SK Hynix LPDDR5 H55G56COBM-S3C 12Gb Mobile DRAM IC
Brand: SK Hynix | Category: Accessories & Components
SKU: SKH-H55G56COBM-S3C | Part #: H55G56COBM-S3C | MPN: H55G56COBM-S3C
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About the SK Hynix LPDDR5 H55G56COBM-S3C 12Gb Mobile DRAM IC
SK Hynix LPDDR5 H55G56COBM-S3C 12Gb Mobile DRAM
The H55G56COBM-S3C is a 12Gb LPDDR5 mobile DRAM chip offering up to 6400 Mbps data rate at 1.05V, delivering exceptional bandwidth-per-milliwatt for edge AI systems, 5G base station components, and compact HPC nodes. SK Hynix's LPDDR5 architecture introduces a new command/address bus structure and bank-group architecture enabling dramatically higher sustained bandwidth versus LPDDR4X.
Key Specifications
| Parameter | Value |
|---|---|
| Capacity | 12Gb (1.5GB) |
| Standard | LPDDR5 (JEDEC JESD209-5) |
| Data Rate | 6400 Mbps |
| Voltage | 1.05V |
| Package | FBGA (11.5×9mm) |
| Bank Groups | 8 (16 banks) |
Technical Specifications
| Brand | SK Hynix |
| Category | Accessories & Components |
| SKU | SKH-H55G56COBM-S3C |
| Part Number | H55G56COBM-S3C |
| Condition | New |
| Manufacturer Part Number | H55G56COBM-S3C |
| Capacity | 12Gb |
| Memory Type | LPDDR5 |
| Data Rate | 6400 Mbps |
| Bandwidth per Milliwatt | High Efficiency |
| Supply Voltage | 1.05V |
| Architecture | Bank-group with Command/Address Bus |
| Form Factor | BGA |
| Operating Temperature | -40°C to +85°C |
| Application | Edge AI, 5G Base Stations, HPC Nodes |