Brand: HPE | Category: Servers
SKU: HPE-R8S86A | Part #: R8S86A | MPN: R8S86A
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The HPE Cray XD670 AI Server is a dense, high-performance computing platform engineered specifically for GPU-accelerated artificial intelligence applications. The system accommodates up to 8 NVIDIA H100 or H200 SXM GPUs in a single 4U form factor, connected via NVIDIA NVLink for ultra-low-latency inter-GPU communication essential for distributed training of large language models and foundation models. The server integrates direct liquid cooling for GPUs and CPU to manage thermal density while maintaining operational reliability at full compute utilization.
Architecturally, the XD670 combines dual-socket AMD EPYC processors with high-bandwidth PCIe 5.0 infrastructure, delivering the CPU-to-GPU and GPU-to-GPU bandwidth required for modern AI workflows. The system supports up to 2TB of DDR5 memory and multiple high-speed network options including InfiniBand and Ethernet, enabling seamless integration into HPC clusters and cloud data centers. Launched in Q3 2023, the XD670 addresses critical demand from cloud service providers, telecommunications companies, and research institutions developing and deploying next-generation large language models.
The XD670's compact, liquid-cooled design reduces data center footprint and power delivery requirements compared to air-cooled alternatives while supporting sustained peak GPU performance. Sophisticated power distribution, redundant cooling loops, and integrated systems management enable reliable operation in production AI training clusters where continuous uptime and thermal stability are paramount.
| Manufacturer | HPE |
| Product_Name | Cray XD670 AI Server |
| Form_Factor | 4U rack-mounted server |
| GPU_Configuration | 8x NVIDIA H100 or H200 SXM GPUs |
| GPU_Memory | 80GB HBM3 per H100; 141GB HBM3 per H200 |
| GPU_Interconnect | NVIDIA NVLink 5 (400GB/s GPU-to-GPU bandwidth) |
| CPU_Socket_Configuration | Dual-socket AMD EPYC (4th or 5th Generation) |
| CPU_Cores | Up to 192 cores (dual 96-core processors) |
| Memory_Capacity | Up to 2TB DDR5 memory |
| Memory_Type | DDR5-5600 with ECC protection |
| PCIe_Gen | PCIe 5.0 x16 per GPU |
| Cooling_Type | Direct liquid cooling for GPUs and CPU with redundant pump/loop configuration |
| Network_Options | Dual InfiniBand NDR (400Gbps) or Ethernet 400GbE connectivity |
| Storage_Bay_Configuration | Up to 8x 2.5-inch SSD bays for NVMe |
| Power_Supply | Redundant modular PSU (6400W+ total capacity) |
| Peak_Power_Consumption | 12,000W at full GPU utilization |
| Management_Interface | Integrated Lights-Out Management (iLOM) with remote console access |
| Launch_Date | Q3 2023 |
| Thermal_Design_Power_GPUs | 700W per H100; 900W per H200 |
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| Brand | HPE |
| Category | Servers |
| SKU | HPE-R8S86A |
| Part Number | R8S86A |
| Condition | New |
| Product_Name | Cray XD670 AI Server |
| Form_Factor | 4U rack-mounted server |
| GPU_Configuration | 8x NVIDIA H100 or H200 SXM GPUs |
| GPU_Memory | 80GB HBM3 per H100; 141GB HBM3 per H200 |
| GPU_Interconnect | NVIDIA NVLink 5 (400GB/s GPU-to-GPU bandwidth) |
| CPU_Socket_Configuration | Dual-socket AMD EPYC (4th or 5th Generation) |
| CPU_Cores | Up to 192 cores (dual 96-core processors) |
| Memory_Capacity | Up to 2TB DDR5 memory |
| Memory_Type | DDR5-5600 with ECC protection |
| PCIe_Gen | PCIe 5.0 x16 per GPU |
| Cooling_Type | Direct liquid cooling for GPUs and CPU with redundant pump/loop configuration |
| Network_Options | Dual InfiniBand NDR (400Gbps) or Ethernet 400GbE connectivity |
| Storage_Bay_Configuration | Up to 8x 2.5-inch SSD bays for NVMe |
| Power_Supply | Redundant modular PSU (6400W+ total capacity) |
| Peak_Power_Consumption | 12,000W at full GPU utilization |
| Management_Interface | Integrated Lights-Out Management (iLOM) with remote console access |
| Launch_Date | Q3 2023 |
| Thermal_Design_Power_GPUs | 700W per H100; 900W per H200 |
The HPE Cray XD670 AI Server (8x GPU) is built for enterprise data-center workloads — virtualization (VMware, Proxmox, Nutanix), private cloud, database hosting, and AI/ML training. It fits standard EIA-310 server racks and supports redundant PSUs and hot-swap drives common in production environments.
Key specifications for the HPE Cray XD670 AI Server (8x GPU): new condition; manufacturer HPE; product name Cray XD670 AI Server; form factor 4U rack-mounted server; gpu configuration 8x NVIDIA H100 or H200 SXM GPUs; gpu memory 80GB HBM3 per H100; 141GB HBM3 per H200; gpu interconnect NVIDIA NVLink 5 (400GB/s GPU-to-GPU bandwidth). Manufacturer part number R8S86A. For the full datasheet with electrical, environmental, and compliance details, contact our pre-sales engineering team.