AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375)

AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375)

Brand: AMD | Category: CPUs

SKU: AMD-100000001370 | Part #: 100-000001370 | MPN: 100-000001370

Contact for Pricing — Request a Quote

Request a Quote Contact Us

About the AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375)

The AMD Ryzen AI PRO 300 Series, led by the Ryzen AI 9 HX PRO 375, is AMD's flagship commercial-grade mobile processor built on the TSMC 4nm 'Zen 5' architecture combined with AMD's latest XDNA 2 NPU engine. Designed specifically for enterprise and commercial notebook deployments, this SoC integrates up to 12 CPU cores (8 Zen 5 + 4 Zen 5c), AMD Radeon 890M integrated graphics, and a dedicated Neural Processing Unit capable of delivering over 50 TOPS of AI inference throughput — meeting and exceeding the Microsoft Copilot+ PC requirements. The heterogeneous compute design ensures that AI inference, graphics rendering, and multi-threaded workloads can run concurrently without resource contention, making it a highly capable all-in-one silicon solution for modern productivity machines.

The PRO designation unlocks a comprehensive suite of enterprise manageability and security features built directly into silicon. AMD PRO Security includes AMD Memory Guard (full-memory encryption), Microsoft Pluton security processor integration, AMD Shadow Stack, and hardware-enforced AMD Secure Boot, collectively hardening the platform against physical and firmware-level attacks. AMD PRO Manageability delivers out-of-band management compatibility with Microsoft Endpoint Manager, AMD Dash (DMTF standard), and major MDM/RMM platforms, enabling IT administrators to remotely manage, provision, and remediate devices at scale without requiring end-user interaction.

The Ryzen AI 9 HX PRO 375 targets AI-augmented enterprise notebooks where local AI inferencing is a primary requirement — supporting Windows Studio Effects, on-device LLM inference, real-time transcription, and ISV AI-accelerated professional applications. The combination of high single-threaded CPU performance from Zen 5 cores, the Radeon 890M RDNA 3.5 iGPU with up to 16 compute units, and the 50+ TOPS XDNA 2 NPU positions this processor as a three-engine AI platform capable of distributing AI workloads intelligently across CPU, GPU, and NPU simultaneously.

Ideal for

  • On-device AI inference for enterprise Copilot+ PC workflows including real-time transcription, live translation, and AI-assisted content generation without cloud dependency
  • Secure remote workforce deployments requiring hardware-encrypted memory, AMD Shadow Stack, and Pluton-based attestation for compliance with enterprise security policies
  • Professional content creation and video collaboration on mobile workstations leveraging Radeon 890M RDNA 3.5 iGPU for hardware-accelerated video encode/decode and display output
  • IT-managed fleet deployments utilizing AMD PRO Manageability, DMTF DASH out-of-band management, and integration with Microsoft Intune and leading MDM platforms
  • Data analytics and business intelligence workflows where local NPU acceleration offloads model inference from cloud, reducing latency and data egress costs for sensitive datasets
  • Healthcare and financial sector notebooks requiring full-memory encryption via AMD Memory Guard and firmware integrity enforcement to meet regulatory data protection mandates

Technical specifications

ManufacturerAMD
Product LineRyzen AI PRO 300 Series
ModelRyzen AI 9 HX PRO 375
CPU ArchitectureAMD Zen 5 + Zen 5c (hybrid core configuration)
Process NodeTSMC 4nm FinFET
Total CPU Cores12 (8 Zen 5 Performance + 4 Zen 5c Efficiency)
Total CPU Threads24
Base Clock (P-Core)Up to 2.0 GHz (configurable TDP-dependent)
Max Boost ClockUp to 5.1 GHz
L3 Cache24 MB AMD 3D Cache (unified last-level cache)
NPU EngineAMD XDNA 2 Architecture
NPU AI Performance50+ TOPS (Tera Operations Per Second)
Combined SoC AI PerformanceUp to 73 TOPS (CPU + GPU + NPU combined)
Integrated GraphicsAMD Radeon 890M (RDNA 3.5 Architecture)
iGPU Compute Units16 Compute Units
iGPU Max Boost FrequencyUp to 2900 MHz
Supported Memory TypeLPDDR5X up to 7500 MT/s
Max Memory Capacity64 GB
Memory ChannelsDual-channel
TDP (Configurable cTDP)15W – 54W
PCIe VersionPCIe 4.0
Display Outputs SupportedUp to 4 simultaneous displays
Security FeaturesAMD Memory Guard (SME full-memory encryption), AMD Secure Boot, AMD Shadow Stack, Microsoft Pluton Security Processor
ManageabilityAMD PRO Manageability — DMTF DASH out-of-band, Microsoft Intune/Endpoint Manager compatible, AMD Dash support
PlatformAMD PRO Platform (commercial-grade ISV certification, extended availability commitment)
Launch PeriodQ4 2024

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.

Technical Specifications

BrandAMD
CategoryCPUs
SKUAMD-100000001370
Part Number100-000001370
ConditionNew
Product LineRyzen AI PRO 300 Series
ModelRyzen AI 9 HX PRO 375
CPU ArchitectureAMD Zen 5 + Zen 5c (hybrid core configuration)
Process NodeTSMC 4nm FinFET
Total CPU Cores12 (8 Zen 5 Performance + 4 Zen 5c Efficiency)
Total CPU Threads24
Base Clock (P-Core)Up to 2.0 GHz (configurable TDP-dependent)
Max Boost ClockUp to 5.1 GHz
L3 Cache24 MB AMD 3D Cache (unified last-level cache)
NPU EngineAMD XDNA 2 Architecture
NPU AI Performance50+ TOPS (Tera Operations Per Second)
Combined SoC AI PerformanceUp to 73 TOPS (CPU + GPU + NPU combined)
Integrated GraphicsAMD Radeon 890M (RDNA 3.5 Architecture)
iGPU Compute Units16 Compute Units
iGPU Max Boost FrequencyUp to 2900 MHz
Supported Memory TypeLPDDR5X up to 7500 MT/s
Max Memory Capacity64 GB
Memory ChannelsDual-channel
TDP (Configurable cTDP)15W – 54W
PCIe VersionPCIe 4.0
Display Outputs SupportedUp to 4 simultaneous displays
Security FeaturesAMD Memory Guard (SME full-memory encryption), AMD Secure Boot, AMD Shadow Stack, Microsoft Pluton Security Processor
ManageabilityAMD PRO Manageability — DMTF DASH out-of-band, Microsoft Intune/Endpoint Manager compatible, AMD Dash support
PlatformAMD PRO Platform (commercial-grade ISV certification, extended availability commitment)
Launch PeriodQ4 2024

Frequently Asked Questions about AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375)

What does the AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375) do?

The AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375) is enterprise IT hardware deployed in production data centers, server rooms, and edge sites across the GCC and EMEA region.

What does the AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375) do?

The AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375) is enterprise IT hardware deployed in production data centers, server rooms, and edge sites across the GCC and EMEA region.

What are the headline specs of the AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375)?

Key specifications for the AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375): new condition; manufacturer AMD; product line Ryzen AI PRO 300 Series; model Ryzen AI 9 HX PRO 375; cpu architecture AMD Zen 5 + Zen 5c (hybrid core configuration); process node TSMC 4nm FinFET; total cpu cores 12 (8 Zen 5 Performance + 4 Zen 5c Efficiency). Manufacturer part number 100-000001370. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.

What are the headline specs of the AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375)?

Key specifications for the AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375): new condition; manufacturer AMD; product line Ryzen AI PRO 300 Series; model Ryzen AI 9 HX PRO 375; cpu architecture AMD Zen 5 + Zen 5c (hybrid core configuration); process node TSMC 4nm FinFET; total cpu cores 12 (8 Zen 5 Performance + 4 Zen 5c Efficiency). Manufacturer part number 100-000001370. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.