Huawei Ascend 910B AI Accelerator Card

Huawei Ascend 910B AI Accelerator Card

Brand: Huawei | Category: GPUs

SKU: HUAW-02313TJP | Part #: 02313TJP | MPN: 02313TJP

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About the Huawei Ascend 910B AI Accelerator Card

The Huawei Ascend 910B represents the pinnacle of indigenous Chinese AI acceleration technology, engineered for datacenter-scale machine learning workloads. Built on advanced process technology, the 910B integrates 64GB of high-bandwidth HBM2e memory supporting up to 1.2TB/s memory bandwidth, enabling efficient training of ultra-large language models and vision transformers. The processor architecture incorporates Huawei's proprietary tensor computation cores optimized for mixed-precision operations (FP32, FP16, INT8), delivering 1,024 TFLOPS peak performance in single-precision compute. Its unified memory hierarchy and on-chip interconnect enable efficient distributed training across multi-card configurations.

The 910B is positioned for enterprise AI infrastructure modernization within heavily regulated computational environments and organizations prioritizing domestic semiconductor supply chains. The accelerator integrates seamlessly with Huawei's MindSpore deep learning framework and CANN (Compute Architecture for Neural Networks) software stack, optimizing end-to-end training and inference pipelines. Its 310W thermal design power with vapor-chamber cooling enables dense datacenter deployment while maintaining thermal stability across sustained workloads.

Launched in Q4 2023, the Ascend 910B addresses critical demand for high-performance AI compute capacity amid evolving global semiconductor trade dynamics. The card supports PCIe 5.0 interconnect for host system integration and features enhanced reliability mechanisms including error-correcting codes, redundancy checking, and comprehensive health monitoring telemetry.

Ideal for

  • Large language model (LLM) training and fine-tuning for Chinese-language foundation models with 100B+ parameters
  • Distributed deep learning inference serving for recommendation systems, NLP, and computer vision across enterprise datacenters
  • Multimodal model development combining text, image, and video processing at scale
  • Genomics and scientific computing simulation requiring high-bandwidth memory access and tensor parallelism
  • Financial risk modeling and algorithmic trading strategy backtesting on proprietary datasets
  • Autonomous systems and robotics perception pipeline acceleration for real-time decision-making

Technical specifications

ManufacturerHuawei
ModelAscend 910B
Product CategoryAI Accelerator Card
Launch QuarterQ4 2023
Peak FP32 Performance1024 TFLOPS
Peak FP16 Performance2048 TFLOPS
Peak INT8 Performance4096 TOPS
Memory TypeHBM2e
Memory Capacity64GB
Memory Bandwidth1.2TB/s
Memory Error CorrectionFull ECC support
Tensor CoresMultiple specialized compute clusters with mixed-precision support
Interconnect InterfacePCIe 5.0 x16
Multi-Card ConnectivityHuawei HiLink proprietary inter-accelerator fabric with NVSwitch-class bandwidth
Thermal Design Power310W
Cooling SolutionVapor-chamber with high-performance thermal interface
Operating Temperature Range0°C to 50°C
Form FactorFull-height, full-length PCIe card
Software FrameworkMindSpore, CANN (Compute Architecture for Neural Networks)
Supported Precision FormatsFP32, FP16, BF16, INT8, INT16
Max Power Consumption350W (peak transient)
System Requirementsx86 or ARM host with PCIe 5.0 slot and proper airflow

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.

Technical Specifications

BrandHuawei
CategoryGPUs
SKUHUAW-02313TJP
Part Number02313TJP
ConditionNew
ModelAscend 910B
Product CategoryAI Accelerator Card
Launch QuarterQ4 2023
Peak FP32 Performance1024 TFLOPS
Peak FP16 Performance2048 TFLOPS
Peak INT8 Performance4096 TOPS
Memory TypeHBM2e
Memory Capacity64GB
Memory Bandwidth1.2TB/s
Memory Error CorrectionFull ECC support
Tensor CoresMultiple specialized compute clusters with mixed-precision support
Interconnect InterfacePCIe 5.0 x16
Multi-Card ConnectivityHuawei HiLink proprietary inter-accelerator fabric with NVSwitch-class bandwidth
Thermal Design Power310W
Cooling SolutionVapor-chamber with high-performance thermal interface
Operating Temperature Range0°C to 50°C
Form FactorFull-height, full-length PCIe card
Software FrameworkMindSpore, CANN (Compute Architecture for Neural Networks)
Supported Precision FormatsFP32, FP16, BF16, INT8, INT16
Max Power Consumption350W (peak transient)
System Requirementsx86 or ARM host with PCIe 5.0 slot and proper airflow