Supermicro SuperServer SYS-F629P3-RC1B (Liquid-Cooled)

Supermicro SuperServer SYS-F629P3-RC1B (Liquid-Cooled)

Brand: Supermicro | Category: Servers

SKU: SUPE-SYSF629P3RC1B | Part #: SYS-F629P3-RC1B | MPN: SYS-F629P3-RC1B

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About the Supermicro SuperServer SYS-F629P3-RC1B (Liquid-Cooled)

The Supermicro SuperServer SYS-F629P3-RC1B is a 2U dual-socket rack server engineered around factory-integrated Direct Liquid Cooling (DLC) technology, purpose-built to support the next generation of high thermal design power processors and accelerators without relying on traditional air-cooling infrastructure alone. The DLC system routes temperature-controlled coolant directly to cold plates mounted on the CPUs, memory, and other high-heat components, dramatically reducing the thermal resistance between silicon and the cooling loop. This architecture allows the system to sustain full-performance workloads in facilities operating at elevated ambient temperatures or in dense rack deployments where air cooling headroom is limited.

Designed for the Intel Xeon Scalable processor family in a dual-socket configuration, the SYS-F629P3-RC1B delivers substantial compute density per rack unit, supporting up to 400W TDP per CPU socket when paired with the liquid cooling subsystem. The platform accommodates DDR4 registered ECC memory across up to 24 DIMM slots, providing ample bandwidth and capacity for memory-intensive analytics, virtualization, and AI inference workloads. Multiple PCIe expansion slots support high-bandwidth GPU accelerators, NVMe co-processors, or high-speed networking cards, making this chassis a flexible foundation across a wide range of HPC and enterprise acceleration scenarios.

What distinguishes the SYS-F629P3-RC1B within Supermicro's FatTwin and liquid-cooled portfolio is its datacenter operational efficiency profile. By transferring heat to a facility water loop rather than exhausting it as hot air into the datacenter aisle, the server enables organizations to reduce Power Usage Effectiveness (PUE) ratios, lower CRAC unit load, and qualify for higher-density rack configurations that would otherwise be thermally constrained. The platform ships with Supermicro's IPMI 2.0-compliant Baseboard Management Controller and is compatible with Supermicro's SuperDoctor 5 management software, providing granular monitoring of coolant flow, temperatures, and system health through standard out-of-band interfaces.

Ideal for

  • High-performance computing (HPC) clusters requiring sustained full-socket TDP operation across dense multi-rack deployments without proportional increases in CRAC cooling capacity
  • AI and machine learning training infrastructure where high-TDP GPUs are co-located with processor sockets and collective thermal output exceeds conventional air-cooling thresholds
  • Financial services risk analytics and real-time quantitative modeling demanding consistent clock frequency under continuous 100% CPU utilization across extended computational runs
  • Virtualization consolidation projects targeting aggressive VM-to-rack-unit ratios in datacenters with warm-aisle containment or limited raised-floor airflow availability
  • Scientific research and simulation environments such as computational fluid dynamics, molecular dynamics, or seismic processing that maintain near-peak CPU utilization for days or weeks continuously
  • Datacenter modernization initiatives converting legacy air-cooled rows to hybrid or fully liquid-cooled rows to achieve measurable PUE improvements and sustainability targets

Technical specifications

ManufacturerSupermicro
ModelSYS-F629P3-RC1B
Form Factor2U Rack Server
Cooling TechnologyFactory-Integrated Direct Liquid Cooling (DLC) with CPU and memory cold plates
Coolant InterfaceQuick-disconnect liquid manifold; compatible with facility chilled water or CDU loops (typically 18–45 °C inlet)
CPU Sockets2 × LGA 3647 (Socket P)
Supported ProcessorsIntel Xeon Scalable Processor Family (1st, 2nd, and 3rd Gen); up to 400W TDP per socket with DLC
Memory Slots24 × DDR4 DIMM slots (12 per CPU)
Maximum MemoryUp to 3 TB DDR4 ECC RDIMM/LRDIMM/3DS LRDIMM
Memory SpeedUp to 2933 MHz DDR4
PCIe ExpansionMultiple PCIe 3.0 slots; supports full-length, full-height GPU and accelerator cards
Storage BaysUp to 12 × 3.5-inch hot-swap SAS/SATA drive bays; optional NVMe support
Storage ControllersIntegrated Intel C621 chipset SATA; optional SAS HBA / RAID controllers
NetworkingDual 10GBase-T LAN ports (Intel X550) onboard; additional NIC slots available
ManagementIPMI 2.0 with dedicated management port; KVM over IP; Supermicro SuperDoctor 5 compatible
BMCASPEED AST2500 Baseboard Management Controller
Power SupplyRedundant 80 PLUS Platinum hot-swap power supplies (high-efficiency; wattage configurable per deployment)
Operating Temperature10 °C to 35 °C ambient (air); liquid cooling loop extends effective thermal envelope
Chassis Dimensions2U standard EIA-310 rack width; approximately 728 mm depth
OS SupportWindows Server 2019/2022, RHEL, CentOS, Ubuntu Server LTS, VMware ESXi, Proxmox VE
Regulatory ComplianceCE, FCC Class A, RoHS, REACH; datacenter-grade EMC and safety certifications
Launch2025 Q2

Available from Omnixon Global. Submit an RFQ and our team will confirm configuration and availability for your order.

Technical Specifications

BrandSupermicro
CategoryServers
SKUSUPE-SYSF629P3RC1B
Part NumberSYS-F629P3-RC1B
ConditionNew
ModelSYS-F629P3-RC1B
Form Factor2U Rack Server
Cooling TechnologyFactory-Integrated Direct Liquid Cooling (DLC) with CPU and memory cold plates
Coolant InterfaceQuick-disconnect liquid manifold; compatible with facility chilled water or CDU loops (typically 18–45 °C inlet)
CPU Sockets2 × LGA 3647 (Socket P)
Supported ProcessorsIntel Xeon Scalable Processor Family (1st, 2nd, and 3rd Gen); up to 400W TDP per socket with DLC
Memory Slots24 × DDR4 DIMM slots (12 per CPU)
Maximum MemoryUp to 3 TB DDR4 ECC RDIMM/LRDIMM/3DS LRDIMM
Memory SpeedUp to 2933 MHz DDR4
PCIe ExpansionMultiple PCIe 3.0 slots; supports full-length, full-height GPU and accelerator cards
Storage BaysUp to 12 × 3.5-inch hot-swap SAS/SATA drive bays; optional NVMe support
Storage ControllersIntegrated Intel C621 chipset SATA; optional SAS HBA / RAID controllers
NetworkingDual 10GBase-T LAN ports (Intel X550) onboard; additional NIC slots available
ManagementIPMI 2.0 with dedicated management port; KVM over IP; Supermicro SuperDoctor 5 compatible
BMCASPEED AST2500 Baseboard Management Controller
Power SupplyRedundant 80 PLUS Platinum hot-swap power supplies (high-efficiency; wattage configurable per deployment)
Operating Temperature10 °C to 35 °C ambient (air); liquid cooling loop extends effective thermal envelope
Chassis Dimensions2U standard EIA-310 rack width; approximately 728 mm depth
OS SupportWindows Server 2019/2022, RHEL, CentOS, Ubuntu Server LTS, VMware ESXi, Proxmox VE
Regulatory ComplianceCE, FCC Class A, RoHS, REACH; datacenter-grade EMC and safety certifications
Launch2025 Q2

Frequently Asked Questions about Supermicro SuperServer SYS-F629P3-RC1B (Liquid-Cooled)

What does the Supermicro SuperServer SYS-F629P3-RC1B (Liquid-Cooled) do?

The Supermicro SuperServer SYS-F629P3-RC1B (Liquid-Cooled) is built for enterprise data-center workloads — virtualization (VMware, Proxmox, Nutanix), private cloud, database hosting, and AI/ML training. It fits standard EIA-310 server racks and supports redundant PSUs and hot-swap drives common in production environments.

What are the headline specs of the Supermicro SuperServer SYS-F629P3-RC1B (Liquid-Cooled)?

Key specifications for the Supermicro SuperServer SYS-F629P3-RC1B (Liquid-Cooled): new condition; manufacturer Supermicro; model SYS-F629P3-RC1B; form factor 2U Rack Server; cooling technology Factory-Integrated Direct Liquid Cooling (DLC) with CPU and memory cold plates; coolant interface Quick-disconnect liquid manifold; compatible with facility chilled water or CDU loops (typically 18–45 °C inlet); cpu sockets 2 × LGA 3647 (Socket P). Manufacturer part number SYS-F629P3-RC1B. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.