Brand: AMD | Category: GPUs
SKU: AMD-100300000080 | Part #: 100-300000080 | MPN: 100-300000080
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The AMD Instinct MI325X 8-GPU platform is a purpose-built accelerator baseboard integrating eight MI325X GPUs interconnected via AMD Infinity Fabric, designed to address the extreme memory and compute demands of frontier-scale AI workloads. Each MI325X GPU is built on the CDNA3 architecture and features 288GB of HBM3E memory, yielding a combined 2.304TB of high-bandwidth memory across the full eight-GPU configuration—sufficient to hold trillion-parameter large language models entirely in accelerator memory without relying on CPU-side offloading. The platform delivers aggregate peak AI compute exceeding 5,200 TFLOPS in FP8 precision, making it one of the highest-density inference and training solutions available in a single baseboard form factor.
The CDNA3 architecture underpinning each MI325X GPU introduces second-generation matrix cores with native FP8, BF16, FP16, and FP32 support, enabling flexible mixed-precision workflows across training, fine-tuning, and high-throughput inference. AMD Infinity Fabric links all eight dies at high bandwidth, enabling coherent memory access and efficient collective communications across the full GPU ensemble without the latency penalties associated with PCIe-only multi-GPU topologies. The platform is compatible with ROCm open software stack, supporting PyTorch, TensorFlow, JAX, and the vLLM inference engine through validated HIP kernels and MIOpen libraries.
Launched in Q1 2025, the AMD Instinct MI325X 8-GPU platform targets hyperscale data centers and enterprise AI infrastructure teams deploying large language models, diffusion models, and scientific simulation workloads that exceed the memory envelope of single-socket or dual-GPU configurations. The platform integrates into server chassis supporting the OAM (OCP Accelerator Module) form factor, enabling rack-scale deployment alongside high-speed Ethernet or InfiniBand networking fabrics. Its 2TB+ aggregate HBM3E capacity eliminates model sharding constraints for models in the 500B–1T+ parameter range, dramatically simplifying deployment orchestration and reducing end-to-end inference latency.
| Manufacturer | AMD |
| Product Family | AMD Instinct MI325X |
| Platform Configuration | 8-GPU OAM Baseboard |
| GPU Architecture | AMD CDNA3 |
| GPUs per Platform | 8x AMD Instinct MI325X |
| Memory per GPU | 288 GB HBM3E |
| Aggregate Platform Memory | 2.304 TB HBM3E |
| Memory Bandwidth per GPU | 6.0 TB/s (peak) |
| Aggregate Memory Bandwidth | 48 TB/s (peak) |
| Peak AI Compute (FP8) per GPU | ~655 TOPS |
| Aggregate Peak AI Compute (FP8) | >5,200 TOPS |
| Peak FP16 Compute per GPU | ~327.7 TFLOPS |
| Peak FP64 Compute per GPU | ~81.9 TFLOPS |
| Interconnect Technology | AMD Infinity Fabric (GPU-to-GPU, coherent) |
| Inter-GPU Bandwidth | Up to 896 GB/s bidirectional per GPU link |
| Form Factor | OCP Accelerator Module (OAM) Baseboard |
| Host Interface | PCIe Gen 5 x16 per GPU (host uplink) |
| Supported Precisions | FP8, BF16, FP16, FP32, FP64, INT8, INT4 |
| Software Stack | AMD ROCm (HIP, MIOpen, rocBLAS, rocFFT), PyTorch, TensorFlow, JAX, vLLM |
| Thermal Design | Liquid cooling required; OAM chassis direct liquid cooling (DLC) compatible |
| Launch | Q1 2025 |
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| Brand | AMD |
| Category | GPUs |
| SKU | AMD-100300000080 |
| Part Number | 100-300000080 |
| Condition | New |
| Product Family | AMD Instinct MI325X |
| Platform Configuration | 8-GPU OAM Baseboard |
| GPU Architecture | AMD CDNA3 |
| GPUs per Platform | 8x AMD Instinct MI325X |
| Memory per GPU | 288 GB HBM3E |
| Aggregate Platform Memory | 2.304 TB HBM3E |
| Memory Bandwidth per GPU | 6.0 TB/s (peak) |
| Aggregate Memory Bandwidth | 48 TB/s (peak) |
| Peak AI Compute (FP8) per GPU | ~655 TOPS |
| Aggregate Peak AI Compute (FP8) | >5,200 TOPS |
| Peak FP16 Compute per GPU | ~327.7 TFLOPS |
| Peak FP64 Compute per GPU | ~81.9 TFLOPS |
| Interconnect Technology | AMD Infinity Fabric (GPU-to-GPU, coherent) |
| Inter-GPU Bandwidth | Up to 896 GB/s bidirectional per GPU link |
| Form Factor | OCP Accelerator Module (OAM) Baseboard |
| Host Interface | PCIe Gen 5 x16 per GPU (host uplink) |
| Supported Precisions | FP8, BF16, FP16, FP32, FP64, INT8, INT4 |
| Software Stack | AMD ROCm (HIP, MIOpen, rocBLAS, rocFFT), PyTorch, TensorFlow, JAX, vLLM |
| Thermal Design | Liquid cooling required; OAM chassis direct liquid cooling (DLC) compatible |
| Launch | Q1 2025 |
The AMD Instinct MI325X (8-GPU platform) accelerates AI/ML training, inference, scientific HPC, and virtualization (vGPU) workloads. Typical deployments include LLM training clusters, computer-vision pipelines, financial risk modeling, and rendering farms.
The AMD Instinct MI325X (8-GPU platform) accelerates AI/ML training, inference, scientific HPC, and virtualization (vGPU) workloads. Typical deployments include LLM training clusters, computer-vision pipelines, financial risk modeling, and rendering farms.
The AMD Instinct MI325X (8-GPU platform) accelerates AI/ML training, inference, scientific HPC, and virtualization (vGPU) workloads. Typical deployments include LLM training clusters, computer-vision pipelines, financial risk modeling, and rendering farms.
Key specifications for the AMD Instinct MI325X (8-GPU platform): new condition; manufacturer AMD; product family AMD Instinct MI325X; platform configuration 8-GPU OAM Baseboard; gpu architecture AMD CDNA3; gpus per platform 8x AMD Instinct MI325X; memory per gpu 288 GB HBM3E. Manufacturer part number 100-300000080. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.
Key specifications for the AMD Instinct MI325X (8-GPU platform): new condition; manufacturer AMD; product family AMD Instinct MI325X; platform configuration 8-GPU OAM Baseboard; gpu architecture AMD CDNA3; gpus per platform 8x AMD Instinct MI325X; memory per gpu 288 GB HBM3E. Manufacturer part number 100-300000080. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.