HPE ProLiant Compute DL384 Gen12 with NVIDIA GH200

HPE ProLiant Compute DL384 Gen12 with NVIDIA GH200

Brand: HPE | Category: Servers

SKU: HPE-P65820B21 | Part #: P65820-B21 | MPN: P65820-B21

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About the HPE ProLiant Compute DL384 Gen12 with NVIDIA GH200

The HPE ProLiant Compute DL384 Gen12 represents HPE's next-generation GPU-dense rack server platform, purpose-built to harness the transformative compute density of NVIDIA GH200 Grace Hopper Superchips. Each GH200 Superchip integrates a 72-core NVIDIA Grace Arm-based CPU with a Hopper-architecture H100 GPU through NVLink-C2C interconnect delivering 900 GB/s of chip-to-chip bandwidth, effectively collapsing the traditional CPU-to-GPU memory bottleneck. The DL384 Gen12 accommodates multiple GH200 modules within a 4U chassis footprint, enabling organizations to deploy extreme AI compute density per rack unit while leveraging HPE's enterprise-grade reliability, serviceability, and systems management ecosystem.

Targeted at enterprises, cloud service providers, national laboratories, and AI-native organizations, the DL384 Gen12 excels at workloads demanding massive memory bandwidth and tightly coupled CPU-GPU compute. Each GH200 Superchip exposes up to 96 GB of HBM3 GPU memory alongside up to 480 GB of LPDDR5X CPU memory, all accessible to the GPU across NVLink-C2C at unprecedented bandwidth. This unified memory architecture eliminates traditional PCIe bottlenecks and enables model parallelism across trillion-parameter large language models (LLMs) without memory-capacity constraints that plague conventional discrete GPU designs. Multi-node NVLink configurations via NVLink Switch further scale collective operations across DGX SuperPOD-style deployments.

From a platform management perspective, the DL384 Gen12 integrates HPE's iLO 7 Baseboard Management Controller with NVIDIA's GPU Telemetry Infrastructure, providing unified health monitoring, firmware lifecycle management, and AI-optimized thermal controls. HPE's high-density direct liquid cooling (DLC) options address the substantial thermal design power of the GH200 modules, supporting data center deployments transitioning from air to hybrid or fully liquid-cooled infrastructure. Full integration with HPE GreenLake for Compute Ops Management enables cloud-consistent operations, predictive analytics, and automated remediation across on-premises AI clusters.

Ideal for

  • Training and fine-tuning large language models and multimodal foundation models with trillion-scale parameter counts requiring terabytes of aggregate GPU-accessible memory
  • High-throughput generative AI inference serving for enterprise LLM deployments where low-latency token generation at scale demands maximum memory bandwidth per accelerator
  • Molecular dynamics simulation, quantum chemistry, and computational fluid dynamics workloads in life sciences and engineering that benefit from the Grace CPU's memory capacity paired with Hopper GPU compute
  • Seismic imaging and reservoir simulation in energy sector applications requiring sustained FP64 double-precision throughput at scale
  • AI-accelerated genomics pipelines combining rapid CPU-side bioinformatics preprocessing with GPU-accelerated deep learning variant calling and protein structure prediction
  • National laboratory and academic HPC clusters running mixed precision scientific computing that demands both high MPI performance from the Grace CPU mesh interconnect and Tensor Core acceleration for AI-enhanced simulations

Technical specifications

ManufacturerHPE
Product LineHPE ProLiant Compute DL384 Gen12
Form Factor4U Rack Server
Accelerator ArchitectureNVIDIA GH200 Grace Hopper Superchip
GPU ArchitectureNVIDIA Hopper (H100 GPU die)
CPU Architecture per SuperchipNVIDIA Grace, 72-core Arm Neoverse V2
CPU-GPU InterconnectNVLink-C2C, 900 GB/s bidirectional bandwidth per Superchip
GPU Memory per Superchip96 GB HBM3
CPU Memory per SuperchipUp to 480 GB LPDDR5X
GPU Memory BandwidthUp to 4.0 TB/s HBM3 per GH200 Superchip
FP8 Tensor Core PerformanceUp to 2,000 TFLOPS per GH200 Superchip
FP16 / BF16 Tensor Core PerformanceUp to 1,000 TFLOPS per GH200 Superchip
FP64 PerformanceUp to 67 TFLOPS per GH200 Superchip
Inter-GPU ConnectivityNVLink 4.0 / NVLink Switch support for multi-node scale-out
PCIe GenerationPCIe 5.0
Network I/OUp to 400 GbE or NDR InfiniBand via OCP 3.0 and PCIe 5.0 slots; NVIDIA ConnectX-7 or BlueField-3 DPU options
Storage OptionsNVMe Gen5 U.2/E3.S front-accessible drive bays; support for HPE NS204i-u Boot Device
Cooling OptionsHigh-performance fans (air-cooled); Direct Liquid Cooling (DLC) rear-door heat exchanger and warm-water direct-to-chip loop support
Power SupplyRedundant high-efficiency Titanium-rated PSUs; per-chassis wattage scales with GH200 module count and TDP
Systems ManagementHPE iLO 7 BMC with NVIDIA GPU Telemetry integration; HPE GreenLake Compute Ops Management
Operating System SupportUbuntu 22.04/24.04 LTS, Red Hat Enterprise Linux 9.x, SUSE Linux Enterprise Server 15 SP5+
Software EcosystemNVIDIA AI Enterprise, CUDA 12.x, cuDNN, TensorRT-LLM, NCCL, OpenMPI, HPE Performance Cluster Manager
Chassis Dimensions4U; standard 19-inch EIA rack compatible
Launch GenerationGen12 (2025-Q3)

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.

Technical Specifications

BrandHPE
CategoryServers
SKUHPE-P65820B21
Part NumberP65820-B21
ConditionNew
Product LineHPE ProLiant Compute DL384 Gen12
Form Factor4U Rack Server
Accelerator ArchitectureNVIDIA GH200 Grace Hopper Superchip
GPU ArchitectureNVIDIA Hopper (H100 GPU die)
CPU Architecture per SuperchipNVIDIA Grace, 72-core Arm Neoverse V2
CPU-GPU InterconnectNVLink-C2C, 900 GB/s bidirectional bandwidth per Superchip
GPU Memory per Superchip96 GB HBM3
CPU Memory per SuperchipUp to 480 GB LPDDR5X
GPU Memory BandwidthUp to 4.0 TB/s HBM3 per GH200 Superchip
FP8 Tensor Core PerformanceUp to 2,000 TFLOPS per GH200 Superchip
FP16 / BF16 Tensor Core PerformanceUp to 1,000 TFLOPS per GH200 Superchip
FP64 PerformanceUp to 67 TFLOPS per GH200 Superchip
Inter-GPU ConnectivityNVLink 4.0 / NVLink Switch support for multi-node scale-out
PCIe GenerationPCIe 5.0
Network I/OUp to 400 GbE or NDR InfiniBand via OCP 3.0 and PCIe 5.0 slots; NVIDIA ConnectX-7 or BlueField-3 DPU options
Storage OptionsNVMe Gen5 U.2/E3.S front-accessible drive bays; support for HPE NS204i-u Boot Device
Cooling OptionsHigh-performance fans (air-cooled); Direct Liquid Cooling (DLC) rear-door heat exchanger and warm-water direct-to-chip loop support
Power SupplyRedundant high-efficiency Titanium-rated PSUs; per-chassis wattage scales with GH200 module count and TDP
Systems ManagementHPE iLO 7 BMC with NVIDIA GPU Telemetry integration; HPE GreenLake Compute Ops Management
Operating System SupportUbuntu 22.04/24.04 LTS, Red Hat Enterprise Linux 9.x, SUSE Linux Enterprise Server 15 SP5+
Software EcosystemNVIDIA AI Enterprise, CUDA 12.x, cuDNN, TensorRT-LLM, NCCL, OpenMPI, HPE Performance Cluster Manager
Chassis Dimensions4U; standard 19-inch EIA rack compatible
Launch GenerationGen12 (2025-Q3)

Frequently Asked Questions about HPE ProLiant Compute DL384 Gen12 with NVIDIA GH200

What does the HPE ProLiant Compute DL384 Gen12 with NVIDIA GH200 do?

The HPE ProLiant Compute DL384 Gen12 with NVIDIA GH200 is built for enterprise data-center workloads — virtualization (VMware, Proxmox, Nutanix), private cloud, database hosting, and AI/ML training. It fits standard EIA-310 server racks and supports redundant PSUs and hot-swap drives common in production environments.

What are the headline specs of the HPE ProLiant Compute DL384 Gen12 with NVIDIA GH200?

Key specifications for the HPE ProLiant Compute DL384 Gen12 with NVIDIA GH200: new condition; manufacturer HPE; product line HPE ProLiant Compute DL384 Gen12; form factor 4U Rack Server; accelerator architecture NVIDIA GH200 Grace Hopper Superchip; gpu architecture NVIDIA Hopper (H100 GPU die); cpu architecture per superchip NVIDIA Grace, 72-core Arm Neoverse V2. Manufacturer part number P65820-B21. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.