AMD Instinct MI350X 288GB HBM3E GPU Accelerator OAM

The AMD Instinct MI350X is AMD's highest-performance data center GPU accelerator, built on the CDNA 4 architecture and engineered for the most demanding AI training, inference, and high-performance computing workloads at scale. Featuring 288 GB of HBM3E high-bandwidth memory, the MI350X delivers a substantial leap in memory capacity and bandwidth over its predecessors, enabling large language model training, multi-modal AI, and scientific simulation workloads that require massive on-device memory footprints. The OAM (OCP Accelerator Module) form factor ensures compatibility with open standards-based server platforms designed for hyperscale and enterprise data center deployments.

Built on CDNA 4 microarchitecture, the MI350X introduces significant improvements in compute density, matrix math throughput, and memory subsystem efficiency compared to the CDNA 3 generation. The HBM3E memory stack provides higher bandwidth and improved power efficiency per bit transferred, directly benefiting memory-bound workloads such as large-batch inference and transformer model training. AMD ROCm open software platform support ensures integration with industry-standard frameworks including PyTorch, TensorFlow, and JAX, as well as HPC environments using MPI and OpenMP.

The Gigabyte MI350X OAM module carries AMD manufacturer part number 100-300000112 and is positioned for deployment in OAM-compliant Universal Baseboard (UBB) server platforms. Its thermal and power design is optimized for liquid-cooled and air-cooled data center infrastructure, making it suitable for enterprise AI factories, national laboratories, financial modeling clusters, and cloud service provider accelerated compute nodes across regions including the UAE, GCC, EMEA, and APAC.

Ideal for

• Large language model (LLM) pre-training and fine-tuning requiring high on-device memory capacity to accommodate billion-to-trillion parameter model weights and activations
• High-throughput generative AI inference serving for enterprise applications, supporting large batch sizes enabled by 288 GB HBM3E memory
• Multi-modal AI workloads combining vision, language, and structured data that demand both high compute throughput and substantial memory bandwidth
• High-performance computing simulations in computational fluid dynamics, molecular dynamics, and climate modeling benefiting from CDNA 4 double-precision floating-point performance
• Financial services quantitative analytics and risk modeling requiring sustained FP64 throughput across large in-memory datasets
• Enterprise AI infrastructure buildouts in hyperscale and colocation data centers across the Middle East, Africa, and Asia-Pacific seeking open-standards OAM-based accelerator platforms

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.