Micron 16GB DDR4 RDIMM - DDR4

Brand: Micron | Category: Memory (RAM)

SKU: MTA18ASF2G72HZ-2G6E1 | Part #: MTA18ASF2G72HZ-2G6E1 | MPN: MTA18ASF2G72HZ-2G6E1

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Registered DDR4 memory designed for mission-critical server environments demands careful attention to rank configuration and error correction architecture before any other specification is evaluated. The Micron 16GB DDR4 RDIMM, part number MTA18ASF2G72HZ-2G6E1, arrives as a dual-rank, x8 organised module built on the JEDEC DDR4 RDIMM standard—a distinction that immediately signals compatibility with two-socket and higher-core-count Xeon platforms, rather than single-socket or consumer-grade systems. This is the module choice for infrastructure teams provisioning memory into standardised data-centre refresh cycles, not a component for workstation upgrades or edge computing.

The dual-rank (2Rx8) organisation means each 16GB module presents itself to the memory controller as two logical 8GB ranks, distributing electrical load across the memory bus and improving signal integrity under sustained load. Micron engineered this layout specifically to reduce voltage stress at 1.2V nominal—the standard JEDEC operating voltage for DDR4—while maintaining compatibility with the full installed-base of registered DIMM slots found in enterprise servers. The 288-pin configuration and low-profile mechanical form factor ensure you can populate high-density memory configurations without thermal interference from CPU coolers or top-mounted power delivery modules. A systems administrator evaluating memory for a 24-DIMM dual-socket platform will immediately recognise this rank structure as the safe, validated choice for production workloads.

Running at 2666 MT/s (marketed as PC4-21300 by Micron), the module delivers sufficient throughput for memory-bound applications—database engines, in-memory analytics, and virtualisation hypervisors—without the power and thermal penalties associated with higher-frequency DDR4 variants. The CAS latency of 19 cycles (19-19-19 timing) is neither aggressive nor conservative; it reflects a design optimisation for reliability over peak single-threaded performance. Error correction code (ECC) support is built into the module architecture at the x8 device level, enabling single-device data correction (SDDC). This means a bit error within any individual DRAM chip can be detected and corrected on-the-fly without triggering a system fault or memory error interrupt. For a storage architect planning a SAN controller upgrade or an AI infrastructure engineer deploying training nodes, this ECC capability transforms memory from a speed component into a reliability component—critical when downtime costs exceed component replacement costs by orders of magnitude.

The electrical and thermal envelope of the MTA18ASF2G72HZ-2G6E1 reflects Micron's engineering for sustainable data-centre operation. The module operates across 0°C to 85°C, a range that accommodates both chilled and warm-aisle deployment strategies common in modern facilities. The 1.2V supply requirement aligns with standard server power delivery rails, eliminating the need for auxiliary voltage regulators or platform modifications. Micron's compliance with JEDEC DDR4 RDIMM standards means qualification against this part number extends across Xeon Scalable generations—third-gen, fourth-gen, and fifth-gen platforms from Intel, and equivalent EPYC generations from AMD, provided the platform supports registered DIMMs. This is not a component requiring validation spreadsheets per unique platform SKU; instead, it sits within the validated material list for thousands of deployed systems already running in production.

Omnixon Global maintains inventory and supply continuity for the Micron MTA18ASF2G72HZ-2G6E1 across data-centre and enterprise refresh cycles throughout the GCC, Asia-Pacific, and European regions. As a B2B distributor embedded in the region's infrastructure supply chain, we understand the qualified-parts discipline required in server memory procurement and the lead-time sensitivity that accompanies memory allocation shortages. Whether your requirement stems from a scheduled refresh, a capacity expansion, or failure replacement under warranty, we support project timelines with competitive allocation and technical verification. Contact our sales team to discuss your memory architecture and submit an RFQ for volume pricing tailored to your infrastructure deployment schedule.

Performance and Compatibility Specifications

• Dual-rank, x8 organisation (2Rx8) optimised for two-socket and multi-socket Xeon platforms with registered DIMM support
• 16GB capacity per module; 288-pin RDIMM form factor with low-profile mechanical clearance for dense blade and 2U server deployments
• DDR4-2666 MT/s (PC4-21300) with CAS latency 19-19-19, engineered for reliability-first applications including virtualisation, databases, and in-memory analytics
• Full ECC support with single-device data correction (SDDC) at the x8 device level, enabling transparent bit-error recovery without system interruption
• 1.2V nominal supply voltage and 0°C to 85°C operating temperature range compatible with standard data-centre power delivery and thermal strategies
• Micron MTA18ASF2G72HZ-2G6E1 part number qualified against JEDEC DDR4 RDIMM standard, validated across Intel Xeon Scalable and AMD EPYC platforms
• 144-bit bus width (128-bit data + 16-bit ECC) enabling error correction without performance overhead or capacity loss