AMD Instinct MI325X 256GB HBM3E

The AMD Instinct MI325X accelerator, offered through Supermicro's validated hardware portfolio under part number 100-300000025, is built on AMD's CDNA 3 compute architecture and represents AMD's highest-memory-capacity GPU accelerator to date. Featuring 256 GB of HBM3E high-bandwidth memory across eight stacks, the MI325X delivers up to 6.0 TB/s of aggregate memory bandwidth, enabling large-scale AI model inference and training workloads that demand both massive memory capacity and extreme data throughput. The accelerator supports FP8, FP16, BF16, FP32, TF32, and INT8 precision formats, with peak matrix compute performance reaching up to 1,307.4 TFLOPS at FP8, making it suited for the most demanding generative AI and scientific computing tasks.

The MI325X is designed for high-density datacenter deployment within Supermicro's OAM (Open Accelerator Module) form factor, enabling integration into multi-accelerator node configurations that scale across large AI infrastructure deployments. Its CDNA 3 architecture incorporates AMD Infinity Fabric technology, supporting coherent multi-GPU communication across nodes and enabling unified memory addressing in multi-chip configurations. The accelerator is optimized for ROCm open-software ecosystem compatibility, providing a flexible path for enterprises deploying PyTorch, TensorFlow, JAX, and HPC frameworks without dependency on proprietary software stacks.

Targeted at enterprise datacenters, cloud service providers, and AI research organizations across the UAE, GCC, EMEA, and APAC regions, the Supermicro-validated MI325X is positioned for deployments requiring the largest available GPU memory footprint in the AMD Instinct line. The 256 GB HBM3E capacity allows entire large language models and recommendation system embeddings to reside on-device, reducing latency and eliminating the need for model sharding across memory boundaries in many practical LLM inference scenarios. Omnixon Global makes this accelerator available to enterprise buyers seeking AMD-based AI infrastructure at scale.

Ideal for

• Large language model (LLM) inference serving, where 256 GB HBM3E capacity allows multi-billion-parameter models to run entirely within a single accelerator's memory space
• Generative AI training at scale, leveraging FP8 and BF16 matrix compute performance for distributed training jobs across multi-node Supermicro AI server clusters
• High-performance computing (HPC) simulations in climate modeling, computational fluid dynamics, and molecular dynamics that require both high memory bandwidth and large working-set memory
• Enterprise recommendation system acceleration, where massive embedding tables benefit directly from the 256 GB on-device memory to avoid costly host-to-device data transfers
• AI-driven drug discovery and genomics workloads that combine large dataset sizes with complex floating-point compute requirements across sustained multi-day training runs
• Datacenter AI infrastructure buildouts for sovereign cloud and national AI initiatives across GCC and APAC, where open ROCm software compatibility supports regulatory and vendor-diversity requirements

Technical specifications

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.