Brand: AMD | Category: GPUs
SKU: 210-BFZV | Part #: 210-BFZV | MPN: 210-BFZV
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The AMD Instinct MI300X OAM Accelerator Tray for the Dell PowerEdge XE9680 is built on AMD's CDNA 3 architecture, combining compute dies and HBM3 memory stacks into a unified Accelerated Processing Unit (APU) design. With 192 GB of HBM3 memory and a 5.3 TB/s aggregate memory bandwidth, the MI300X addresses the fundamental memory-capacity bottleneck that constrains large-scale AI model inference and training workloads. The OAM (OCP Accelerator Module) form factor enables dense multi-accelerator configurations within the XE9680 chassis, supporting up to eight MI300X modules per server node interconnected via AMD Infinity Fabric for high-bandwidth peer-to-peer communication.
At the compute level, the MI300X delivers 1,307 TFLOPS of FP16 performance and 2,615 TFLOPS of FP8 performance, making it well-suited for the numerical precision requirements of generative AI inference, large language model (LLM) training, and scientific simulation. The accelerator supports the ROCm open software platform, providing compatibility with widely adopted AI frameworks including PyTorch and TensorFlow, as well as HPC programming models such as HIP, OpenCL, and OpenMP offloading. ROCm's hardware abstraction layer enables enterprises to migrate and optimize existing CUDA-adjacent workloads without proprietary lock-in.
Deployed within the Dell PowerEdge XE9680 platform (manufacturer part number 210-BFZV), the MI300X OAM Accelerator Tray is an enterprise-grade component designed for datacenter rack integration with managed power, thermal, and serviceability characteristics appropriate for 24/7 mission-critical environments. The combination of the XE9680's system-level power delivery, NVMe storage backplane, and dual-socket CPU infrastructure with the MI300X's memory capacity makes this configuration particularly effective for serving very large foundation models—including those with hundreds of billions of parameters—entirely within a single server node's GPU memory pool.
| Manufacturer | AMD |
| Manufacturer Part Number | 210-BFZV |
| GPU Architecture | CDNA 3 |
| Form Factor | OAM (OCP Accelerator Module) |
| Compatible Platform | Dell PowerEdge XE9680 |
| Memory Capacity | 192 GB HBM3 |
| Memory Bandwidth | 5.3 TB/s |
| Memory Type | HBM3 |
| FP16 Peak Performance | 1,307 TFLOPS |
| FP8 Peak Performance | 2,615 TFLOPS |
| FP64 Peak Performance | 163.4 TFLOPS |
| BF16 Peak Performance | 1,307 TFLOPS |
| Compute Units | 304 |
| Interconnect | AMD Infinity Fabric |
| PCIe Interface | PCIe 5.0 x16 |
| Thermal Design Power (TDP) | 750 W |
| Accelerators per XE9680 Node | Up to 8 |
| Software Platform | AMD ROCm (open-source) |
| Supported Frameworks | PyTorch, TensorFlow, HIP, OpenCL, OpenMP offload |
| Process Node | TSMC N5 (compute dies) / TSMC N6 (I/O die) |
| Product Category | Data Center GPU Accelerator |
Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.
| Brand | AMD |
| Category | GPUs |
| SKU | 210-BFZV |
| Part Number | 210-BFZV |
| Condition | New |
| Manufacturer Part Number | 210-BFZV |
| GPU Architecture | CDNA 3 |
| Form Factor | OAM (OCP Accelerator Module) |
| Compatible Platform | Dell PowerEdge XE9680 |
| Memory Capacity | 192 GB HBM3 |
| Memory Bandwidth | 5.3 TB/s |
| Memory Type | HBM3 |
| FP16 Peak Performance | 1,307 TFLOPS |
| FP8 Peak Performance | 2,615 TFLOPS |
| FP64 Peak Performance | 163.4 TFLOPS |
| BF16 Peak Performance | 1,307 TFLOPS |
| Compute Units | 304 |
| Interconnect | AMD Infinity Fabric |
| PCIe Interface | PCIe 5.0 x16 |
| Thermal Design Power (TDP) | 750 W |
| Accelerators per XE9680 Node | Up to 8 |
| Software Platform | AMD ROCm (open-source) |
| Supported Frameworks | PyTorch, TensorFlow, HIP, OpenCL, OpenMP offload |
| Process Node | TSMC N5 (compute dies) / TSMC N6 (I/O die) |
| Product Category | Data Center GPU Accelerator |
Reference servers include Dell PowerEdge XE9680 / XE9712, HPE Cray XD670, Lenovo ThinkSystem SR685a / SR675 V3, Supermicro AS-A21GE / SYS-821GE, Gigabyte G593 / G894, ASUS ESC. Share your target platform in the RFQ and we will confirm chassis-to-GPU compatibility and recommended NIC pairing.
Highly model-dependent. L40S / RTX-class: typically 3-6 weeks. H100/H200/B200 in SXM form factor: 12-16 weeks for whole-platform allocations. We quote genuine-channel ETAs only — no grey-market promises.
Yes — Omnixon stocks the full NVIDIA networking lineup (Quantum-2 / Quantum-X InfiniBand, Spectrum-X Ethernet, ConnectX NICs, BlueField DPUs) so we can quote a complete training-cluster BOM, not just the GPUs.
Yes. We hold genuine-channels for NVIDIA AI Enterprise software subscriptions. Add it to your RFQ and we quote node-aligned licensing along with the hardware.