Micron 64GB DDR4 LRDIMM 4Rx4 2666MHz CL19 ECC Load-Reduced Server Memory MTA72ASS8G72LZ-2G6I2R

Brand: Micron | Category: Memory (RAM)

SKU: MTA72ASS8G72LZ-2G6I2R | Part #: MTA72ASS8G72LZ-2G6I2R

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Product Overview

The Micron 64GB DDR4 LRDIMM (Load-Reduced Dual In-Line Memory Module) is a high-density, enterprise-grade server memory module engineered for mission-critical computing environments. Operating at 2666MHz (PC4-21300) with CL19 latency timings and built on 8Gbit die technology in a 4-rank, 4-die-per-package (4Rx4) configuration, this module delivers exceptional memory density per DIMM slot. Designed and manufactured by Micron Technology — one of the world's foremost memory and storage innovators — this module targets data centre operators, enterprise IT teams, cloud service providers, and HPC facilities that require maximum memory capacity within constrained physical slot budgets.

LRDIMM architecture fundamentally differs from standard RDIMM by introducing an additional memory buffer — the iMB (isolation Memory Buffer) — that sits between the DRAM components and the memory controller on the host CPU. This buffer effectively decouples the electrical load of the DRAM from the memory bus, allowing servers to populate more ranks per channel without sacrificing signal integrity or operating frequency. The result is dramatically higher total system memory capacity from a given number of DIMM slots, which is critical in memory-intensive workloads such as large in-memory databases, virtualisation consolidation, and AI/ML inference.

Supplied as a single-pack brand-new module, this Micron LRDIMM is fully compliant with JEDEC standards and includes on-die ECC (Error-Correcting Code) plus host-side ECC support, making it suitable for 24/7 enterprise deployments where data integrity is non-negotiable.

Key Features & Benefits

• 64GB High-Density Capacity: Maximises total addressable memory per server, enabling platforms to reach 1.5TB–6TB+ total RAM when fully populated across all DIMM slots.
• Load-Reduced (LRDIMM) Architecture: The integrated isolation Memory Buffer (iMB) reduces the electrical load on the memory bus, supporting higher rank counts and greater density without frequency penalties.
• DDR4-2666 Speed Grade: Delivers 21,333 MB/s peak theoretical bandwidth per module, providing the throughput required for latency-sensitive, data-intensive enterprise applications.
• 4Rx4 Rank Configuration: Four-rank organisation using x4 DRAM components and 8Gbit die density achieves 64GB per module while maintaining compatibility with LRDIMM-capable server platforms.
• ECC Error Correction: Full ECC support detects and corrects single-bit errors and detects multi-bit errors, ensuring data integrity across continuous enterprise operation cycles.
• JEDEC-Compliant SPD Programming: Factory-programmed Serial Presence Detect (SPD) EEPROM ensures plug-and-play compatibility with supported server platforms and correct auto-configuration during POST.
• Brand New Condition: Ships as factory-sealed, unused stock — full production quality with no refurbishment or prior deployment history, meeting enterprise procurement standards.
• Micron Quality Manufacturing: Produced in Micron's own fabrication facilities with rigorous burn-in and qualification testing, backed by the engineering pedigree of one of the JEDEC memory standards committee's founding members.

Technical Architecture

This module is built on the DDR4 standard using a 288-pin DIMM form factor with a 64-bit data bus width plus 8 ECC bits (72-bit total bus). The 4Rx4 designation indicates four independent ranks of DRAM, each composed of x4-width 8Gbit (1GB) DRAM components. Micron's 8Gbit die density is the foundational building block that enables the 64GB capacity within the physical constraints of a standard DIMM PCB.

The LRDIMM's iMB (isolation Memory Buffer) is a critical architectural element. Unlike RDIMM — which uses a Register/Clock Driver (RCD) purely for command/address buffering — the LRDIMM iMB also buffers the data lines between the DRAM and the memory channel. This means the memory controller on the host CPU only ever sees a single load regardless of how many ranks are populated behind the buffer. This is essential for enabling 4-rank modules to operate at full rated frequency (2666MHz) without triggering memory controller speed throttling, which is a common limitation when using high-rank-count RDIMMs.

Voltage operation is at the standard DDR4 specification of 1.2V, contributing to lower per-bit power consumption compared to DDR3 predecessors. The module PCB is manufactured to strict impedance control specifications, and Micron applies proprietary thermal management practices to ensure stable operation within server thermal envelopes. The on-board SPD EEPROM stores all JEDEC-defined timing parameters, voltage settings, and module identification data, allowing compatible server BIOS/UEFI firmware to auto-configure the module correctly at boot.

Performance & Capacity

At DDR4-2666 speed, each module provides a theoretical peak bandwidth of approximately 21.3 GB/s per channel. In a dual-channel server configuration with two modules, aggregate bandwidth reaches approximately 42.6 GB/s, while quad-channel and six-channel server platforms (common in dual-socket Intel Xeon Scalable and AMD EPYC configurations) can achieve 128 GB/s or higher aggregate memory bandwidth when fully populated.

A single-socket server platform with 12 DIMM slots fully populated with 64GB LRDIMMs provides 768GB of total system memory — a configuration that is cost-effective and slot-efficient for large in-memory database engines such as SAP HANA, Oracle In-Memory, or Microsoft SQL Server In-Memory OLTP. Dual-socket platforms with 24 DIMM slots can reach 1.5TB total RAM, while platforms supporting 48 slots achieve 3TB. These densities are only practically achievable with LRDIMM technology at this capacity point.

Latency at CL19 (CAS Latency 19 cycles) is consistent with the DDR4-2666 specification tier and represents a well-balanced trade-off between raw clock frequency and access latency for workloads that prioritise bandwidth and capacity over absolute minimum latency.

Compatibility & Integration

This Micron LRDIMM is designed for compatibility with server platforms that explicitly support LRDIMM DIMMs. Key compatible server families and platforms include:

• Intel Xeon Scalable (Skylake-SP, Cascade Lake-SP, Cooper Lake): These processors support DDR4-2666 LRDIMMs natively via the integrated memory controller (IMC) and are the primary target platform for this module.
• HPE ProLiant Gen10 and Gen10 Plus servers (including DL380, DL360, DL580) with qualified LRDIMM support.
• Dell PowerEdge 14th and 15th Generation servers (R740, R940, R7525, and similar) configured with LRDIMM-compatible memory slots.
• Lenovo ThinkSystem SR650, SR850, and related platforms supporting DDR4 LRDIMM configurations.
• Supermicro X11 and X12 server platforms with Intel Xeon Scalable processors.
• Inspur and H3C enterprise server platforms used widely across Asia-Pacific and Middle East data centre deployments.

The module is JEDEC DDR4 LRDIMM standard compliant and operates at 1.2V. It is not backward-compatible with DDR3 sockets and requires a server platform with a LRDIMM-capable memory subsystem. Always verify the server's Hardware Compatibility List (HCL) or Qualified Vendor List (QVL) prior to deployment. Mixed RDIMM/LRDIMM populations within the same memory channel are not supported per JEDEC specifications.

Ideal Use Cases

• Large-Scale Server Virtualisation: VMware vSphere, Microsoft Hyper-V, and KVM hypervisor hosts benefit directly from maximised DIMM density. Higher per-host memory capacity increases VM consolidation ratios, reducing total server count and associated power and licensing costs.
• In-Memory Databases & Analytics: Platforms such as SAP HANA, Oracle TimesTen, MemSQL (SingleStore), and Redis Enterprise demand hundreds of gigabytes to multiple terabytes of RAM. LRDIMMs enable this capacity on standard two-socket platforms without resorting to expensive four- or eight-socket systems.
• AI & Machine Learning Inference Servers: Large language model inference and AI inference pipelines increasingly require massive model parameter storage in host DRAM. High-density LRDIMM configurations ensure the CPU host memory subsystem is not the bottleneck when feeding GPU accelerators.
• High-Performance Computing (HPC) Clusters: Scientific computing, computational fluid dynamics, genomics pipelines, and finite element analysis benefit from large addressable memory spaces to hold working datasets entirely in RAM, minimising storage I/O overhead.
• Cloud & Managed Service Provider Infrastructure: Public and private cloud operators provisioning multi-tenant compute nodes require maximum memory density to support flexible VM and container sizing, particularly for memory-optimised instance types.
• Enterprise ERP & CRM Platforms: Large SAP ECC, SAP S/4HANA, Oracle E-Business Suite, and Microsoft Dynamics deployments running on-premises benefit from high-density memory configurations that support large shared memory pools and in-memory caching layers.
• Big Data & Streaming Analytics: Apache Spark, Apache Flink, and Hadoop ecosystem workloads leverage in-memory computation extensively. Nodes equipped with 384GB–1.5TB RAM handle significantly larger dataset partitions without spilling to disk.

Why Buy from Omnixon

Omnixon Global is a trusted B2B IT hardware distributor headquartered in Dubai, UAE, serving enterprise clients across the GCC region and internationally. We maintain in-region inventory of high-demand server memory modules including Micron LRDIMM product lines, enabling rapid fulfilment for data centre build-outs, server refresh programmes, and capacity expansion projects across the UAE, Saudi Arabia, Qatar, Kuwait, Bahrain, Oman, and beyond. Our procurement team specialises in sourcing both current-generation and end-of-life memory SKUs, making us a reliable single source for complex multi-SKU memory orders. All products sold by Omnixon are brand new and sourced through authorised distribution channels, ensuring full traceability and authenticity. Our enterprise account managers provide expert pre-sales technical support to help you validate compatibility with your specific server platform and configuration before purchase, reducing deployment risk.

Related Products & Ecosystem

To build a complete, high-performance server memory solution, consider complementing this LRDIMM module with related products available through Omnixon's catalogue. For platforms requiring lower-density slots or RDIMM configurations, explore our range of DDR4 RDIMM 16GB and 32GB modules from Micron, Samsung, SK Hynix, and Kingston. For storage-layer performance alongside your memory upgrade, our Enterprise SSD category includes NVMe U.2 and PCIe AIC drives optimised for database and virtualisation workloads. Network Adapters & NICs from Mellanox (now NVIDIA) and Broadcom provide the high-throughput fabric connectivity that memory-dense servers demand. For the server platforms themselves, our Servers category covers HPE ProLiant, Dell PowerEdge, Lenovo ThinkSystem, and Supermicro systems pre-validated for LRDIMM populations. Additionally, our UPS & Power Protection and Server Racks & Enclosures categories support the full infrastructure stack required for a production-grade data centre deployment.