Brand: HPE | Category: Servers
SKU: HPE-R9G65A | Part #: R9G65A | MPN: R9G65A
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The HPE Cray XD675 is a purpose-built 4U AI accelerator server designed within the Open Compute Project (OCP) Data Center Ready form factor, engineered to support the most demanding large language model (LLM) training, fine-tuning, and high-performance computing workloads. At its core, the XD675 accommodates up to eight NVIDIA H200 SXM5 Tensor Core GPUs interconnected via fifth-generation NVLink, delivering a combined GPU memory capacity of up to 1.12 TB of HBM3e at 3.35 TB/s of aggregate memory bandwidth. This architecture eliminates inter-GPU communication bottlenecks, enabling near-linear scaling across transformer model training tasks that demand rapid gradient synchronization and massive parameter counts.
The XD675 is designed for datacenter-scale deployment within the HPE Cray supercomputer ecosystem, integrating tightly with HPE's high-speed Slingshot 11 interconnect fabric to enable multi-node scaling across thousands of GPU endpoints. Dual fourth-generation AMD EPYC processors provide the CPU compute backbone, supplying ample PCIe Gen 5 lanes, high memory bandwidth, and the I/O throughput necessary to keep eight SXM5 GPUs fully saturated with training data. The server supports up to 6 TB of DDR5 system memory, and its NVMe storage subsystem ensures rapid checkpoint saving and dataset streaming without creating I/O-bound bottlenecks during training runs.
Direct liquid cooling (DLC) is a first-class design element in the XD675, with chassis-integrated cold plates covering both GPUs and CPUs to sustain peak thermal dissipation at datacenter scale without reliance on airflow-intensive hot-aisle containment alone. This approach enables higher rack densities and aligns with modern sustainable datacenter power and cooling strategies. The platform is managed through HPE iLO 6 with integrated Redfish API support, enabling programmatic lifecycle management, telemetry streaming, and integration with HPE GreenLake cloud management services for unified fleet observability across on-premises AI infrastructure.
| Manufacturer | HPE |
| Product Line | HPE Cray XD Series |
| Model | HPE Cray XD675 |
| Form Factor | 4U, OCP Data Center Ready (DCR) form factor |
| GPU Configuration | Up to 8x NVIDIA H200 SXM5 Tensor Core GPUs |
| GPU Interconnect | NVLink 5th Generation, 900 GB/s bidirectional per GPU pair |
| GPU Memory (Total) | Up to 1.12 TB HBM3e (8x 141 GB per GPU) |
| GPU Memory Bandwidth (Aggregate) | Up to 3.35 TB/s aggregate across all 8 GPUs |
| CPU | Dual 4th Gen AMD EPYC processors (Genoa) |
| System Memory | Up to 6 TB DDR5, 12x DIMM slots per processor (24 slots total) |
| PCIe Generation | PCIe Gen 5 |
| Network Fabric | HPE Slingshot 11 (200 Gb/s per port), supports multi-rail configurations |
| Host Fabric Interface | Up to 4x HPE Slingshot NIC (200 Gb/s) for GPU-direct RDMA |
| Internal Storage | Up to 4x NVMe M.2 SSD (boot) + front-accessible NVMe U.2 drive bays |
| Cooling Technology | Direct Liquid Cooling (DLC) with integrated GPU and CPU cold plates; supplementary airflow fans |
| Power Supply | Redundant high-efficiency (Titanium) PSUs; supports high-density rack PDU integration |
| Management | HPE iLO 6 with Redfish API, IPMI 2.0, HPE GreenLake cloud integration |
| Operating System Support | Red Hat Enterprise Linux, SUSE Linux Enterprise Server, Ubuntu, CentOS Stream |
| AI Software Stack | Compatible with NVIDIA AI Enterprise, CUDA 12.x, cuDNN, NCCL, PyTorch, TensorFlow, JAX |
| Security | HPE Silicon Root of Trust, Secure Boot, TPM 2.0, encrypted storage support |
| Chassis Dimensions | 4U OCP DCR chassis; rack-optimized for high-density GPU pod configurations |
| Launch | 2025 Q1 |
Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.
| Brand | HPE |
| Category | Servers |
| SKU | HPE-R9G65A |
| Part Number | R9G65A |
| Condition | New |
| Product Line | HPE Cray XD Series |
| Model | HPE Cray XD675 |
| Form Factor | 4U, OCP Data Center Ready (DCR) form factor |
| GPU Configuration | Up to 8x NVIDIA H200 SXM5 Tensor Core GPUs |
| GPU Interconnect | NVLink 5th Generation, 900 GB/s bidirectional per GPU pair |
| GPU Memory (Total) | Up to 1.12 TB HBM3e (8x 141 GB per GPU) |
| GPU Memory Bandwidth (Aggregate) | Up to 3.35 TB/s aggregate across all 8 GPUs |
| CPU | Dual 4th Gen AMD EPYC processors (Genoa) |
| System Memory | Up to 6 TB DDR5, 12x DIMM slots per processor (24 slots total) |
| PCIe Generation | PCIe Gen 5 |
| Network Fabric | HPE Slingshot 11 (200 Gb/s per port), supports multi-rail configurations |
| Host Fabric Interface | Up to 4x HPE Slingshot NIC (200 Gb/s) for GPU-direct RDMA |
| Internal Storage | Up to 4x NVMe M.2 SSD (boot) + front-accessible NVMe U.2 drive bays |
| Cooling Technology | Direct Liquid Cooling (DLC) with integrated GPU and CPU cold plates; supplementary airflow fans |
| Power Supply | Redundant high-efficiency (Titanium) PSUs; supports high-density rack PDU integration |
| Management | HPE iLO 6 with Redfish API, IPMI 2.0, HPE GreenLake cloud integration |
| Operating System Support | Red Hat Enterprise Linux, SUSE Linux Enterprise Server, Ubuntu, CentOS Stream |
| AI Software Stack | Compatible with NVIDIA AI Enterprise, CUDA 12.x, cuDNN, NCCL, PyTorch, TensorFlow, JAX |
| Security | HPE Silicon Root of Trust, Secure Boot, TPM 2.0, encrypted storage support |
| Chassis Dimensions | 4U OCP DCR chassis; rack-optimized for high-density GPU pod configurations |
| Launch | 2025 Q1 |
The HPE Cray XD675 AI Accelerator Server is built for enterprise data-center workloads — virtualization (VMware, Proxmox, Nutanix), private cloud, database hosting, and AI/ML training. It fits standard EIA-310 server racks and supports redundant PSUs and hot-swap drives common in production environments.
Key specifications for the HPE Cray XD675 AI Accelerator Server: new condition; manufacturer HPE; product line HPE Cray XD Series; model HPE Cray XD675; form factor 4U, OCP Data Center Ready (DCR) form factor; gpu configuration Up to 8x NVIDIA H200 SXM5 Tensor Core GPUs; gpu interconnect NVLink 5th Generation, 900 GB/s bidirectional per GPU pair. Manufacturer part number R9G65A. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.