Brand: AMD | Category: GPUs
SKU: AMD-100000001234X | Part #: 100-000001234X | MPN: 100-000001234X
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The AMD Instinct MI325X is a data center GPU accelerator built on AMD's CDNA 3 architecture, featuring 256GB of HBM3E high-bandwidth memory — the largest memory capacity available in a production AI accelerator at its launch in Q4 2024. This exceptional memory footprint enables the accelerator to hold extremely large model parameter sets entirely in-device memory, eliminating costly host-to-device data transfers during inference and enabling full-scale training of multi-hundred-billion parameter large language models without model parallelism across additional nodes. The MI325X delivers 6.0 TB/s of aggregate memory bandwidth, providing the throughput necessary to feed its compute engines during memory-bound inference workloads at high batch sizes.
The CDNA 3 architecture underlying the MI325X features a chiplet-based design combining compute dies with HBM3E memory stacks, interconnected through AMD's advanced packaging technology. The architecture includes second-generation AMD Matrix Cores optimized for mixed-precision AI workloads, supporting FP8, FP16, BF16, and FP32 data formats natively. With 1,307 TFLOPS of FP16 peak throughput and 2,615 TOPS of FP8 performance, the accelerator scales efficiently across transformer-based model architectures commonly used in generative AI. AMD Infinity Fabric interconnects deliver 896 GB/s of bidirectional bandwidth for multi-GPU scaling within a node.
Designed for enterprise hyperscale and cloud deployments, the MI325X integrates into AMD Instinct platform-compatible OCP Accelerator Module (OAM) and PCIe form factors, supporting ROCm open-source software stack compatibility. The accelerator targets AI infrastructure operators who require maximum per-accelerator memory to reduce the total number of accelerators needed for large model deployment, directly improving total infrastructure efficiency. Security features include secure boot and hardware-level isolation appropriate for multi-tenant cloud environments.
| Manufacturer | AMD |
| Product Family | AMD Instinct MI300 Series |
| Architecture | AMD CDNA 3 (chiplet-based compute + HBM3E) |
| GPU Memory | 256 GB HBM3E |
| Memory Bandwidth | 6.0 TB/s |
| FP8 Peak Throughput | 2,615 TOPS |
| FP16 Peak Throughput | 1,307 TFLOPS |
| BF16 Peak Throughput | 1,307 TFLOPS |
| FP32 Peak Throughput | 653 TFLOPS |
| FP64 Peak Throughput | 163 TFLOPS |
| Matrix Cores | Second-generation AMD Matrix Cores |
| Supported Precisions | FP8, FP16, BF16, FP32, FP64, INT8 |
| AMD Infinity Fabric Bandwidth | 896 GB/s bidirectional |
| Multi-GPU Interconnect | AMD Infinity Fabric with peer-to-peer NVLink-equivalent direct GPU communication |
| Form Factor | OCP Accelerator Module (OAM) / PCIe |
| Thermal Design Power (TDP) | 750W |
| Compute Dies | 3 CDNA 3 GPU compute chiplets + 12 HBM3E stacks |
| ECC Support | Full ECC on HBM3E memory |
| Software Stack | AMD ROCm open-source platform (HIP, MIOpen, rocBLAS, rocDNN) |
| Framework Support | PyTorch, TensorFlow, JAX, ONNX Runtime via ROCm |
| Security Features | Secure Boot, hardware-level memory isolation, multi-tenant capable |
| Launch Generation | Q4 2024 |
| Target Deployment | Data center AI training and inference, HPC clusters |
Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.
| Brand | AMD |
| Category | GPUs |
| SKU | AMD-100000001234X |
| Part Number | 100-000001234X |
| Condition | New |
| Product Family | AMD Instinct MI300 Series |
| Architecture | AMD CDNA 3 (chiplet-based compute + HBM3E) |
| GPU Memory | 256 GB HBM3E |
| Memory Bandwidth | 6.0 TB/s |
| FP8 Peak Throughput | 2,615 TOPS |
| FP16 Peak Throughput | 1,307 TFLOPS |
| BF16 Peak Throughput | 1,307 TFLOPS |
| FP32 Peak Throughput | 653 TFLOPS |
| FP64 Peak Throughput | 163 TFLOPS |
| Matrix Cores | Second-generation AMD Matrix Cores |
| Supported Precisions | FP8, FP16, BF16, FP32, FP64, INT8 |
| AMD Infinity Fabric Bandwidth | 896 GB/s bidirectional |
| Multi-GPU Interconnect | AMD Infinity Fabric with peer-to-peer NVLink-equivalent direct GPU communication |
| Form Factor | OCP Accelerator Module (OAM) / PCIe |
| Thermal Design Power (TDP) | 750W |
| Compute Dies | 3 CDNA 3 GPU compute chiplets + 12 HBM3E stacks |
| ECC Support | Full ECC on HBM3E memory |
| Software Stack | AMD ROCm open-source platform (HIP, MIOpen, rocBLAS, rocDNN) |
| Framework Support | PyTorch, TensorFlow, JAX, ONNX Runtime via ROCm |
| Security Features | Secure Boot, hardware-level memory isolation, multi-tenant capable |
| Launch Generation | Q4 2024 |
| Target Deployment | Data center AI training and inference, HPC clusters |
The AMD Instinct MI325X Accelerator accelerates AI/ML training, inference, scientific HPC, and virtualization (vGPU) workloads. Typical deployments include LLM training clusters, computer-vision pipelines, financial risk modeling, and rendering farms.
Key specifications for the AMD Instinct MI325X Accelerator: new condition; manufacturer AMD; product family AMD Instinct MI300 Series; architecture AMD CDNA 3 (chiplet-based compute + HBM3E); gpu memory 256 GB HBM3E; memory bandwidth 6.0 TB/s; fp8 peak throughput 2,615 TOPS. Manufacturer part number 100-000001234X. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.
The AMD Instinct MI325X Accelerator requires a PCIe Gen4 or Gen5 x16 slot, server power adequate for the card's TDP, and CUDA/ROCm driver support in your hypervisor or bare-metal OS. Sales engineering will confirm chassis fit (1U/2U/4U), PCIe lane count, and PSU headroom before quoting.