Kioxia LC9 Series 245.76TB QLC NVMe SSD (E3.L)

The Kioxia LC9 Series 245.76TB QLC NVMe SSD represents a landmark achievement in single-device storage density, packaged in the E3.L (9.5mm) form factor standardized for high-capacity datacenter deployments. Built on Kioxia's advanced BiCS FLASH QLC (Quad-Level Cell) 3D NAND technology, the LC9 integrates multiple NAND die stacks with a high-performance NVMe controller capable of managing the enormous logical block space while sustaining throughput and endurance characteristics appropriate for read-intensive and capacity-optimized enterprise workloads. The E3.L form factor provides a substantially larger PCB footprint than M.2 or U.2, enabling the integration of sufficient NAND packages to reach the 245.76TB capacity point without resorting to multi-device aggregation, thereby reducing complexity and power overhead at the rack level.

The LC9 is architected for sequential read-dominant workflows where capacity density per rack unit is the primary optimization axis. Kioxia's internal ECC and data refresh algorithms are tuned to extend QLC NAND endurance beyond typical consumer-grade QLC deployments, while an integrated SLC write cache tier absorbs burst write activity and smooths latency variance during mixed workloads. NVMe over PCIe Gen 5 connectivity ensures the interface does not become a bottleneck, delivering multi-gigabyte-per-second sequential throughput commensurate with the drive's capacity class. Power management features include configurable power states and thermal throttling profiles that allow operators to optimize for sustained throughput or acoustic and thermal constraints within dense enclosures.

Launched in Q1 2026, the LC9 245.76TB targets hyperscale operators, cloud service providers, and enterprise AI infrastructure teams building petabyte-scale data lakes, unstructured data repositories, and cold-to-warm storage tiers. By consolidating what previously required arrays of multiple smaller drives into a single E3.L module, operators achieve meaningful reductions in slot count, cabling, controller overhead, and power-per-terabyte metrics. The drive is compatible with standard E3.L host platforms and NVMe management tooling, supporting NVMe-MI for out-of-band telemetry, SMART health reporting, and namespace management features essential for large-scale fleet operations.

Ideal for

• AI and machine learning data lake storage, consolidating training datasets, checkpoints, and feature stores into the fewest possible drive slots per rack to maximize GPU-to-storage ratio
• Hyperscale cold and warm object storage tiers where per-terabyte power efficiency and physical slot density directly reduce datacenter TCO at petabyte scale
• Media and entertainment deep archive repositories storing raw 8K and HDR production assets with high sequential read throughput for rapid editorial retrieval
• Genomics and life sciences research platforms requiring dense, fast-access storage for reference genome libraries, variant call databases, and multi-patient sequencing pipelines
• Log analytics and cybersecurity telemetry ingestion where months of full-fidelity event data must reside on accessible NVMe-class storage rather than tape or object cold tiers
• HPC scratch and intermediate dataset storage where consolidating node-local or shared NVMe capacity into fewer, higher-density modules reduces fabric port consumption and management overhead

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.