Brand: SK Hynix | Category: Accessories & Components
SKU: SKH-H55G56COBM-S3C | Part #: H55G56COBM-S3C | MPN: H55G56COBM-S3C
Contact for Pricing — Request a Quote
The SK Hynix H55G56COBM-S3C is a 12Gb LPDDR5 memory IC engineered for power-constrained, high-throughput applications across edge computing, 5G infrastructure, and AI acceleration platforms. Operating at just 1.05V, this component delivers 6400 Mbps data rates while maintaining exceptional energy efficiency—critical for mobile and remote deployment scenarios where thermal and power budgets are tight.
Built on an advanced bank-group architecture with dedicated command/address bus topology, the H55G56COBM-S3C sustains substantially higher bandwidth per milliwatt compared to previous LPDDR4X generations. The BGA form factor and wide operating range (-40°C to +85°C) make it suitable for both consumer-grade edge devices and industrial-grade HPC node configurations in geographically distributed data centers.
Typical applications include:
Omnixon Global stocks the H55G56COBM-S3C for immediate shipment across GCC, Asia, and European markets. Contact our team for bulk pricing, lead time confirmation, or custom logistics requirements.
| Brand | SK Hynix |
| Category | Accessories & Components |
| SKU | SKH-H55G56COBM-S3C |
| Part Number | H55G56COBM-S3C |
| Condition | New |
| Manufacturer Part Number | H55G56COBM-S3C |
| Capacity | 12Gb |
| Memory Type | LPDDR5 |
| Data Rate | 6400 Mbps |
| Bandwidth per Milliwatt | High Efficiency |
| Supply Voltage | 1.05V |
| Architecture | Bank-group with Command/Address Bus |
| Form Factor | BGA |
| Operating Temperature | -40°C to +85°C |
| Application | Edge AI, 5G Base Stations, HPC Nodes |