance characteristics required for large sequential read workloads. The drive's low power envelope relative to its capacity makes it uniquely suited for rack-level deployments where thermal and power budgets constrain achievable storage density.
The 6550 ION is purpose-built for read-intensive and capacity-optimized workloads that define modern AI infrastructure. AI training pipelines, large language model (LLM) data ingestion, genomics repositories, media asset archives, and telemetry data lakes all demand the combination of high sequential throughput and extreme raw capacity that this drive provides. The E3.S form factor itself is an industry-standard EDSFF (Enterprise and Datacenter Standard Form Factor) specification, enabling higher drive counts per 1U tray compared to legacy 2.5-inch U.2 designs, directly multiplying achievable petabyte-scale density within standard rack footprints.
Micron's end-to-end vertical integration — manufacturing both the NAND flash and the NVMe controller — allows the 6550 ION to undergo exhaustive qualification for data integrity features including end-to-end data path protection, power loss protection circuitry, and advanced NAND management algorithms optimized for QLC longevity under sustained sequential write pressure. The drive supports NVMe 1.4 command sets, namespace management, and TCG Opal 2.0 encryption, meeting enterprise security and manageability requirements for regulated industries and hyperscale operators alike.
| Manufacturer | Micron |
| Product Family | Micron 6550 ION |
| Form Factor | E3.S 1T (EDSFF) |
| Capacity | 61.44 TB |
| NAND Technology | Micron 232-Layer QLC (Quad-Level Cell) 3D NAND |
| Interface | PCIe 4.0 x4, NVMe 1.4 |
| Sequential Read Throughput | Up to 7,000 MB/s |
| Sequential Write Throughput | Up to 3,500 MB/s |
| Random Read IOPS (4K) | Up to 1,500,000 IOPS |
| Random Write IOPS (4K) | Up to 200,000 IOPS |
| Endurance (TBW) | Up to 12,288 TBW |
| Drive Write Per Day (DWPD) | 0.58 DWPD over 5-year operational life |
| Power Consumption (Active Read) | Up to 25 W |
| Power Consumption (Active Write) | Up to 25 W |
| Power Consumption (Idle) | Approximately 10 W |
| Data Security | TCG Opal 2.0 Self-Encrypting Drive (SED); AES-256 encryption |
| Data Integrity | End-to-end data path protection (T10 PI); LDPC ECC; Power Loss Protection (PLP) |
| NVMe Features | Namespaces, Streams, Command Queuing (up to 64 queues, 64K commands per queue), Telemetry Log, Sanitize |
| Operating Temperature | 0°C to 70°C |
| Shock | 1500 G / 0.5 ms |
| Vibration (Operating) | 5–800 Hz, 2.17 Grms |
| Connector | PCIe E3.S Gen-Z/SFF-TA-1009 compliant |
| Dimensions (L × W × H) | 112.75 mm × 31.5 mm × 7.5 mm (1T thickness) |
| Launch | 2025 Q3 |
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| Brand | Micron |
| Category | Enterprise SSDs |
| SKU | MICR-MTFDKCC61T4HG1BK1DABYY |
| Part Number | MTFDKCC61T4HG-1BK1DABYY |
| Condition | New |
| Product Family | Micron 6550 ION |
| Form Factor | E3.S 1T (EDSFF) |
| Capacity | 61.44 TB |
| NAND Technology | Micron 232-Layer QLC (Quad-Level Cell) 3D NAND |
| Interface | PCIe 4.0 x4, NVMe 1.4 |
| Sequential Read Throughput | Up to 7,000 MB/s |
| Sequential Write Throughput | Up to 3,500 MB/s |
| Random Read IOPS (4K) | Up to 1,500,000 IOPS |
| Random Write IOPS (4K) | Up to 200,000 IOPS |
| Endurance (TBW) | Up to 12,288 TBW |
| Drive Write Per Day (DWPD) | 0.58 DWPD over 5-year operational life |
| Power Consumption (Active Read) | Up to 25 W |
| Power Consumption (Active Write) | Up to 25 W |
| Power Consumption (Idle) | Approximately 10 W |
| Data Security | TCG Opal 2.0 Self-Encrypting Drive (SED); AES-256 encryption |
| Data Integrity | End-to-end data path protection (T10 PI); LDPC ECC; Power Loss Protection (PLP) |
| NVMe Features | Namespaces, Streams, Command Queuing (up to 64 queues, 64K commands per queue), Telemetry Log, Sanitize |
| Operating Temperature | 0°C to 70°C |
| Shock | 1500 G / 0.5 ms |
| Vibration (Operating) | 5–800 Hz, 2.17 Grms |
| Connector | PCIe E3.S Gen-Z/SFF-TA-1009 compliant |
| Dimensions (L × W × H) | 112.75 mm × 31.5 mm × 7.5 mm (1T thickness) |
| Launch | 2025 Q3 |
the Micron 6550 ION NVMe SSD (E3.S 61.44TB) suits enterprise data-center storage tiers — all-flash arrays, hyperconverged storage pools (vSAN, Ceph), database backends, and high-throughput backup repositories. It is supported by major server platforms.
the Micron 6550 ION NVMe SSD (E3.S 61.44TB) suits enterprise data-center storage tiers — all-flash arrays, hyperconverged storage pools (vSAN, Ceph), database backends, and high-throughput backup repositories. It is supported by major server platforms.
Key specifications for the Micron 6550 ION NVMe SSD (E3.S 61.44TB): new condition; manufacturer Micron; product family Micron 6550 ION; form factor E3.S 1T (EDSFF); capacity 61.44 TB; nand technology Micron 232-Layer QLC (Quad-Level Cell) 3D NAND; interface PCIe 4.0 x4, NVMe 1.4. Manufacturer part number MTFDKCC61T4HG-1BK1DABYY. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.
Key specifications for the Micron 6550 ION NVMe SSD (E3.S 61.44TB): new condition; manufacturer Micron; product family Micron 6550 ION; form factor E3.S 1T (EDSFF); capacity 61.44 TB; nand technology Micron 232-Layer QLC (Quad-Level Cell) 3D NAND; interface PCIe 4.0 x4, NVMe 1.4. Manufacturer part number MTFDKCC61T4HG-1BK1DABYY. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.