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SK Hynix LPDDR5 H55G56COBM-S3C 12Gb Mobile DRAM IC

SK Hynix LPDDR5 H55G56COBM-S3C 12Gb Mobile DRAM IC

Brand: SK Hynix | Category: Accessories & Components

SKU: SKH-H55G56COBM-S3C | Part #: H55G56COBM-S3C | MPN: H55G56COBM-S3C

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About the SK Hynix LPDDR5 H55G56COBM-S3C 12Gb Mobile DRAM IC

The SK Hynix H55G56COBM-S3C is a 12Gb LPDDR5 memory IC engineered for power-constrained, high-throughput applications across edge computing, 5G infrastructure, and AI acceleration platforms. Operating at just 1.05V, this component delivers 6400 Mbps data rates while maintaining exceptional energy efficiency—critical for mobile and remote deployment scenarios where thermal and power budgets are tight.

Built on an advanced bank-group architecture with dedicated command/address bus topology, the H55G56COBM-S3C sustains substantially higher bandwidth per milliwatt compared to previous LPDDR4X generations. The BGA form factor and wide operating range (-40°C to +85°C) make it suitable for both consumer-grade edge devices and industrial-grade HPC node configurations in geographically distributed data centers.

Typical applications include:

  • Edge AI inference engines and on-device machine learning accelerators
  • 5G RAN and base station equipment requiring compact footprints
  • Distributed HPC nodes in thermal-constrained environments
  • Mobile workstations and ruggedized computing platforms

Omnixon Global stocks the H55G56COBM-S3C for immediate shipment across GCC, Asia, and European markets. Contact our team for bulk pricing, lead time confirmation, or custom logistics requirements.

Technical Specifications

BrandSK Hynix
CategoryAccessories & Components
SKUSKH-H55G56COBM-S3C
Part NumberH55G56COBM-S3C
ConditionNew
Manufacturer Part NumberH55G56COBM-S3C
Capacity12Gb
Memory TypeLPDDR5
Data Rate6400 Mbps
Bandwidth per MilliwattHigh Efficiency
Supply Voltage1.05V
ArchitectureBank-group with Command/Address Bus
Form FactorBGA
Operating Temperature-40°C to +85°C
ApplicationEdge AI, 5G Base Stations, HPC Nodes