AMD Instinct MI325X Accelerator

AMD Instinct MI325X Accelerator

Brand: AMD | Category: GPUs

SKU: AMD-100000001234X | Part #: 100-000001234X | MPN: 100-000001234X

Contact for Pricing — Request a Quote

Request a Quote Contact Us

About the AMD Instinct MI325X Accelerator

The AMD Instinct MI325X is a data center GPU accelerator built on AMD's CDNA 3 architecture, featuring 256GB of HBM3E high-bandwidth memory — the largest memory capacity available in a production AI accelerator at its launch in Q4 2024. This exceptional memory footprint enables the accelerator to hold extremely large model parameter sets entirely in-device memory, eliminating costly host-to-device data transfers during inference and enabling full-scale training of multi-hundred-billion parameter large language models without model parallelism across additional nodes. The MI325X delivers 6.0 TB/s of aggregate memory bandwidth, providing the throughput necessary to feed its compute engines during memory-bound inference workloads at high batch sizes.

The CDNA 3 architecture underlying the MI325X features a chiplet-based design combining compute dies with HBM3E memory stacks, interconnected through AMD's advanced packaging technology. The architecture includes second-generation AMD Matrix Cores optimized for mixed-precision AI workloads, supporting FP8, FP16, BF16, and FP32 data formats natively. With 1,307 TFLOPS of FP16 peak throughput and 2,615 TOPS of FP8 performance, the accelerator scales efficiently across transformer-based model architectures commonly used in generative AI. AMD Infinity Fabric interconnects deliver 896 GB/s of bidirectional bandwidth for multi-GPU scaling within a node.

Designed for enterprise hyperscale and cloud deployments, the MI325X integrates into AMD Instinct platform-compatible OCP Accelerator Module (OAM) and PCIe form factors, supporting ROCm open-source software stack compatibility. The accelerator targets AI infrastructure operators who require maximum per-accelerator memory to reduce the total number of accelerators needed for large model deployment, directly improving total infrastructure efficiency. Security features include secure boot and hardware-level isolation appropriate for multi-tenant cloud environments.

Ideal for

  • Training frontier-scale large language models with hundreds of billions of parameters, leveraging 256GB on-device memory to reduce inter-node communication overhead
  • High-throughput generative AI inference serving for production LLM APIs, where large KV cache requirements demand maximum memory capacity per accelerator
  • Multimodal AI model development combining vision transformers and language models that benefit from unified large memory pools
  • Scientific simulation and HPC workloads requiring both high double-precision floating-point performance and massive memory capacity for in-memory dataset processing
  • Enterprise retrieval-augmented generation (RAG) pipelines where embedding models and generative models must co-reside in accelerator memory for latency-critical applications
  • AI model fine-tuning and continual learning pipelines in regulated industries where data residency requires on-premises GPU clusters with maximum per-node capacity

Technical specifications

ManufacturerAMD
Product FamilyAMD Instinct MI300 Series
ArchitectureAMD CDNA 3 (chiplet-based compute + HBM3E)
GPU Memory256 GB HBM3E
Memory Bandwidth6.0 TB/s
FP8 Peak Throughput2,615 TOPS
FP16 Peak Throughput1,307 TFLOPS
BF16 Peak Throughput1,307 TFLOPS
FP32 Peak Throughput653 TFLOPS
FP64 Peak Throughput163 TFLOPS
Matrix CoresSecond-generation AMD Matrix Cores
Supported PrecisionsFP8, FP16, BF16, FP32, FP64, INT8
AMD Infinity Fabric Bandwidth896 GB/s bidirectional
Multi-GPU InterconnectAMD Infinity Fabric with peer-to-peer NVLink-equivalent direct GPU communication
Form FactorOCP Accelerator Module (OAM) / PCIe
Thermal Design Power (TDP)750W
Compute Dies3 CDNA 3 GPU compute chiplets + 12 HBM3E stacks
ECC SupportFull ECC on HBM3E memory
Software StackAMD ROCm open-source platform (HIP, MIOpen, rocBLAS, rocDNN)
Framework SupportPyTorch, TensorFlow, JAX, ONNX Runtime via ROCm
Security FeaturesSecure Boot, hardware-level memory isolation, multi-tenant capable
Launch GenerationQ4 2024
Target DeploymentData center AI training and inference, HPC clusters

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.

Technical Specifications

BrandAMD
CategoryGPUs
SKUAMD-100000001234X
Part Number100-000001234X
ConditionNew
Product FamilyAMD Instinct MI300 Series
ArchitectureAMD CDNA 3 (chiplet-based compute + HBM3E)
GPU Memory256 GB HBM3E
Memory Bandwidth6.0 TB/s
FP8 Peak Throughput2,615 TOPS
FP16 Peak Throughput1,307 TFLOPS
BF16 Peak Throughput1,307 TFLOPS
FP32 Peak Throughput653 TFLOPS
FP64 Peak Throughput163 TFLOPS
Matrix CoresSecond-generation AMD Matrix Cores
Supported PrecisionsFP8, FP16, BF16, FP32, FP64, INT8
AMD Infinity Fabric Bandwidth896 GB/s bidirectional
Multi-GPU InterconnectAMD Infinity Fabric with peer-to-peer NVLink-equivalent direct GPU communication
Form FactorOCP Accelerator Module (OAM) / PCIe
Thermal Design Power (TDP)750W
Compute Dies3 CDNA 3 GPU compute chiplets + 12 HBM3E stacks
ECC SupportFull ECC on HBM3E memory
Software StackAMD ROCm open-source platform (HIP, MIOpen, rocBLAS, rocDNN)
Framework SupportPyTorch, TensorFlow, JAX, ONNX Runtime via ROCm
Security FeaturesSecure Boot, hardware-level memory isolation, multi-tenant capable
Launch GenerationQ4 2024
Target DeploymentData center AI training and inference, HPC clusters

Frequently Asked Questions about AMD Instinct MI325X Accelerator

What does the AMD Instinct MI325X Accelerator do?

The AMD Instinct MI325X Accelerator accelerates AI/ML training, inference, scientific HPC, and virtualization (vGPU) workloads. Typical deployments include LLM training clusters, computer-vision pipelines, financial risk modeling, and rendering farms.

What are the headline specs of the AMD Instinct MI325X Accelerator?

Key specifications for the AMD Instinct MI325X Accelerator: new condition; manufacturer AMD; product family AMD Instinct MI300 Series; architecture AMD CDNA 3 (chiplet-based compute + HBM3E); gpu memory 256 GB HBM3E; memory bandwidth 6.0 TB/s; fp8 peak throughput 2,615 TOPS. Manufacturer part number 100-000001234X. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.

Is the AMD Instinct MI325X Accelerator compatible with my infrastructure?

The AMD Instinct MI325X Accelerator requires a PCIe Gen4 or Gen5 x16 slot, server power adequate for the card's TDP, and CUDA/ROCm driver support in your hypervisor or bare-metal OS. Sales engineering will confirm chassis fit (1U/2U/4U), PCIe lane count, and PSU headroom before quoting.