Brand: AMD | Category: CPUs
SKU: AMD-100000001370 | Part #: 100-000001370 | MPN: 100-000001370
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The AMD Ryzen AI PRO 300 Series, led by the Ryzen AI 9 HX PRO 375, is AMD's flagship commercial-grade mobile processor built on the TSMC 4nm 'Zen 5' architecture combined with AMD's latest XDNA 2 NPU engine. Designed specifically for enterprise and commercial notebook deployments, this SoC integrates up to 12 CPU cores (8 Zen 5 + 4 Zen 5c), AMD Radeon 890M integrated graphics, and a dedicated Neural Processing Unit capable of delivering over 50 TOPS of AI inference throughput — meeting and exceeding the Microsoft Copilot+ PC requirements. The heterogeneous compute design ensures that AI inference, graphics rendering, and multi-threaded workloads can run concurrently without resource contention, making it a highly capable all-in-one silicon solution for modern productivity machines.
The PRO designation unlocks a comprehensive suite of enterprise manageability and security features built directly into silicon. AMD PRO Security includes AMD Memory Guard (full-memory encryption), Microsoft Pluton security processor integration, AMD Shadow Stack, and hardware-enforced AMD Secure Boot, collectively hardening the platform against physical and firmware-level attacks. AMD PRO Manageability delivers out-of-band management compatibility with Microsoft Endpoint Manager, AMD Dash (DMTF standard), and major MDM/RMM platforms, enabling IT administrators to remotely manage, provision, and remediate devices at scale without requiring end-user interaction.
The Ryzen AI 9 HX PRO 375 targets AI-augmented enterprise notebooks where local AI inferencing is a primary requirement — supporting Windows Studio Effects, on-device LLM inference, real-time transcription, and ISV AI-accelerated professional applications. The combination of high single-threaded CPU performance from Zen 5 cores, the Radeon 890M RDNA 3.5 iGPU with up to 16 compute units, and the 50+ TOPS XDNA 2 NPU positions this processor as a three-engine AI platform capable of distributing AI workloads intelligently across CPU, GPU, and NPU simultaneously.
| Manufacturer | AMD |
| Product Line | Ryzen AI PRO 300 Series |
| Model | Ryzen AI 9 HX PRO 375 |
| CPU Architecture | AMD Zen 5 + Zen 5c (hybrid core configuration) |
| Process Node | TSMC 4nm FinFET |
| Total CPU Cores | 12 (8 Zen 5 Performance + 4 Zen 5c Efficiency) |
| Total CPU Threads | 24 |
| Base Clock (P-Core) | Up to 2.0 GHz (configurable TDP-dependent) |
| Max Boost Clock | Up to 5.1 GHz |
| L3 Cache | 24 MB AMD 3D Cache (unified last-level cache) |
| NPU Engine | AMD XDNA 2 Architecture |
| NPU AI Performance | 50+ TOPS (Tera Operations Per Second) |
| Combined SoC AI Performance | Up to 73 TOPS (CPU + GPU + NPU combined) |
| Integrated Graphics | AMD Radeon 890M (RDNA 3.5 Architecture) |
| iGPU Compute Units | 16 Compute Units |
| iGPU Max Boost Frequency | Up to 2900 MHz |
| Supported Memory Type | LPDDR5X up to 7500 MT/s |
| Max Memory Capacity | 64 GB |
| Memory Channels | Dual-channel |
| TDP (Configurable cTDP) | 15W – 54W |
| PCIe Version | PCIe 4.0 |
| Display Outputs Supported | Up to 4 simultaneous displays |
| Security Features | AMD Memory Guard (SME full-memory encryption), AMD Secure Boot, AMD Shadow Stack, Microsoft Pluton Security Processor |
| Manageability | AMD PRO Manageability — DMTF DASH out-of-band, Microsoft Intune/Endpoint Manager compatible, AMD Dash support |
| Platform | AMD PRO Platform (commercial-grade ISV certification, extended availability commitment) |
| Launch Period | Q4 2024 |
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| Brand | AMD |
| Category | CPUs |
| SKU | AMD-100000001370 |
| Part Number | 100-000001370 |
| Condition | New |
| Product Line | Ryzen AI PRO 300 Series |
| Model | Ryzen AI 9 HX PRO 375 |
| CPU Architecture | AMD Zen 5 + Zen 5c (hybrid core configuration) |
| Process Node | TSMC 4nm FinFET |
| Total CPU Cores | 12 (8 Zen 5 Performance + 4 Zen 5c Efficiency) |
| Total CPU Threads | 24 |
| Base Clock (P-Core) | Up to 2.0 GHz (configurable TDP-dependent) |
| Max Boost Clock | Up to 5.1 GHz |
| L3 Cache | 24 MB AMD 3D Cache (unified last-level cache) |
| NPU Engine | AMD XDNA 2 Architecture |
| NPU AI Performance | 50+ TOPS (Tera Operations Per Second) |
| Combined SoC AI Performance | Up to 73 TOPS (CPU + GPU + NPU combined) |
| Integrated Graphics | AMD Radeon 890M (RDNA 3.5 Architecture) |
| iGPU Compute Units | 16 Compute Units |
| iGPU Max Boost Frequency | Up to 2900 MHz |
| Supported Memory Type | LPDDR5X up to 7500 MT/s |
| Max Memory Capacity | 64 GB |
| Memory Channels | Dual-channel |
| TDP (Configurable cTDP) | 15W – 54W |
| PCIe Version | PCIe 4.0 |
| Display Outputs Supported | Up to 4 simultaneous displays |
| Security Features | AMD Memory Guard (SME full-memory encryption), AMD Secure Boot, AMD Shadow Stack, Microsoft Pluton Security Processor |
| Manageability | AMD PRO Manageability — DMTF DASH out-of-band, Microsoft Intune/Endpoint Manager compatible, AMD Dash support |
| Platform | AMD PRO Platform (commercial-grade ISV certification, extended availability commitment) |
| Launch Period | Q4 2024 |
The AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375) is enterprise IT hardware deployed in production data centers, server rooms, and edge sites across the GCC and EMEA region.
The AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375) is enterprise IT hardware deployed in production data centers, server rooms, and edge sites across the GCC and EMEA region.
Key specifications for the AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375): new condition; manufacturer AMD; product line Ryzen AI PRO 300 Series; model Ryzen AI 9 HX PRO 375; cpu architecture AMD Zen 5 + Zen 5c (hybrid core configuration); process node TSMC 4nm FinFET; total cpu cores 12 (8 Zen 5 Performance + 4 Zen 5c Efficiency). Manufacturer part number 100-000001370. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.
Key specifications for the AMD Ryzen AI PRO 300 Series (Ryzen AI 9 HX PRO 375): new condition; manufacturer AMD; product line Ryzen AI PRO 300 Series; model Ryzen AI 9 HX PRO 375; cpu architecture AMD Zen 5 + Zen 5c (hybrid core configuration); process node TSMC 4nm FinFET; total cpu cores 12 (8 Zen 5 Performance + 4 Zen 5c Efficiency). Manufacturer part number 100-000001370. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.