SK Hynix H25G9TCXXCX702A 512Gb NAND Flash
Brand: SK Hynix | Category: Accessories & Components
SKU: SKHYNIXH25G9TCXXCX702A512GBNANDFLAS | Part #: H25G9TCXXCX702A | MPN: H25G9TCXXCX702A
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About the SK Hynix H25G9TCXXCX702A 512Gb NAND Flash
Accessories in production require fast replacement paths—and the SK Hynix H25G9TCXXCX702A 512Gb NAND Flash die delivers the raw storage capacity needed for rapid SSD and embedded storage module assembly. This raw NAND Flash component is engineered for enterprise-grade applications where storage architects and OEM assembly teams need proven, high-density memory dies to build custom storage solutions. The SK Hynix H25G9TCXXCX702A features TLC (Triple-Level Cell) architecture with a 128-layer stacked 4D (Periphery Under Cell) design, delivering 512Gb capacity (64GB per die) in a form factor optimized for integration into larger storage subsystems.
The die operates across a commercial temperature range of 0°C to +70°C and communicates via the ONFI (Open NAND Flash Interface) standard with an 8-bit bus width. Power requirements are straightforward: 3.3 V for supply voltage (Vcc) and 1.8 V for I/O voltage (Vccq). Page size is specified at 16KB data plus spare area, with block size at 768KB data plus spare area. Available in both TSOP and KGD (Known Good Die) package configurations depending on assembly variant, this component integrates seamlessly into enterprise SSD controllers, embedded storage modules, and industrial storage applications where design flexibility and proven reliability matter.
Typical Enterprise Integration Scenarios
- Enterprise SSD firmware development and custom storage appliance design
- Embedded storage module assembly for mission-critical server and data center equipment
- Industrial storage solutions requiring validated TLC NAND architecture
- High-capacity module refresh and accelerated production builds using proven die inventory
- OEM storage subsystem integration where raw NAND die specification control is essential
For bulk availability, technical integration support, or RFQ on the SK Hynix part number H25G9TCXXCX702A, contact Omnixon Global's enterprise components team.
Technical Specifications
| Brand | SK Hynix |
| Category | Accessories & Components |
| SKU | SKHYNIXH25G9TCXXCX702A512GBNANDFLAS |
| Part Number | H25G9TCXXCX702A |
| Condition | New |
| Capacity | 512Gb |
| Form Factor | BGA (Ball Grid Array) |
| Interface | UFS 3.1 |
| Speed | up to 2100 MB/s |
| Manufacturer Part Number | H25G9TCXXCX702A |
| Product Type | Raw NAND Flash Die |
| NAND Cell Type | TLC (Triple-Level Cell) |
| NAND Architecture | 4D (Periphery Under Cell) 128-Layer Stacked NAND |
| Die Capacity | 512Gb (64GB per die) |
| Interface Standard | ONFI (Open NAND Flash Interface) |
| Bus Width | 8-bit (x8) |
| Package Type | TSOP / KGD (Known Good Die) — configuration per assembly variant |
| Supply Voltage (Vcc) | 3.3 V |
| I/O Voltage (Vccq) | 1.8 V |
| Page Size | 16KB (data) + spare area |
| Block Size | 768KB (data) + spare area (typical for 128L TLC generation) |
| Operating Temperature | 0°C to +70°C (commercial range) |
| Application | Enterprise SSD, Embedded Storage, Industrial Storage Module Integration |
Frequently Asked Questions about SK Hynix H25G9TCXXCX702A 512Gb NAND Flash
What does the SK Hynix H25G9TCXXCX702A 512Gb NAND Flash do?
The SK Hynix H25G9TCXXCX702A 512Gb NAND Flash is enterprise IT hardware deployed in production data centers, server rooms, and edge sites across the GCC and EMEA region.
What are the headline specs of the SK Hynix H25G9TCXXCX702A 512Gb NAND Flash?
Key specifications for the SK Hynix H25G9TCXXCX702A 512Gb NAND Flash: capacity 512Gb; new condition; product name SK Hynix H25G9TCXXCX702A 512Gb NAND Flash; brand SK Hynix; category Accessories & Components; capacity 512Gb; memory type 3D NAND Flash; form factor BGA (Ball Grid Array). Manufacturer part number H25G9TCXXCX702A. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.