Brand: HPE | Category: Servers
SKU: HPE-P67890B21 | Part #: P67890-B21 | MPN: P67890-B21
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The HPE Cray Supercomputing EX4000 System is a purpose-built, liquid-cooled blade chassis infrastructure designed to power the most demanding high-performance computing and large-scale AI training environments. Built on the proven HPE Cray EX architecture and launched in 2025, the EX4000 introduces a higher-density blade form factor with enhanced thermal management via direct liquid cooling, enabling sustained operation of the latest GPU accelerators including NVIDIA H100 and H200 SXM series alongside next-generation AMD Instinct accelerators. The chassis integrates native HPE Slingshot 200Gb/s high-bandwidth, low-latency interconnect fabric, eliminating the need for external top-of-rack switching at the blade level and reducing congestion at scale across tens of thousands of compute nodes.
The EX4000 chassis supports a flexible mix of compute blades, including CPU-only nodes based on AMD EPYC Genoa and Intel Xeon Scalable processors, as well as fully accelerated GPU blades optimized for tensor operations and large language model training. The system's centralized management fabric leverages HPE's Cray System Management (CSM) software stack integrated with HPE Performance Cluster Manager (HPCM), providing unified monitoring, firmware orchestration, and workload scheduling across the entire supercomputing infrastructure. The liquid-cooled design achieves Power Usage Effectiveness (PUE) values approaching 1.03 in optimized data center environments, significantly reducing operational energy overhead compared to air-cooled alternatives.
The EX4000 is engineered for deployment in national laboratories, hyperscale AI research facilities, defense simulation environments, and enterprise HPC clusters requiring exascale-class throughput. Its modular blade and chassis architecture allows incremental scaling from a single cabinet to multi-thousand-node configurations without architectural redesign. Tight integration with HPE's Cray Programming Environment (CPE) and support for industry-standard MPI, OpenMP, CUDA, and ROCm programming models ensures compatibility with existing HPC application portfolios while enabling optimized performance on the latest accelerated compute blades.
| Manufacturer | HPE |
| Product Line | HPE Cray Supercomputing EX Series |
| Model | EX4000 |
| Form Factor | Liquid-cooled blade chassis, cabinet-scale deployment |
| Chassis Blade Slots | Up to 64 compute blade slots per cabinet (configuration-dependent) |
| Supported Blade Types | CPU compute blades (AMD EPYC Genoa/Bergamo, Intel Xeon Scalable 4th/5th Gen), GPU accelerator blades (NVIDIA H100/H200 SXM, AMD Instinct MI300X) |
| GPU Accelerators per Blade | Up to 4 double-wide GPU accelerators per GPU blade |
| CPU Options | AMD EPYC 9004/9005 Series, Intel Xeon Scalable 4th/5th Generation |
| Memory per Blade | Up to 3TB DDR5 ECC RDIMM per CPU blade; up to 2TB HBM3 aggregate per GPU blade |
| Interconnect Fabric | HPE Slingshot 200Gb/s (2x200Gb/s per blade endpoint), low-latency adaptive routing |
| Interconnect Topology | Dragonfly+ with all-to-all high-radix routing, integrated in-chassis Rosetta switch ASICs |
| Interconnect Latency | Sub-500 nanoseconds MPI point-to-point latency |
| Cooling Technology | Direct Liquid Cooling (DLC) with rear-door heat exchanger; facility water inlet temperature up to 45°C supported |
| Power Usage Effectiveness (PUE) | As low as 1.03 in optimized liquid-cooled data center environments |
| Cabinet Power Capacity | Up to 500kW per cabinet (high-density GPU blade configuration) |
| Storage Connectivity | NVMe-oF over Slingshot, PCIe Gen5 local NVMe per blade, integration with HPE Cray ClusterStor E1000 |
| Management Software | HPE Cray System Management (CSM), HPE Performance Cluster Manager (HPCM), Redfish-compliant BMC |
| Programming Environment | HPE Cray Programming Environment (CPE) — supports MPI, OpenMP, SHMEM, CUDA, HIP/ROCm, OpenACC |
| Operating System Support | SUSE Linux Enterprise HPC, Red Hat Enterprise Linux, COS (Cray Operating System) |
| Security | TPM 2.0 per blade, silicon root of trust, FIPS 140-2 compliant cryptographic modules, support for classified/air-gap environments |
| Scalability | From single cabinet to multi-thousand node configurations; linear scaling with Slingshot Dragonfly+ topology |
| Availability | Launched 2025-Q3 |
| Compliance | ENERGY STAR data center infrastructure guidelines, RoHS, CE, FCC Class A, TAA-compliant configurations available |
Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.
| Brand | HPE |
| Category | Servers |
| SKU | HPE-P67890B21 |
| Part Number | P67890-B21 |
| Condition | New |
| Product Line | HPE Cray Supercomputing EX Series |
| Model | EX4000 |
| Form Factor | Liquid-cooled blade chassis, cabinet-scale deployment |
| Chassis Blade Slots | Up to 64 compute blade slots per cabinet (configuration-dependent) |
| Supported Blade Types | CPU compute blades (AMD EPYC Genoa/Bergamo, Intel Xeon Scalable 4th/5th Gen), GPU accelerator blades (NVIDIA H100/H200 SXM, AMD Instinct MI300X) |
| GPU Accelerators per Blade | Up to 4 double-wide GPU accelerators per GPU blade |
| CPU Options | AMD EPYC 9004/9005 Series, Intel Xeon Scalable 4th/5th Generation |
| Memory per Blade | Up to 3TB DDR5 ECC RDIMM per CPU blade; up to 2TB HBM3 aggregate per GPU blade |
| Interconnect Fabric | HPE Slingshot 200Gb/s (2x200Gb/s per blade endpoint), low-latency adaptive routing |
| Interconnect Topology | Dragonfly+ with all-to-all high-radix routing, integrated in-chassis Rosetta switch ASICs |
| Interconnect Latency | Sub-500 nanoseconds MPI point-to-point latency |
| Cooling Technology | Direct Liquid Cooling (DLC) with rear-door heat exchanger; facility water inlet temperature up to 45°C supported |
| Power Usage Effectiveness (PUE) | As low as 1.03 in optimized liquid-cooled data center environments |
| Cabinet Power Capacity | Up to 500kW per cabinet (high-density GPU blade configuration) |
| Storage Connectivity | NVMe-oF over Slingshot, PCIe Gen5 local NVMe per blade, integration with HPE Cray ClusterStor E1000 |
| Management Software | HPE Cray System Management (CSM), HPE Performance Cluster Manager (HPCM), Redfish-compliant BMC |
| Programming Environment | HPE Cray Programming Environment (CPE) — supports MPI, OpenMP, SHMEM, CUDA, HIP/ROCm, OpenACC |
| Operating System Support | SUSE Linux Enterprise HPC, Red Hat Enterprise Linux, COS (Cray Operating System) |
| Security | TPM 2.0 per blade, silicon root of trust, FIPS 140-2 compliant cryptographic modules, support for classified/air-gap environments |
| Scalability | From single cabinet to multi-thousand node configurations; linear scaling with Slingshot Dragonfly+ topology |
| Availability | Launched 2025-Q3 |
| Compliance | ENERGY STAR data center infrastructure guidelines, RoHS, CE, FCC Class A, TAA-compliant configurations available |
The HPE Cray Supercomputing EX4000 System is built for enterprise data-center workloads — virtualization (VMware, Proxmox, Nutanix), private cloud, database hosting, and AI/ML training. It fits standard EIA-310 server racks and supports redundant PSUs and hot-swap drives common in production environments.
Key specifications for the HPE Cray Supercomputing EX4000 System: new condition; manufacturer HPE; product line HPE Cray Supercomputing EX Series; model EX4000; form factor Liquid-cooled blade chassis, cabinet-scale deployment; chassis blade slots Up to 64 compute blade slots per cabinet (configuration-dependent); supported blade types CPU compute blades (AMD EPYC Genoa/Bergamo, Intel Xeon Scalable 4th/5th Gen), GPU accelerator blades (NVIDIA H100/H200 SXM, AMD Instinct MI300X). Manufacturer part number P67890-B21. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.